Laser diode and semiconductor light-emitting device producing visible-wavelength radiation

ABSTRACT

A laser diode includes a substrate having a lattice constant of GaAs or between GaAs and GaP, a first cladding layer of AlGaInP formed on the substrate, an active layer of GaInAsP formed on the first cladding layer, an etching stopper layer of GaInP formed on the active layer, a pair of current-blocking regions of AlGaInP formed on the etching stopper layer so as to define a strip region therebetween, an optical waveguide layer of AlGaInP formed on the pair of current-blocking regions so as to cover the etching stopper layer in the stripe region, and a second cladding layer of AlGaInP formed on the optical waveguide layer, wherein the current-blocking regions having an Al content substantially identical with an Al content of the second cladding layer.

CROSS-REFERENCE TO RELATED APPLICATIONS

The present application is a divisional of U.S. application Ser. No.12/696,322, filed on Jan. 29, 2010, now U.S. Pat. No. 8,009,714 which isa divisional of U.S. application Ser. No. 11/580,918, filed on Oct. 16,2006 (now U.S. Pat. No. 7,684,456), which is a divisional of U.S. patentapplication Ser. No. 10/866,901, filed on Jun. 15, 2004 (now U.S. Pat.No. 7,139,297), which is a divisional of U.S. application Ser. No.10/427,909, filed on May 2, 2003 (now U.S. Pat. No. 6,983,004), which isa divisional of U.S. patent application Ser. No. 09/633,230, filed onAug. 4, 2000 (now U.S. Pat. No. 6,614,821) which is based on Japanesepriority applications No. 11-220649 filed on Aug. 4, 1999, No. 11-229794filed on Aug. 16, 1999, No. 11-243745 filed on Aug. 30, 1999, No.11-339267 filed on Nov. 30, 1999, No. 2000-057254 filed on Mar. 2, 2000and No. 2000-1440604 filed on May 12, 2000, the entire contents of whichare incorporated in their entirety by reference herein.

BACKGROUND OF THE INVENTION

The present invention generally relates to semiconductor devices andmore particularly to semiconductor light-emitting devices and laserdiodes.

Particularly, the present invention relates to a laser diode operable ina wavelength range of 360-680 nm. Further, the present invention relatesto a laser diode for use in optical recording and optical reading ofinformation or light-emitting display of information. Further, thepresent invention relates to a semiconductor light-emitting device basedon a III-V compound semiconductor material.

Further, the present invention relates to a vertical-cavity laser diodesuitable for an optical source of optical recording and reading ofinformation or light-emitting display of information. The presentinvention further relates to an optical information recording apparatussuch as a xerographic image recording system or an optical system andoptical telecommunication system including an optical interconnectiondevice that uses a vertical-cavity laser diode.

In these days, efforts are being made to develop a red-wavelength laserdiode operable in the wavelength range of 630-680 nm as an opticalsource of optical disk recording apparatuses. Such an optical diskrecording apparatus includes a DVD (Digital Video Disk or DigitalVersatile Disk) player. The laser diode is used in such disk recordingapparatuses as the optical source for reading and/or writing ofinformation.

In order to increase the writing speed of information into the opticaldisk in such optical disk devices, it is necessary to increase theoutput power of the laser diode used therein.

Hereinafter, a brief review will be made on conventional red-wavelengthlaser diodes.

FIG. 1 shows the cross-sectional diagram of a conventionalred-wavelength laser diode of an AlGaInP system disclosed in theJapanese Laid-Open Patent Publication 11-26880.

Referring to FIG. 1, a substrate 1 of n-type GaAs carries thereon abuffer layer 2 of n-type GaAs, a cladding layer 3 n-type AlGaInP, aquantum well active layer 4 including therein alternate and repetitivestacking of an AlGaInP layer and a GaInP layer, a cladding layer 5 ofAlGaInP of low carrier concentration (2−6×10¹⁷ cm⁻³), and an etchingstopper layer 6 of p-type GaInP.

Further, there is provided a ridge structure 10 on a part of the etchingstopper layer 6 wherein the ridge structure 10 includes acarrier-diffusion suppressing layer 7 of p-type AlGaInP, a claddinglayer 8 of p-type AlGaInP, and a band-discontinuity relaxation layer 9of p-type GaInP.

Further, there are formed a pair of electric current blocking regions 11of n-type GaAs on the surface part of the etching stopper layer 6 wherethe ridge structure 10 is not formed, and a contact layer 12 of p-typeGaAs is formed continuously on the current blocking regions 11 and theband-discontinuity relaxation layer 9 therebetween. The contact layer 12carries thereon a p-type electrode 13, and an n-type electrode 14 isformed on the bottom surface of the substrate 1.

In the laser diode of FIG. 1, there occurs a current confinement in theridge structure 10 wherein the ridge structure 10 provides a currentpath between the current-blocking regions 11, and the electric currentis confined into the ridge structure 10 thus formed of p-type GaAs.Further, it should be noted that the current-blocking regions 11 absorbthe optical radiation from the quantum well active layer 4 and there isinduced a refractive-index difference between the ridge structure 10 andthe region outside the ridge structure 10 as a result of such an opticalabsorption. Thereby, there occurs an optical confinement in the ridgestructure 10.

Such a ridge structure 10, while being able to form so-called opticalloss-guide structure in the laser diode, has a drawback in that itincreases the threshold current of laser oscillation due to the opticalabsorption caused by the current-blocking regions 10.

FIG. 2 shows the cross-sectional structure of a red-wavelength laserdiode disclosed in the Japanese Laid-Open Patent Publication 9-172222.

Referring to FIG. 2, the laser diode is constructed on a substrate 15 ofn-type GaAs and includes a buffer layer 16 of n-type GaAs, a claddinglayer 17 of n-type AlGaInP, an active layer 18 of GaInP, a claddinglayer 19 of p-type AlGaInP and an intermediate layer 20 of p-type GaInP,wherein the layers 16-20 are formed on the substrate 15 consecutively byan epitaxial process.

In the intermediate layer 20, there are formed a pair of stripe groovesreaching the p-type cladding layer 19, and the stripe grooves thusformed define a stripe ridge 21 therebetween. Further, current-blockingregions 22 are formed by filling the stripe grooves with a layer ofn-type AlGaAs, and the entire structure is covered by a cap layer 23 ofp-type GaAs formed by an epitaxial process.

In the case of the laser diode of FIG. 2, the current-blocking regions22 are formed of AlGaAs having a bandgap larger than a bandgap of theactive layer 18. For example, the current-blocking regions 22 are formedto contain Al with a concentration of 39% in terms of atomic percentwhen the laser diode is designed to operate at the wavelength of 650 nm.In the case the laser diode is to be operated at the wavelength of 630nm, the Al content in the current-blocking regions 22 should be 45% ormore in terms of atomic percent. In such a case, the current-blockingregions 22 are transparent to the laser beam and the loss at the opticalwaveguide is minimized.

FIG. 3 shows the cross-sectional diagram of a red-wavelength laser diodedisclosed in the Japanese Laid-Open Patent Publication 7-249838.

Referring to FIG. 3, the laser diode is constructed on a substrate 24 ofGaAs and includes, on the substrate 24, a cladding layer of n-typeAlGaInP having a composition (Al_(0.6)Ga_(0.4))_(0.5)In_(0.5)P, anactive layer 26 having a quantum well structure formed by an AlGaInPbarrier layer and a GaInP quantum well layer, an inner cladding layer 27of p-type AlGaInP having a composition of(Al_(0.6)Ga_(0.4))_(0.5)In_(0.5)P, an etching stopper layer 28 of p-typeGaInP having, a composition of Ga_(0.5)In_(0.5)P, an outer claddinglayer 29 of p type AlGaInP having a composition(Al_(0.6)Ga_(0.4))_(0.5)In_(0.5)P, a buffer layer 30 of p-type GaInPhaving a composition of Ga_(0.5)In_(0.5)P, and a cap layer 31 of p-typeGaAs.

The laser diode is formed with a mesa structure by a wet etchingprocess, wherein the wet etching process is conducted while using an SiNmask formed on the cap layer 31 with a width of 6 μm, until the etchingstopper layer 28 is exposed. After the mesa structure is thus formed, apair of current-blocking regions 32 of n-type AlInP and a pair of capregions 33 of n-type GaAs are formed on the mesa surface. Thereby, thecurrent-blocking regions 32 are grown so as to have a composition ofAl0.5 In0.5P on the part making contact with the mesa surface. Afterremoving the SiN mask, a contact layer 34 of p-type GaAs is formed so asto cover the cap regions 33, the current-blocking regions 32 and the caplayer 31 on the mesa structure.

In the laser diode of FIG. 3, too, the problem of waveguide loss isavoided due to the large bandgap energy of AlInP used for thecurrent-blocking regions 10. Further, the use of the AlInPcurrent-blocking regions 32 is advantageous in view of the fact thatAlInP has a smaller refractive-index as compared with the inner andouter cladding layers of p-type AlGaInP. Thereby, it should be notedthat there is formed a real refractive-index difference between theregion inside the ridge and the region outside the ridge, and a realrefractive-index waveguide is formed in the laser diode.

In the laser diode of FIGS. 2 and 3, it should be noted that thecurrent-blocking regions 22 or 32 contain an increased amount of Al forminimizing the optical absorption by the current-blocking regions. Asnoted already with reference to FIG. 2, the Al content in thecurrent-blocking region 22 of AlGaAs has to be set to 39% or more inatomic percent when the laser diode is to be operated at the wavelengthof 650 nm. In the case of the laser diode of FIG. 3, on the other hand,the current-blocking region 32 contains Al with an amount of 50% interms of, atomic percent in the vicinity of the mesa surface, while thisvalue of Al concentration is larger than the Al concentration (35% inatomic percent) of the AlGaInP cladding layer typically used in anAlGaInP laser diode. When the Al content in a semiconductor layer islarge as such, there tends to occur a problem of optical damaging at theedge surface of the laser optical cavity due to non-opticalrecombination of carriers. It should be noted that the increase of Alcontent tends to increase surface states, while the surface states tendto facilitate the non-optical recombination of carriers.

Thus it is an object of the present invention to provide ared-wavelength laser diode having a reduced optical waveguide loss andsimultaneously a reduced optical damage at the edge surface of theoptical cavity formed in the laser diode.

As noted already, the laser diode of the AlGaInP system is becoming animportant target of investigation in relation to application to laserbeam printers, optical disk drives and the like, due to the fact thatthe laser diode of this system can produce an optical beam with thewavelength range of about 600 μm.

In the application to the optical source of disk drives, it is requiredthat the fundamental mode of laser oscillation is a horizontal lateralmode of single peak. Further, it is required that astigmatism is small.

Such a single fundamental mode laser oscillation with reducedastigmatism is realized by using a real refractive-index waveguidestructure, and there is proposed a visible-wavelength laser diodestructure based on an AlGaInP system as represented in FIG. 4.

Referring to FIG. 4, the laser diode is constructed on a substrate 42 ofn-type GaAs and includes a cladding layer 43 of AlGaInP, an active layer44 of GaInP, and a cladding layer 45 of AlGaInP, formed consecutively onthe substrate 42.

After forming the cladding layer 45, a ridge stripe of an inverse-mesastructure is formed so as to extend axially, and high-resistance regions46 of AlInP are formed at both lateral sides of the stripe structure bycausing a selective growth process while using an SiO₂ mask on thestripe region. Further, a GaInP layer 48 and a p-type GaAs layer 49 aregrown selectively and consecutively on the AlGaInP layer forming thestripe region While using an SiO₂ mask formed on the high-resistanceregions 46. Further, n-type GaAs regions 47 are formed on thehigh-resistance regions 46 at both lateral sides of the central striperegion, and a p-type electrode of Cr/Au/Pt/Au structure is formed on thetop surface of the p-type GaAs layer 49. Further, an n-type electrode 41of AuGe/Ni is formed on the bottom surface of the substrate 42.

In such a structure, there is formed a real refractive-index waveguidestructure in correspondence to the central ridge stripe. Generally, sucha laser diode is fabricated such that the epitaxial layers constitutingthe laser structure achieves a lattice fitting with the GaAs substrate42.

On the other hand, the Japanese Laid-Open Patent Publication 5-41560describes a refractive-index waveguide laser diode that uses a doubleheterostructure of a mixed crystal of (AlGa)_(a)In_(1-a)P (0.51<a≦0.73)formed on a GaAs substrate, wherein the foregoing double heterostructureis formed with an intervening lattice misfit relaxation layer having acomposition represented as GaP_(x)As_(1-x).

FIG. 5 shows the relationship between the band edge energy and thelattice constant for various III-V crystals, wherein the continuouslines represent the band edge energy of the conduction band Ec and thevalence band Ev of a GaInP mixed crystal while the broken linesrepresent the conduction band energy and valence band energy of an AlInPmixed crystal.

Referring to FIG. 5, it can be seen that a mixed crystal of the AlGaInPsystem can be used for the cladding layer and the active layer as longas the AlGaInP mixed crystal has a composition in which the latticeconstant is smaller than that of GaAs. When the composition is chosen assuch, the bandgap energy increases and the laser oscillation wavelengthshifts in the shorter wavelength direction. Thus, the foregoing JapaneseLaid-Open Patent Publication 5-41560 proposes a laser diode that canoscillate at the wavelength shorter than 600 nm, by choosing thecomposition of the AlGaInP mixed crystal constituting the laser diode.

On the other hand, the relationship of FIG. 5 also indicates thepossibility of improvement of performance of the red-wavelength laserdiode oscillating in the wavelength range of 600-660 nm, by using amixed crystal of AlGaInP having a lattice constant between those of GaAsand GaP, for the cladding layer and the optical waveguide layer.

Further, laser diodes having a refractive index waveguide structure withcurrent-blocking regions of GaAs or AlInP are proposed. In such arefractive-index waveguide laser diode, it is also possible to use amixed crystal of AlGaInP for the current-blocking regions. However, theuse of a mixed crystal composition containing a large amount of Al suchas AlInP causes a problem to be described later.

In order to fabricate such a real refractive-index waveguide laserdiode, it is necessary to form a real refractive-index profile in atransverse direction of the active layer. Normally, this is achieved byforming a ridge-stripe structure or a groove-stripe during thefabrication process of the laser diode by an etching process and byforming a cladding layer or current-blocking regions of AlGaInP, and thelike, by a regrowth process.

In the case of forming a layer of AlGaInP on a substrate of GaP, GaAs orGaP_(0.4)As_(0.6) by an MOCVD process, there is a tendency of extensiveformation of hillock structure on the surface of the AlGaInP layer thusgrown when the AlGaInP layer is grown on the substrate having a (100)principal surface or when the offset angle of the substrate principalsurface from the (100) surface is small. This tendency of hillockformation is enhanced when the mixed crystal layer thus grown contains alarge amount of Al as in the case of an AlInP mixed crystal.

It is possible to suppress the hillock formation to some extent by usingan offset substrate and by increasing the offset angle of the substrate.However, such suppressing of hillock formation by way of using an offsetsubstrate tends to become difficult in the case of an AlGaInP mixedcrystal containing a large amount of Al and Ga and hence having alattice constant smaller than that of GaAs. Further, use of an offsetGaAsP substrate having a large offset angle poses a problem ofavailability as compared with the case of using a readily availableindustrial standard GaAs substrate.

When such hillock structure exists extensively in the semiconductorlayers constituting a laser diode or an LED, the device performance orthe yield of device production may be degraded seriously. This problemappears particularly serious in the case of regrowing a mixed crystalcontaining Al. In such a case, realization of a sufficient crystalquality is extremely difficult due to the surface oxidation of theunderlying layer.

In the case of the laser diode disclosed in the Japanese Laid-OpenPatent Publication 5-41560, op. cit., it is believed that fabrication ofa satisfactory laser diode device with high-quality crystal layers isdifficult.

Thus, it is an object of the present invention to provide a laser diodeoperable in the wavelength range of 600-660 nm wherein the device isperformance is improved by improving the quality of the crystalconstituting the current-blocking regions.

A material of the AlGaInP system is a direct-transition type III-Vmaterial having the largest bandgap energy except for a material of theAlGaInN system. The bandgap energy can reach as much as 2.3 eV (540 nmin bandgap wavelength).

Thus, efforts have been made with regard to optical semiconductordevices of the AlGaInN system to provide a high-luminosity, green to redoptical source for use in various color display devices or a laser diodefor use in laser printers, compact disk drives, DVDs for optical writingof information.

In the case of a laser diode, a material system achieving a latticematching with a GaAs substrate has conventionally been used. It shouldbe noted that a laser diode for high-density optical recording isrequired to produce a large optical output of short-wavelength in a hightemperature environment.

In order to construct a laser diode, it is necessary to provide astructure for confining both carriers and optical radiation in an activelayer or light-emitting layer by using a cladding layer. Thus, acladding layer is required to have a bandgap larger than a bandgap ofthe active layer.

In this regard, the material in the system of AlGaInP has a drawback inthat the band discontinuity ΔEc on the conduction band tends to becomesmaller. In such a case, the injected carriers easily escape from theactive layer into the cladding layer by causing an overflow. When suchan overflow of carriers takes place, the threshold current of laseroscillation becomes sensitive with the operational temperature of thelaser diode and the temperature characteristic of the laser diode isdeteriorated.

In order to overcome the problem, the Japanese Laid-Open PatentPublication 4-114486 proposes a structure that uses an MQB (multiplequantum barrier) structure, in which a large number of extremely thinlayers are stacked between the active layer and the cladding layer forcarrier confinement. This structure, however, is complex, and it hasbeen difficult to achieve the desired effect in view of the necessity ofprecision control of thickness of the layers to the degree of atomiclayer level.

In an ordinary edge-emission type red-wavelength laser diode that uses astructure in which the active layer is sandwiched by a pair of opticalguide layers having a composition represented as(Al_(x)Ga_(1-x))_(0.5)In_(0.5)P, the desired optical confinement isrealized in the optical guide layers of the composition(Al_(x)Ga_(1-x))_(0.5)In_(0.5)P. On the other hand, the optical guidelayers generally contain Al with a composition x of 0.5 or more, whilesuch a high concentration of Al in the optical waveguide layer causesthe problem of optical damaging at the optical cavity edge surface ofthe laser diode due to the recombination of carriers facilitated by Al.Thus, there has been a difficulty in obtaining a high optical outputpower or realizing a stable operation of the laser diode over a longperiod of time.

Summarizing above, conventional laser diodes constructed on a GaAssubstrate with lattice matching therewith have a problem in operationunder high temperature environment, or high-output operation, oroperation over a long period of time. For example, it has been difficultto realize a red-wavelength laser diode operable under a hightemperature environment such as 80° C. with high output power such as 70mW or more, over a long period of time such as ten thousand hours. Thedifficulty increases with decreasing output wavelength of the laserdiode.

The material of the system of AlGaInP having a lattice constant smallerthan the lattice constant of GaAs is characterized by a wide bandgap andis suitable for decreasing the output wavelength of the laser diode orlight-emitting diode. Thus, there is a proposal in the JapaneseLaid-Open Patent Publication 8-18101 with regard to a light-emittingdiode (LED) using the foregoing material system as well as othermaterial systems. Further, there are proposals of a short wavelengthlaser diode oscillating at a wavelength of 600 nm or less. For example,the Japanese Laid-Open Patent Publication 5-41560 proposes a laser diodein which a double heterostructure having a composition of(AlGa)_(a)In_(1-a)P (0.51<a≦0.73) and a lattice constant intermediatebetween GaAs and GaP is provided on a GaAs substrate with an interveningbuffer layer of GaP_(x)As_(1-x) having a composition adjusted so as toachieve a lattice matching with the foregoing double heterostructure. Inthe foregoing proposal, the problem of lattice misfit is resolved byinterposing the buffer layer between the substrate and the doubleheterostructure.

FIG. 6 shows the relationship between the bandgap energy and the latticeconstant for various III-V materials.

Referring to FIG. 6, the continuous lines represent the compositioncausing a direct-transition, while the broken lines represent thecomposition causing an indirect-transition. It should be noted that thematerial of the foregoing composition (AlGa)_(a)In_(1-a)P (0.51<a≦0.73)having the lattice constant between GaAs and GaP falls in the regiondefined by the composition of AlInP and the composition of GaInP. Byusing the material system of AlGaInP having a bandgap larger than thebandgap of the material achieving a lattice matching with a GaAssubstrate for the active layer and the cladding layers, it is possibleto reduce the oscillation wavelength of the laser diode to be smallerthan 600 nm.

FIG. 7 shows the construction of a laser diode having a refractive-indexwaveguide disclosed in the Japanese Laid-Open Patent Publication5-41560, wherein the laser diode has a lattice constant between GaAs andGaP.

Referring to FIG. 7, the laser diode is constructed on a substrate 51 ofn-type GaAs and includes a graded layer 52 of n-type GaPAs formed on thesubstrate 51, and a superlattice layer 53 of n-typeGa_(0.7)In_(0.3)P/(Al_(0.7)Ga_(0.3))_(0.7)In_(0.3)P formed on the gradedlayer 52, wherein the substrate 51, the graded layer 52 and thesuperlattice layer 53 form together a GaPAs semiconductor substrate 54.The GaPAs semiconductor substrate 54 thus formed carries thereonconsecutively an optical waveguide layer 55 of n-type AlGaInP having acomposition of (Al_(0.7)Ga_(0.3))_(0.7)In_(0.3)P, an active layer 56 ofundoped GaInP having a composition of Ga_(0.7)In_(0.3)P, and an opticalwaveguide layer 57 of p-type AlGaInP having a composition of(Al_(0.7)Ga_(0.3))_(0.7)In_(0.3)P, and a first buffer layer 58 of p-typeGaInP, having a composition of Ga_(0.7)In_(0.3)P is provided further onthe optical waveguide layer 57.

The first buffer layer 58 and the underlying optical waveguide layer 57are then subjected to a mesa etching process to form a ridge stripestructure, wherein the mesa etching process is conducted such that theoptical waveguide layer 57 is left with a thickness of 0.2-0.4 μmoutside the ridge stripe structure.

At both lateral sides of the ridge stripe structure, a pair ofcurrent-blocking regions 59 of n-type GaInP having a composition ofGa_(0.7)In_(0.3)P are formed by a regrowth process, wherein thecurrent-blocking regions 59 function also as an optical absorptionregion. Further, a contact layer 60 of p-type GaInP having a compositionof Ga_(0.7)In_(0.3)P is formed on the current-blocking regions 59including the ridge stripe region formed therebetween, by a regrowthprocess. Further, p-type electrode 62 and an n-type electrode 61 areformed respectively on the top surface of the contact layer 60 and onthe bottom surface of the GaAs substrate 51.

In the foregoing laser diode that uses a material system having alattice constant between GaP and GaAs, it is necessary to carry outthree regrowth process steps, one for growing the GaInP buffer layer 58,one for growing the current-blocking regions 59, and one for growing thecontact layer 60. Thereby, the fabrication process of the laser diode iscomplex and the yield of production tends to be reduced.

In order to facilitate the fabrication of a ridge-waveguide laser diode,there is also a proposal in the Japanese Laid-Open Patent Publication10-4239, to form the current-blocking regions by way of oxidation of anAlGaAs mixed crystal having a composition represented asAl_(x)Ga_(1-x)As (0.8<x≦1). According to the foregoing proposal, theridge structure is formed to have a width of 4 μm at the bottom partthereof, and there is provided a current path region as a non-oxidizedpart of the AlGaAs region of the foregoing composition ofAl_(x)Ga_(1-x)As (0.8<x≦1), with a width of 3 μm.

According to the foregoing proposal, it is possible to form a laserdiode having the current-blocking structure in a single crystal growthprocess.

On the other hand, the laser diode of the foregoing prior art has adrawback, in view of the difference in the lattice constant between thematerial system having a lattice constant between GaAs and GaP and theforegoing AlGaAs mixed crystal of the composition Al_(x)Ga_(1-x)As(0.8<x≦1), which achieves a lattice matching with the GaAs substrate, inthat the thickness of the AlGaAs mixed crystal layer of the compositionAl_(x)Ga_(1-x)As (0.8<x≦1) is inevitably limited when the AlGaAs mixedcrystal layer is to be provided in the material system having a latticeconstant between GaAs and GaP. Further, in view of the fact that thecurrent path region of the not-oxidized Al_(x)Ga_(1-x)As (0.8<x≦1) mixedcrystal layer extends such that the edge of the current path region islocated near the edge of the ridge structure, there appears asubstantial optical waveguide loss and increase of optical output poweris difficult.

Thus, the present invention has an object to provide a semiconductorlight-emitting device formed of a semiconductor material having alattice constant between GaP and GaAs wherein the fabrication process issimplified. Further, the present invention has an object to provide asemiconductor light-emitting device formed of a semiconductor materialhaving a lattice constant between GaP and GaAs wherein the opticalwaveguide loss is minimized and suitable for increasing output opticalpower.

Meanwhile, vertical-cavity laser diodes, which emit optical beam in adirection perpendicular to a substrate surface, draw attention inrelation to application of red-wavelength optical source in thewavelength range of 630-650 nm for use in high-density optical diskdrives and laser printers, in view of the fact that a vertical-cavitylaser diode provides various advantageous features such ashigh-efficiency of laser oscillation, excellent beam property, excellentvertical mode property, and the like. Further, the vertical-cavity laserdiodes are suitable for constructing a two dimensional array, and thus,there are possibility of application to the art of opticalinterconnection or optical array for laser beam printers.

In view of the limited length of optical cavity, a vertical-cavity laserdiode requires to provide a large reflectance. Because of this reason, adistributed Bragg reflector (DBR) is generally used as the mirror of thevertical optical cavity. By using a DBR, it is possible to achieve anear 100% reflectance. A DBR is formed by stacking two semiconductorlayers or dielectric layers having mutually different refractive indexalternately and repeatedly with an optical distance corresponding to aquarter of the oscillation wavelength.

When the difference of refractive index between the two semiconductorlayers constituting a DBR is large, a high reflectance is achieved witha reduced number of repetition. In order to avoid optical absorption andto increase the efficiency of laser oscillation, the semiconductorlayers constituting the DBR are required to be transparent to the laseroscillation wavelength.

In the case of a vertical-cavity laser diode using the material of anAlGaInP system and oscillating at the wavelength of 630-650 nm, anactive layer of GaInP is formed on a GaAs substrate, and a DBR is formedof high refractive layers of AlGaInP and low refractive layers of AlInP.

In view of the tendency of increase of bandgap and decrease ofrefractive index with increasing Al content in a semiconductor layercontaining Al, it is desirable to construct a DBR by stacking AlInPlayers and GaInP layers. Unfortunately, a GaInP layer is not transparentto the optical radiation in the wavelength range of 630-650 nm. Thus,there occurs a problem of optical absorption and degradation of opticalcavity efficiency.

FIG. 8 shows the relationship between the lattice constant and bandgapfor the GaInP and AlInP mixed crystals, wherein FIG. 8 shows the rvalley energy and the X valley energy of the conduction band and furtherthe band edge energy of the valence band. As can be seen from FIG. 8,the bandgap energy increases with decreasing lattice constant in theforegoing material system.

In the invention disclosed in the Japanese Laid-Open Patent Publication9-199793, a DBR is constructed by combining an AlInP/GaInP layeredstructure formed on a GaAs substrate with a lattice constant smallerthan the lattice constant of the substrate and an AlGaAs/GaAs layeredstructure, for reducing the optical loss caused by the DBR. According tothe foregoing prior art, a first DBR structure of the AlGaAs/GaAslayered structure is formed on the GaAs semiconductor substrate and asecond DBR structure of the GaInP/AlInP is formed thereon, with a gradedlayer interposed between the first and second DBR structures forrelaxing the lattice misfit. On the DBR thus formed, a first gradedcladding layer, a GaInP active layer and a second graded cladding layerare formed such that the composition grading is symmetric between thefirst and second graded cladding layers. Further, a further DBRstructure is formed on the second cladding layer.

The invention disclosed in the foregoing Japanese Laid-Open PatentPublication 9-199793 is designed so as to minimize the opticalabsorption in the visible wavelength region and to improve the opticalcavity efficiency. The two different material systems are used forconstructing a DBR to eliminate the problem of lattice misfit of theAlGaInP mixed crystal and for avoiding the difficulty of growing a highquality AlGaInP mixed crystal layer. The difficulty of growing anAlGaInP layer will be explained later. Thus, the foregoing prior artuses the material system of AlGaInP for the DBR structure in thevicinity of the active layer where the intensity of optical radiation islarge and uses the material system of AlGaAs for the DBR structure inthe part away from the active layer in order to avoid the problem ofdegradation of the crystal quality associated with the increase of thenumber of stacks.

Further, there is another prior art vertical-cavity laser diodedisclosed in the Japanese Laid-Open Patent Publication 10-200202 whereinthe vertical-cavity laser diode of this prior art is constructed on aGaInP substrate.

According to this prior art, a substrate of GaInP having a compositionof Ga_(0.75)In_(0.25)P is used and a DBR of the AlInP/GaInP is formedthereon with lattice matching. On the DBR thus formed, an active layerof GaInP is formed. According to this prior art, the problem ofdegradation of the crystal quality associated with lattice misfit isimproved.

In the case of the forgoing prior art device of the Japanese Laid-OpenPatent Publication 9-199793, it should be noted a plurality of DBRstructures having different lattice constants are provided in a singlelaser diode device for changing the lattice constant. Further, in viewof the fact that the DBR structure that causes a lattice misfit with thesubstrate has a large thickness, the use of the lattice misfitrelaxation layer is not effective for improving the crystal quality. Itshould be noted that the DBR structure that causes a lattice misfit withthe substrate contains at least 20 pairs of layers (40 layers or more)therein.

In the case of the laser diode disclosed in the Japanese Laid-OpenPatent Publication 200202, lattice matching is successfully achievedwith respect to the GaInP layer transparent to the optical radiation inthe wavelength range of 635-650 nm by choosing the lattice constant ofthe substrate to be smaller than the lattice constant of GaAs. On theother hand, the laser diode of the foregoing prior art has a drawback inthat increase of Al or Ga content in the AlInP or GaInP material systemfacilitates hillock formation. Particularly, increase of Al contentcauses an extensive hillock formation and causes a serious problem inthe AlInP material. There is no fundamental solution to this problem ofhillock formation. When such defects are formed, the homogeneity of theheteroepitaxial interface is degraded substantially, and the opticalscattering associated with such a poor quality interface increases theoptical loss. Thereby, the optical cavity efficiency is deteriorated.

Further, the invention disclosed in the foregoing Japanese Laid-OpenPatent Publication 10-200202 has a drawback, associated with the use ofthe GaInP active layer, in that there is a limitation imposed over thelattice constant when the laser diode is to be operated in thewavelength range of 630-650 nm.

More specifically, the wavelength of the GaInP mixed crystal thatachieves lattice matching with GaAs is about 650 nm, and the wavelengthbecomes shorter when a GaInP mixed crystal having a lattice constantsmaller than that of GaAs is used for the active layer. In order toachieve the foregoing desired wavelength range, it is thereforenecessary to reduce the Ga content so as to increase the oscillationwavelength of the laser diode. However, such a decrease of the Gacontent causes a compressive strain in the active layer and the qualityof the crystal of the active layer is deteriorated. Thus, the latticeconstant of the active layer is practically limited to the range closeto the lattice constant of GaAs and the degree of freedom in designingthe laser oscillation wavelength is limited.

On the other hand, the foregoing construction of the Japanese Laid-OpenPatent Publication provides a possibility of increasing the degree offreedom in the laser diode design associated with the deviation oflattice constant from the lattice constant of GaAs, such as increaseddegree of freedom in selecting the material for various parts of thelaser diode. It should be noted that the laser diode of the foregoingJapanese Laid-Open Patent Publication 10-200202 merely focuses on theproblem of the optical absorption of the DBR, and no further proposalsare made with regard to the improvement of other aspects of the laserdiode.

There are further rooms for improvement in the vertical-cavity laserdiode having a lattice constant between GaAs and GaP.

Thus, the present invention provides a vertical-cavity laser diodeoperable in the wavelength range of 630-660 nm and various opticalsystems using such a vertical-cavity laser diode.

SUMMARY OF THE INVENTION

Accordingly, it is a general object of the present invention to providea novel and useful laser diode, a vertical-cavity laser diode and anoptical semiconductor device wherein the foregoing problems areeliminated.

Another and more specific object of the present invention is to providea red-wavelength laser diode having a reduced optical waveguide loss andsimultaneously a reduced optical damage at an edge surface of an opticalcavity formed in the laser diode.

Another object of the present invention is to provide a laser diode,comprising:

a substrate of a first conductivity type, said substrate having alattice constant of GaAs or a lattice constant between GaAs and GaP;

a first cladding layer of AlGaInP having said first conductivity typeformed over said substrate;

an active layer of GaInAsP formed over said first cladding layer;

an etching stopper layer of GaInP formed over said active layer;

a pair of current-blocking regions of AlGaInP formed over said etchingstopper layer, said pair of current-blocking regions definingtherebetween a strip region;

an optical waveguide layer of AlGaInP formed over said pair ofcurrent-blocking regions so as to include said stripe regions, saidoptical waveguide layer covering said etching stopper layer in saidstripe region; and

a second cladding layer of AlGaInP of a second conductivity type formedover said optical waveguide layer;

said current-blocking regions having an Al content substantiallyidentical with an Al content of said second cladding layer.

According to the present invention, the real refractive-index increasesin correspondence to the strip region where the optical waveguide layerof AlGaInP is formed, and the laser diode has a real refractive-indexwaveguide structure characterized by a low optical loss. Due to the factthat the current-blocking regions outside the stripe region are formedof AlGaInP characterized by a large bandgap, the optical loss caused bysuch current-blocking regions is successfully minimized. In view of thefact that the AlGaInP current-blocking regions contain Al with aconcentration substantially identical with the second cladding layer,which is also formed of AlGaInP, there is no increase of Al content inthese parts of the laser diode. Thereby, the problem of damaging at theedge surface of the laser optical cavity caused by non-opticalrecombination of carriers, is successfully minimized.

Another object of the present invention is to provide a laser diode,comprising:

a substrate having a lattice constant between GaAs and GaP, saidsubstrate having a first conductivity type;

a first cladding layer of AlGaInP having said first conductivity typeformed over said substrate;

a lower optical waveguide layer of GaInP formed over said first claddinglayer;

an active layer of GaInAsP formed over said lower optical waveguidelayer;

a first upper optical waveguide layer of GaInP formed over said activelayer;

a pair of current-blocking regions of AlGaInP formed over said firstupper optical waveguide layer, said pair of current-blocking regionsdefining therebetween a stripe region;

a second upper optical waveguide layer of GaInP formed over said pair ofcurrent-blocking regions so as to include said stripe regions, saidsecond upper optical waveguide layer covering said first upper opticalwaveguide layer in said stripe region; and

a second cladding layer of AlGaInP having a second conductivity typeformed over said second upper optical waveguide layer;

said current-blocking regions having an Al content generally identicalwith an Al content of said second cladding layer.

According to the present invention, the laser diode has an SCH structurein which the active layer is sandwiched vertically by the lower opticalwaveguide layer and the first upper optical waveguide layer both freefrom Al. Thereby, the problem of optical damaging at the edge surface ofthe laser optical cavity is successfully avoided.

Another object of the present invention is to provide a laser diode,comprising:

a substrate having a lattice constant between GaAs and Gap, saidsubstrate having a first conductivity type;

a first cladding layer of AlGaInP having said first conductivity typeformed over said substrate;

a lower optical waveguide layer of GaInP formed over said first claddinglayer;

an active layer of GaInAsP formed over said lower optical waveguidelayer;

a first upper optical waveguide layer formed over said active layer;

a pair of current-blocking regions of AlGaInP formed over said firstupper optical waveguide layer, said pair of current-blocking regionsdefining therebetween a stripe region;

a second upper optical waveguide layer of GaInP formed over said pair ofcurrent-blocking regions so as to include said stripe regions, saidsecond upper optical waveguide layer covering said first upper opticalwaveguide layer in said stripe region; and

a second cladding layer of AlGaInP having a second conductivity typeformed over said second upper optical waveguide layer;

said current-blocking regions having an Al content generally identicalwith an Al content of said second cladding layer,

said first upper optical waveguide layer of GaInP and said second upperoptical waveguide layer of GaInP having respective thicknesses such thata sum of said thickness of said first upper optical waveguide layer andsaid thickness of said second upper optical waveguide layer is equal toa thickness of said lower optical waveguide layer of GaInP.

According to the present invention, the vertical distribution profile ofrefractive-index becomes substantially symmetric about the active layerdue the fact that the first and second upper optical waveguide layers ofGaInP have the total thickness generally identical with the thickness ofthe lower optical waveguide layer of GaInP. Thereby, the opticalradiation produced by the laser diode is effectively confined at thecentral part of the laser structure and the threshold of laseroscillation can be reduced.

Another object of the present invention is to provide a laser diodeoperable in the wavelength range of 600-660 nm wherein the deviceperformance is improved by improving the quality of the crystalconstituting the current-blocking regions.

Another object of the present invention is to provide a laser diode,comprising:

a substrate having a first conductivity type;

a first cladding layer of said first conductivity type provided oversaid substrate, said first cladding layer having a lattice constantbetween GaAs and GaP;

an active layer formed over said first cladding layer;

a second cladding layer of a second conductivity type provided over saidactive layer, said second cladding layer having said lattice constant;

a ridge-stripe region formed in said second cladding layer; and

a pair of current-blocking regions of said first conductivity typerespectively provided over said second cladding layer at both lateralsides of said ridge-stripe region;

each of said current-blocking regions having a composition representedas (Al_(x1)Ga_(1-x1))_(y1)In_(1-y1)As_(z1)P_(1-z1) (0≦x₁≦1, 0≦y₁≦1,0.01≦z₁≦1).

Another object of the present invention is to provide a laser diode,comprising:

a substrate having a first conductivity type;

a first cladding layer of said first conductivity type provided oversaid substrate, said first cladding layer having a lattice constantbetween GaAs and GaP;

an active layer formed over said first cladding layer;

a second cladding layer of a second conductivity type provided over saidactive layer, said second cladding layer having said lattice constant;

a current-blocking layer of said first conductivity type respectivelyprovided over said second cladding layer;

a stripe depression formed in said current-blocking layer; and

a third cladding layer of said second conductivity type formed over saidcurrent-blocking layer so as to include said stripe depression,

said current-blocking layer having a composition represented as(Al_(x2)Ga_(1-x2))_(y2)In_(1-y2)As_(z2)P_(1-z2) (0≦x₂≦1, 0≦y₂≦1,0.01≦z₂≦1).

According to the present invention, the hillock formation issuccessfully suppressed by incorporating As into said current-blockingregions or current-blocking layer.

It should be noted that the inventor of the present invention hasdiscovered that the hillock formation is successfully suppressed byincorporating As when growing an AlGaInP mixed crystal layer. It is alsodiscovered that the hillock formation can be reduced by suitablychoosing the condition of growth of the AlGaInP mixed crystal layer suchas increasing growth temperature from 700° C. to 750° C. However, theoptimization of the growth condition was not sufficient for decreasingthe hillock formation to the desired level of hillock density. By addingAs, on the other hand, a remarkable decrease was observed for thehillock density, even in such a case the growth is conducted at thetemperature of 700° C. It is believed that As atoms thus incorporatedsuccessfully suppressed the droplet formation of Al or Ga during theprocess of growing the AlGaInP layer.

It was further observed that the suppression of hillock formation by Asis effective even in such a case in which the amount of the As atomsincorporated is very small. Naturally, the effect of suppressing hillockformation increases with increasing amount of As in the AlGaInP layer.

It should be noted that the foregoing suppression of hillock formationduring the growth process of an AlGaInP mixed crystal layer by way ofincorporating As is particularly effective when a substrate having asmall offset angle, such as a commercially available GaAsP substrate, isused.

Thus, the laser diode of the present invention has an improvedreliability and lifetime as a result of use of an AlGaInAsP mixedcrystal containing As for the current-blocking regions or for thecurrent-blocking layer. By using the AlGaInAsP mixed crystal for thecurrent-blocking regions or the current-blocking layer, the flatness andcrystal quality of the device surface are improved. Further, the use ofthe AlGaInAsP mixed crystal is effective for reducing the leakagecurrent path which is formed inside the laser diode as a result of thehillock formation. Further, the decrease of the hillock density reducesthe optical scattering in the current-blocking regions and the waveguideloss of the laser diode is reduced accordingly. Thereby, the thresholdcurrent of laser oscillation is reduced.

By using a material transparent to the laser beam produced by the laserdiode, in other words by using a material having a bandgap larger than abandgap of the active layer, for the current-blocking regions or layer,the optical absorption outside the current path region of the laserdiode is reduced. Thereby, the threshold current of laser oscillation isreduced and the efficiency of laser oscillation is improved. Further, inview of the fact that the AlGaInAsP current-blocking regions or layer,containing a large amount of Al, forms a real refractive-index waveguidestructure with the second cladding layer. It should be noted that thecurrent-blocking regions have a smaller refractive-index as comparedwith the second cladding layer. Thereby, the optical radiation iseffectively confined in the stripe region of the laser diode, and thelateral mode of laser oscillation is stabilized. Associated with this,the astigmatism of the laser diode is reduced.

Further, by providing a GaInAsP layer in the second cladding layer or onthe current-blocking layer of AlGaInAsP, the GaInAsP layer functions asan etching stopper layer with respect to the etching process applied tothe second cladding layer or the current-blocking layer, and the processof forming the stripe ridge structure in the second cladding layer orthe process of forming the stripe groove structure in thecurrent-blocking layer as a result of a wet etching process, isfacilitated substantially. As a result of use of the GaInAsP etchingstopper layer, the height of the stripe ridge structure or the depth ofthe stripe groove structure is controlled exactly. Further, the use ofthe GaInAsP etching stopper layer protects the surface of the secondcladding layer or the current-blocking layer from being exposed to theair after the etching process, and the problem of surface oxidation ofAl in the second cladding layer or in the current-blocking layer issuccessfully avoided. It should be noted that a GaAsP composition actsas an effective etching stopper against an etching process applied to anAlGaInAsP layer by a hydrochloric acid etchant, while a GaInPcomposition acts as an effective etching stopper against an etchingprocess applied to an AlGaInAsP layer by a phosphoric or sulfuric acidetchant.

Further, the use of the optical waveguide layer of GaInP adjacent to theactive layer eliminates the direct contact of the active layer and thecladding layer that contains Al, and the problem of damaging of thelaser cavity edge surface caused by Al is effectively eliminated.Thereby, it becomes possible to operate the laser diode with a highoutput power.

Another object of the present invention is to provide a semiconductorlight-emitting device formed of a semiconductor material having alattice constant between GaP and GaAs wherein the fabrication process issimplified.

Another object of the present invention is to provide a semiconductorlight-emitting device formed of a semiconductor material having alattice constant between GaP and GaAs wherein the optical waveguideloss, is minimized and suitable for increasing output optical power.

Another object of the present invention is to provide a semiconductorlight-emitting device, comprising:

a semiconductor substrate;

an active layer provided over said semiconductor substrate, said activelayer emitting optical radiation;

a semiconductor layer vertically sandwiching said active layer withanother semiconductor layer, said semiconductor layer having a bandgaplarger than a bandgap of said active layer and a lattice constantbetween GaP and GaAs,

said semiconductor layer containing a to-be-oxidized layer in a partthereof with a composition represented asAl_(x)Ga_(y)In_(1-x-y)P_(t)As_(1-t) (0.8≦x≦1, 0≦y≦0.2, 0≦t≦1),

a part of said to be-oxidized layer being oxidized to form a selectiveoxidation region.

According to the present invention, the selective oxidation region formsa current-blocking structure for confining an injected electric current.In view of the fact that the selective oxidation region thus formed hasa reduced refractive index, there appears a difference in the realrefractive index between the part of the AlGaInPAs to-be-oxidized layerwhere the oxidized region is formed and the current path region where nosuch oxidized region is formed. In other words, the current-blockingstructure thus formed by the selective oxidation of the AlGaInPAs layerfunctions also as the real refractive index waveguide structureeffective for lateral mode control. As the real refractive indexwaveguide structure thus formed contains, in the vicinity of the activelayer, only the material which is free from waveguide less for all thewavelengths, the laser diode is easily operated to produce a largeoutput optical power.

It should be noted that the foregoing advantageous structure can beformed by a single crystal growth process. Thereby, the semiconductorlight-emitting device of the present invention can be fabricated easilywith high yield.

Another object of the present invention is to provide a semiconductorlight-emitting device, comprising:

a semiconductor substrate;

an active layer provided over said semiconductor substrate, said activelayer producing optical radiation; and

a pair of cladding layers sandwiching said active layer vertically,

said active layer being one of a single quantum well structurecontaining therein a quantum well layer and a multiple quantum wellstructure containing therein a quantum well layer and a barrier layer,

said quantum well layer comprising a mixed crystal of AlGaInPAs having acomposition represented as(Al_(x1)Ga_(1-x1))_(α1)In_(1-α1)P_(t1)As_(1-t1) (0≦x₁<1, 0<α₁≦1,0≦t₁≦1),

said barrier layer comprising a mixed crystal of AlGaInPAs having acomposition represented as(Al_(x2)Ga_(1-x2))_(α2)In_(1-α2)P_(t2)As_(1-t2) (0≦x₂<1, 0.5<α₂<1,0≦t₂≦1),

each of said cladding layers comprising a mixed crystal of AlGaInPAscontaining Al and having a composition represented as(Al_(y)Ga_(1-y))_(β)In_(1-β)P_(v)As_(1-v) (0<y≦1, 0.5<β<1, 0<v≦1), eachof said cladding layers having a lattice constant between GaP and GaAsand a bandgap larger than a bandgap of said active layer,

an optical waveguide layer of AlGaInPAs interposed between said activelayer and each of said cladding layers, said optical waveguide layerhaving a bandgap larger than the bandgap of said active layer butsmaller than the bandgap of said cladding layer, said optical waveguidelayer having a composition represented as(Al_(z)Ga_(1-z))_(γ)In_(1-γ)P_(u)As_(1-u) (0≦z<1, 0.5<γ<1, 0<u≦1),

a to-be-oxidized layer provided in at least one of said cladding layerssuch that said cladding layer contains said to-be-oxidized layer incorrespondence to apart thereof, or between said active layer and one ofsaid cladding layers, said to-be-oxidized layer having a compositionrepresented as Al_(x)Ga_(y)In_(1-x-y)P_(t)As_(1-t) (0.85≦x≦1, 0≦y≦0.2,0≦t≦1), a part of said to-be-oxidized layer being selectively oxidizedto form a selective oxidized region.

According to the present invention, it is possible to oscillate thelaser diode in the visible wavelength band in view of the fact that theactive layer is formed of a mixed crystal of AlGaInPAs having acomposition represented as(Al_(x1)Ga_(1-x1))_(α1)In_(1-α1)P_(t1)As_(1-t1) (0≦x₁<1, 0<α₁≦1,0≦t₁≦1). In view of the fact that a mixed crystal of AlGaInPAscontaining Al with a composition represented as(Al_(y)Ga_(1-y))_(β)In_(1-β)P_(v)As_(1-v) (0<y≦1, 0.5<β<1, 0<v≦1) andhaving a lattice constant between GaP and GaAs is used for the claddinglayer, the bandgap of the cladding layer is increased as compared withthe case of using a cladding layer having a lattice matching compositionto the GaAs substrate, and the wavelength of the output opticalradiation of the semiconductor light-emitting device is reduced.

Further, in view of the fact that the semiconductor light-emittingdevice of the present invention employs the an SCH structure in whichthe mixed crystal of (Al_(x1)Ga_(1-x1))_(α1)In_(1-α1)P_(t1)As_(1-t1)(0≦x₁<1, 0<α₁≦1, 0≦t₁≦1) is used for the quantum well layer forming theactive layer and in which the mixed crystal of(Al_(z)Ga_(1-z))_(γ)In_(1-γ)P_(u)As_(1-u) (0≦z<1, 0.5<γ<1, 0<u≦1) isused for the optical waveguide layer, a wide bandgap can be realizedwith a reduced Al content as compared with the case of using a materialforming a lattice matching with a GaAs substrate, and the non-opticalrecombination of carriers is reduced substantially. Associated withthis, the efficiency of optical emission is improved. In the case of alaser diode, the problem of damaging of optical cavity edge surface as aresult of the non-optical recombination of carries is reduced and thelaser diode can be operated stably and reliably with high optical outputpower.

Further, it is possible to induce a strain in the semiconductorlight-emitting device of the present invention with respect to thecladding layer. In this case, bandgap of the active layer can bereduced. Further, a large conduction band discontinuity can be realizedin the semiconductor light-emitting device of the present invention byreducing the Al content in the optical waveguide layer. Thereby, theproblem, pertinent to a conventional red-wavelength laser diode of theAlGaInP system, of carrier overflow taking place on the conduction band,is reduced substantially.

By interposing the to-be-oxidized layer in a part of one or both of thetwo cladding layers or at the interface between the active layer and oneof the cladding layers with the composition ofAl_(x)Ga_(y)In_(1-x-y)P_(t)As_(1-t) (0.8≦x≦1, 0≦y≦0.2, 0≦t≦1), followedby an oxidizing process oxidizing a part of the to-be-oxidized layer, itis possible to form a current-blocking region by the oxidized regionthus formed selectively in the to-be-oxidized layer. As the oxidizedregion thus formed has a reduced refractive index, there is also formeda real refractive index waveguide structure by the part of theto-be-oxidized region where the selective oxidation has occurred and bythe part where no such a selective oxidation has occurred. Thereby thelateral mode control becomes possible in the semiconductorlight-emitting device. The real refractive index waveguide structurethus formed contains, in the vicinity of the active layer, only thematerial which is free from waveguide less for all the wavelengths, thelaser diode is easily operated to produce a large output optical power.

It should be noted that the foregoing advantageous structure can beformed by a single crystal growth process. Thereby, the semiconductorlight-emitting device of the present invention can be fabricated easilywith high yield.

Another object of the present invention is to provide a semiconductorlight-emitting device, comprising:

a GaAs substrate;

an active layer provided over said GaAs substrate, said active layeremitting an optical radiation;

a pair of semiconductor layers sandwiching said active layer vertically,

said semiconductor layer containing a to-be-oxidized layer in a partthereof with a composition represented asAl_(x)Ga_(y)In_(1-x-y)P_(t)As_(1-t) (0.8≦x≦1, 0≦y≦0.2, 0≦t≦1) andcontaining P,

a part of said to be-oxidized layer being oxidized to form a selectiveoxidation region.

According to the present invention, it is possible to achieve a latticematching for the to-be-oxidized layer with respect to the GaAs substrateby introducing P therein. Thereby, the adversary effect of strain causedin the to-be-oxidized layer is effectively eliminated.

Another object of the present invention is to provide a semiconductorlight-emitting device, comprising:

a GaAs substrate;

an active layer of an AlGaInP system formed over said GaAs substrate,said active layer emitting optical radiation;

a pair of semiconductor layers sandwiching said active layer vertically,each of said semiconductor layers having a bandgap larger than a bandgapof said active layer,

said semiconductor layers including, in a part thereof, a layer ofAlGaInAs having a composition represented as Al_(x)Ga_(y)In_(1-x-y)As(0.8≦x≦1, 0≦y≦0.2),

a part of said semiconductor layer being oxidized to form a pair ofoxidized regions, with a not-oxidized region formed therebetween with awidth w1, a total width of said pair of oxidized regions being definedas w2,

wherein said width w1 is set such that a ratio of said width w1 withrespect to a sum of said width w1 and said width w2, defined asw1/(w1+w2) is smaller than 0.6.

According to the present invention, the waveguide loss caused by thevariation of the edge width is successfully eliminated by setting theforegoing width to be smaller than 0.6.

Another object of the present invention is to provide a semiconductorlight-emitting device, comprising:

a GaAs substrate;

an active layer provided over said GaAs substrate, said active layeremitting optical radiation; and

a pair of semiconductor layers sandwiching said active layer vertically,each of said semiconductor layers having a bandgap larger than a bandgapof said active layer,

said semiconductor layers including, in a part thereof, a layer ofAlGaInAs having a composition represented as Al_(x)Ga_(y)In_(1-x-y)As(0.8≦x≦1, 0≦y≦0.2),

a part of said semiconductor layer being oxidized to form an oxidizedregion,

a ridge structure being formed in a part of said semiconductor layerlocated at least above said layer of AlGaInAs, said ridge structurehaving a ridge width exceeding 10 μm.

According to the present invention, a large contact area for electrodeis secured by setting the ridge width to be larger than 10 μm and thedifferential resistance during the device operation is reduced. Further,the structure is suitable for a flip-chip mounting in which the heat ofthe active region is efficiently dissipated to a supporting substratevia the electrode.

Another object of the present invention is to provide a vertical-cavitylaser diode operable in the wavelength range of 630-660 nm and variousoptical systems using such a vertical-cavity laser diode.

Another object of the present invention is to provide a vertical-cavitylaser diode, comprising:

a substrate;

an active layer provided over said substrate, said active layer emittingoptical radiation; and

a distributed Bragg reflector provided over said substrate in an opticalpath of said optical radiation emitted from said active layer in adirection perpendicularly to a plane of said active layer, saiddistributed Bragg reflector comprising a plurality of layers stackedover said substrate,

said distributed Bragg reflector having a lattice constant between GaAsand GaP and including at least two semiconductor layers of respective,mutually different compositions,

at least one of said semiconductor layers having a compositionrepresented as (Al_(x1)Ga_(1-x1))_(y1)In_(1-y1)As_(z1)P_(1-z1) (0≦x₁≦1,0.5≦y₁≦1, 0<z₁<1).

According to the present invention, the distributed Bragg reflector(DBR) is formed of an AlInAsP mixed crystal containing therein As.Thereby, the hillock formation on the surface of the layers constitutingthe DBR is substantially completely suppressed. Thereby, the problem ofoptical loss associated with the hillocks formed in the DBR iseliminated and the reflectance of the DBR is improved remarkably. Withthe improvement in the reflectance of the DBR, the oscillation thresholdof the laser diode is improved and the device performance and devicelifetime are improved also. The improvement becomes appreciable when Asis added with a concentration of about 1%.

Another object of the present invention is to provide a vertical-cavitylaser diode, comprising:

a substrate;

an active layer provided over said substrate, said active layer emittingoptical radiation; and

a distributed Bragg reflector provided over said substrate in an opticalpath of said optical radiation emitted from said active layer in adirection perpendicularly to a plane of said active layer, saiddistributed Bragg reflector comprising a plurality of layers stackedover said substrate,

said active layer having a composition represented asGa_(1-x2)In_(1-y2)As_(z2)P_(1-z2) (0≦y₂≦1, 0≦z₂≦1).

According to the present invention, the desired laser oscillationwavelength is realized with reduced strain as a result of use of GaInAsPfor the active layer. Thereby, the surface morphology of the activelayer is improved, and the efficiency of laser oscillation is improvedas a result of the improvement of quality of crystal of the activelayer. Further, as a result of reduced strain in the active layer, thedegree of freedom for designing the laser diode is improved. As theactive layer has a lattice constant closer to GaP or AlP as comparedwith the prior art vertical-cavity laser diode, it becomes possible touse a layer of AlInAsP for the DBR. As the layer of AlInAsP has a smallrefractive index, the number of stacks of the layers in the DBR isreduced; and the resistance of the laser diode is accordingly reduced.

Another object of the present invention is to provide a vertical-cavitylaser diode, comprising:

a substrate;

an active layer provided over said substrate, said active layer emittingoptical radiation;

a distributed Bragg reflector provided over said substrate in an opticalpath of said optical radiation emitted from said active layer in adirection perpendicularly to a plane of said active layer, saiddistributed Bragg reflector having a lattice constant between GaAs andGaP; and

a pair of semiconductor layers having a composition represented asGa_(y3)In_(1-y3)P (0.5≦y₃≦1) provided at upper and lower sides of saidactive layer.

According to the present invention, it is possible to reduce the numberof non-optical recombination centers associated with Al by providing theGaInP layers at both upper and lower sides of the active layer. Further,the problem of multiplication of crystal defects originating from Al, orthe problem of migration of the crystal defects into the active regionof the laser diode, is also reduced and the reliability of the laserdiode is improved.

Another object of the present invention is to provide a vertical-cavitylaser diode, comprising:

a substrate;

an active layer provided over said substrate, said, active layeremitting optical radiation;

a distributed Bragg reflector provided over said substrate in an opticalpath of said optical radiation emitted from said active layer in adirection perpendicularly to a plane of said active layer, saiddistributed Bragg reflector having a lattice constant between GaAs andGaP;

a contact layer provided over said distributed Bragg reflector; and

an electrode provided on said contact layer in ohmic contact therewith,

said contact layer being transparent to an optical beam produced as aresult of interaction of said optical radiation produced by said activelayer with said distributed Bragg reflector.

According to the present invention, the process of eliminating a part ofthe contact layer in correspondence to an optical window, from which theoptical beam is emitted to the region outside the laser diode, iseliminated as a result of use of a material transparent to the opticalbeam for the contact layer.

Another object of the present invention is to provide a vertical-cavitylaser diode, comprising:

a substrate;

an active layer provided over said substrate, said active layer emittingoptical radiation; and

a distributed Bragg reflector provided over said substrate in an opticalpath of said optical radiation emitted from said active layer in adirection perpendicularly to a plane of said active layer, saiddistributed Bragg reflector having a lattice constant between GaAs andGaP,

said distributed Bragg reflector including therein a semiconductor layerhaving a composition represented as AlAs_(z4)P_(1-z4) (0≦z₄≦1).

According to the present invention that uses AlAsP characterized by asmall refractive index as compared with AlInP of the same latticeconstant, it becomes possible to increase the diffraction indexdifferent or step inside the DBR and the number of stacks of layers inthe DBR can be reduced. Associated therewith, the threshold current oflaser oscillation is reduced together with the device resistance.

Another object of the present invention is to provide a vertical-cavitylaser diode, comprising:

a substrate;

an active layer provided over said substrate, said active layer emittingoptical radiation; and

a distributed Bragg reflector provided over said substrate in an opticalpath of said optical radiation emitted from said active layer in adirection perpendicularly to a plane of said active layer, saiddistributed Bragg reflector having a lattice constant between GaAs andGaP,

said distributed Bragg reflector including therein a semiconductor layerhaving a composition represented as AlAs_(z5)P_(1-z5) (0≦z₅≦1),

said semiconductor layer being laterally sandwiched by a pair of oxideregions formed coplanar to said semiconductor layer, said semiconductorlayer and said pair of oxide regions forming a current confinementstructure.

According to the present invention, the oxidized regions are formed inthe form of high-quality insulator by selective oxidation process of asemiconductor layer containing Al. Larger the Al content, easier for theselective oxidation process. Particularly, an AlAsP mixed crystal, whichcontains Al as the sole group III element, is easy for oxidation.According to the present invention, the threshold current of laseroscillation is decreased as a result of formation of the currentconfinement structure.

Another object of the present invention is to provide a vertical-cavitylaser diode, comprising:

a substrate;

an active layer provided over said substrate, said active layer emittingoptical radiation;

a distributed Bragg reflector provided over said substrate in an opticalpath of said optical radiation emitted perpendicularly to a plane ofsaid active layer, said distributed Bragg reflector having a latticeconstant between GaAs and GaP; and

a semiconductor layer interposed between said active layer and saiddistributed Bragg reflector, said semiconductor layer having acomposition represented as AlAs_(z6)P_(1-z6) (0≦z₆≦1),

said semiconductor layer being laterally sandwiched by a pair ofoxidized regions formed coplanar to said semiconductor layer.

According to the present invention, current confinement structure isformed between the DBR and the active layer by applying a selectiveoxidation process to the semiconductor layer. As the current confinementstructure is thus formed in the vicinity of the active layer, thecurrent is injected to the active layer in the form of highly confinedstate, and lateral spreading of the carriers in the active layer iseffectively suppressed. Further, the refractive index distribution inthe layer containing the semiconductor layer and the oxidized regionsenables an effective control of lateral mode of laser oscillation. Thus,the laser diode of the present invention oscillates at low thresholdcurrent with a stabilized lateral mode.

Other objects and further features of the present invention will becomeapparent from the following detailed description when read inconjunction with the attached drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a diagram showing the construction of a conventional laserdiode of edge-emission type;

FIG. 2 is a diagram showing the construction of another conventionallaser diode of edge-emission type;

FIG. 3 is a diagram showing the construction of a further conventionallaser diode of edge-emission type;

FIG. 4 is a diagram showing the construction of a further conventionallaser diode of edge-emission type;

FIG. 5 is a diagram showing the relationship between bandgap energy andlattice constant for a III-V semiconductor material system;

FIG. 6 is another diagram showing the relationship between bandgapenergy and lattice constant for a III-V semiconductor material system;

FIG. 7 is a diagram showing the construction of a conventional laserdiode of edge-emission type;

FIG. 8 is another diagram showing the relationship between bandgapenergy and lattice constant for a III-V semiconductor material system;

FIG. 9 is a diagram showing the construction of a laser diode accordingto a first embodiment of the present invention;

FIG. 10A-10D are diagrams showing the fabrication process of the laserdiode of FIG. 9;

FIG. 11 is a diagram showing the construction of a laser diode accordingto a second embodiment of the present invention;

FIG. 12 is a diagram showing the construction of a laser diode accordingto a third embodiment of the present invention;

FIG. 13 is a diagram showing the construction of a laser diode accordingto a fourth embodiment of the present invention;

FIG. 14 is a diagram showing the construction of a laser diode accordingto a fifth embodiment of the present invention;

FIG. 15 is a diagram showing the construction of a laser diode accordingto a sixth embodiment of the present invention;

FIG. 16 is a diagram showing the construction of a laser diode accordingto a seventh embodiment of the present invention;

FIG. 17 is a diagram showing the construction of a laser diode accordingto an eighth embodiment of the present invention;

FIG. 18 is a diagram showing the construction of a laser diode accordingto a ninth embodiment of the present invention;

FIG. 19 is a diagram showing the construction of a laser diode accordingto a tenth embodiment of the present invention;

FIG. 20 is a diagram showing the construction of a laser diode accordingto an eleventh embodiment of the present invention;

FIG. 21 is a diagram showing the construction of, a laser diodeaccording to a twelfth embodiment of the present invention;

FIG. 22 is a diagram showing the construction of a laser diode accordingto a thirteenth embodiment of the present invention;

FIG. 23 is a diagram showing the construction of a laser diode accordingto a fourteenth embodiment of the present invention;

FIG. 24 is a diagram showing the construction of a laser diode accordingto a fifteenth embodiment of the present invention;

FIG. 25 is a diagram showing the construction of a laser diode accordingto a sixteenth embodiment of the present invention;

FIG. 26 is a diagram showing the construction of a laser diode accordingto a seventeenth embodiment of the present invention;

FIG. 27 is a diagram showing the construction of a laser diode accordingto an eighteenth embodiment of the present invention;

FIG. 28 is a diagram showing the construction of a laser diode accordingto a nineteenth embodiment of the present invention;

FIG. 29 is a diagram showing the construction of a laser diode accordingto a twentieth embodiment of the present invention;

FIG. 30 is a diagram showing the construction of a laser diode accordingto a twenty-first embodiment of the present invention;

FIG. 31 is a diagram showing the construction of a laser diode accordingto a twenty-second embodiment of the present invention;

FIG. 32 is a diagram showing the construction of a laser diode accordingto a twenty-third embodiment of the present invention;

FIG. 33 is a diagram showing a part of a laser diode according to atwenty-fourth embodiment of the present invention;

FIG. 34 is a diagram showing a selective oxidation used in thefabrication process of the laser diode of the twenty-fourth embodiment;

FIG. 35 is a diagram showing the construction of a laser diode accordingto a twenty-fifth embodiment of the present invention;

FIG. 36 is a diagram showing the construction of a laser diode accordingto a twenty-sixth embodiment of the present invention;

FIG. 37 is a diagram showing the construction of a laser diode accordingto a twenty-seventh embodiment of the present invention;

FIG. 38 is a diagram showing the construction of a laser diode accordingto a twenty-eighth embodiment of the present invention;

FIG. 39 is a diagram showing the construction of a laser diode accordingto a twenty-ninth embodiment of the present invention;

FIG. 40 is a diagram showing the construction of a laser diode accordingto a thirtieth embodiment of the present invention;

FIG. 41 is a diagram showing the construction of a laser diode accordingto a thirty-first embodiment of the present invention;

FIG. 42 is a diagram showing the construction of a laser diode accordingto a thirty-second embodiment of the present invention;

FIG. 43 is a diagram showing the construction of a xerographic imagerecording apparatus according to a thirty-third embodiment of thepresent invention;

FIG. 44 is a diagram showing the construction of an optical disk driveaccording to a thirty-fourth embodiment of the present invention;

FIG. 45 is a diagram showing the construction of an optical moduleaccording to a thirty-fifth embodiment of the present invention.

DETAILED DESCRIPTION OF THE INVENTION First Embodiment

FIG. 1 shows the structure of a laser diode according to a firstembodiment of the present invention.

Referring to FIG. 1, the laser diode is constructed on a GaAsP substrate115, wherein the GaAsP substrate 115 is formed by stacking, on a GaAssubstrate 101 of n-type, a GaAsP composition graded layer 102 of n-typeand a GaAs_(0.6)P_(0.4) thick film 103 of p-type.

On the GaAsP substrate 115, there is provided a cladding layer 104 ofn-type AlGaInP having a composition represented as(Al_(0.5)Ga_(0.5))_(0.7)In_(0.3)P, and an active layer 105 of GaInAsP isformed on the cladding layer 104. Further, an etching stopper layer 106of GaInP is formed on the active layer with the composition ofGa_(00.7)In_(0.3)P.

On the etching stopper layer 106, there are formed a pair ofcurrent-blocking regions of p-type AlGaInP 107 at both lateral sides ofa stripe region, in which a current injection is made, wherein thecurrent-blocking regions 107 have a composition represented as(Al_(0.5)Ga_(0.5))_(0.7)In_(0.3)P. On each of the current-blockingregions 107, there is provided another current-blocking region 108 ofn-type AlGaInP having a composition represented as(Al_(0.5)Ga_(0.5))_(0.7)In_(0.3)P.

On the current blocking regions 108 thus formed, there is provided anoptical waveguide layer 109 of AlGaInP having a composition representedas (Al_(0.1)Ga_(0.9))_(0.7)In_(0.3)P, wherein the optical waveguidelayer 109 covers the stripe region where the etching stopper layer 106is exposed.

On the optical waveguide layer 109, there is provided a cladding layer110 of p-type AlGaInP having a composition represented as(Al_(0.5)Ga_(0.5))_(0.7)In_(0.3)P. Further, a band-discontinuityrelaxation layer 111 of p-type GaInP is formed on the cladding layer 110with the composition of Ga_(0.7)In_(0.3)P. Further, a cap layer 112 ofp-type GaAsP is formed on the band-discontinuity relaxation layer 111with the composition of GaAs_(0.6)P_(0.4).

Further, a p-type electrode 113 is formed on the surface of the p-typecap layer 112 and an n-type electrode 114 is formed on the bottomsurface of the GaAs substrate 101.

Next, the fabrication process of the laser diode of FIG. 9 will bedescribed with reference to FIGS. 10A-10D.

Referring to FIG. 10A, the cladding layer 104, the active layer 105, theetching stopper layer 106, a p-type AlGaInP layer corresponding to thecurrent-blocking regions 107, and an n-type AlGaInP layer correspondingto the current-blocking regions 108 are grown epitaxially on the GaAsPsubstrate 115 by an MOCVD process. The active layer 105 may have acomposition tuned to the bandgap wavelength of 635 nm.

Next, a resist film 201 is formed on the AlGaInP layer corresponding tothe current-blocking regions 108 and a stripe window is formed in theresist film 201 by applying a photolithographic process. Further, theAlGaInP layers corresponding to the current-blocking regions 108 and thecurrent-blocking regions 107 are patterned by a chemical etching processwhile using the resist film as a mask, until the etching stopper layer106 is exposed in correspondence to the stripe region. As a result, astripe groove as represented in FIG. 10B is formed, and the currentblocking regions 107 are separated from each other by the central stripegroove. Similarly, the current-blocking regions 108 are separated fromeach other by the stripe groove. The chemical etching process may beconducted by using a sulfuric solution as an etchant.

Next, the resist film 201 is removed and the optical waveguide layer109, the cladding layer 110, the band-discontinuity relaxation layer111, and the cap layer 112 are formed consecutively by an epitaxialprocess. Thereafter, the p-type electrode 113 is formed on the cap layer112 and the bottom surface of the GaAs substrate 101 is polished.Finally, the n-type electrode 114 is formed on the polished bottomsurface of the GaAs substrate 101.

The laser diode of FIG. 9 has s current-confinement structure formed bythe current-blocking regions 107 and 108, wherein the current-blockingregions 107 and 108 confine the injected drive current into the striperegion thus formed.

As the current-confinement structure thus formed include a stacking ofthe p-type AlGaInP layer 107 and the n-type AlGaInP layer 108, there isformed a pnpn junction in the region outside the stripe region. Becauseof the reverse biasing of the pn junction, there flows no substantialelectric current in such a current-confinement structure, and theelectric current is effectively confined into the stripe region.

Of course it is possible to construct the current-confinement structureby stacking of more than two layers with different carrier density ordifferent conductivity type. Alternatively, the current-confinementstructure may be formed by using a high-resistance or semi-insulatingAlGaInP layer.

When a drive current is injected into the GaInAsP active layer 105,there occurs emission of optical radiation with a wavelength of 635 nm,in correspondence to the bandgap. Thereby, it should be noted that theoptical waveguide layer 109 of AlGaInP covers the stripe groove over thethin GaInP etching stopper layer 106. In view of the fact that theoptical waveguide layer 109 has a refractive index smaller than therefractive index of the active layer 105 but larger than the refractiveindex of the cladding layer 110 or the current-blocking regions 107 and108, and further in view of the fact that the optical waveguide layer109 is located away from the active layer 105 in the region outside thestripe groove, there is formed a refractive index structure in which therefractive index is larger in the stripe groove than in the regionoutside the strip groove. Thereby, the optical radiation emitted by theactive layer 105 is effectively confined in the stripe groove.

While it is true that the horizontal lateral mode leaks into the regionoutside the stripe groove, the optical loss outside the stripe groove isminimized due to the large bandgap of the p-type current-blockingregions 107 and the n-type current-blocking regions 108. There occurs nosubstantial optical absorption. Thus, the drive current of the laserdiode is effectively minimized.

In the structure of FIG. 9, it should be noted that the foregoing realrefractive index profile is formed, not by reducing the refractive indexof the current-blocking regions 107 and 108 but by changing the locationof the optical waveguide layer 109. Thus, the same composition can beused for the p-type current-blocking regions 107 and the n-typecurrent-blocking regions 108. Thereby, there is no need of increasingthe Al content and the problem of optical damaging of the optical cavityedge is minimized.

In view of the fact that the laser diode of FIG. 9 is constructed on theGaAsP substrate 115 having a lattice constant between the latticeconstant of GaAs and the lattice constant of GaP, the GaInP etchingstopper layer 106 that achieves lattice matching with the GaAsPsubstrate 115 has the composition of Ga_(0.7)In_(0.3)P and a bandgapwavelength of 560 nm. As this wavelength is substantially shorter thanthe bandgap wavelength of 635 nm of the active layer 105, the etchingstopper layer 106 functions as a carrier-blocking layer having a bandgaplarger than the bandgap of the active layer 105. Thereby, there occursno optical absorption by the etching stopper layer 106. In view of thefact that a GaInP layer shows a very low etching rate with respect to anAlGaInP layer when subjected to an etching process using a sulfuric acidetchant, the selective etching process for forming the current-blockingregions 107 and 108 is substantially facilitated.

It should be noted that the GaAs_(0.6)P_(0.4) 115 is formed on then-type GaAs substrate 101 as a result of stacking of the n-type GaAsPcomposition graded layer 102 and the n-type GaAs_(0.6)P_(0.4) thick film103 formed by a vapor-phase epitaxial process, as noted previously. Sucha GaAsP substrate is marketed commercially as a substrate for 660nm-wavelength red LED. Thus, fabrication of the laser diode is easilymade, by utilizing such a commercially available substrate.

Second Embodiment

Next, a second embodiment of the present invention will be describedwith reference to FIG. 11 wherein those parts corresponding to the partsdescribed previously are designated by the same reference numerals andthe description thereof will be omitted.

Referring to FIG. 11, there is provided a lower optical waveguide layer301 on the n-type cladding layer 104 with a composition ofGa_(0.7)In_(0.3)P, and a quantum-well active layer 302 is formed on thelower optical waveguide layer 301 by alternately stacking GaInP andGaInAsP layers so as to form a strained superlattice structure. Further,a first upper optical waveguide layer 303 is formed on the quantum-wellactive layer 302 with a composition represented as Ga0.7In0.3P. Further,a second upper optical waveguide layer 304 is formed on the n-typecurrent-blocking regions 108 with a composition of Ga0.7In0.3P, whereinthe second upper optical waveguide layer is formed on thecurrent-blocking regions 108 so as to cover the stripe groove region.Otherwise, the laser diode of FIG. 11 has a construction disclosed inFIG. 9.

In the present embodiment, the laser diode has an SCH structure as aresult of use of the optical waveguide layers 301 and 303 on theGaInAsP/GaInP quantum-well active layer 302, wherein it should be notedthat the lower optical waveguide layer 301 and the first upper opticalwaveguide layer 303 have an Al-free composition of Ga0.7In0.3P.

Thus, the laser diode of the present embodiment has an advantageousfeature over the laser diode of the previous embodiment in the point inthat the problem of oxidation or formation of surface states at theoptical cavity edge surface is reduced. Thereby, the problem of opticaldamaging at such a cavity edge surface is reduced.

Further, there is an advantageous point, in view of the fact that thesecond upper optical waveguide layer 304 covering the first opticalwaveguide layer 303 and the n-type current-blocking regions 108 isformed with the composition of Ga0.7In0.3P, that the second crystalgrowth is started from the layer thus free from Al. Thereby, the qualityof the crystal of the semiconductor layers thus formed by the regrowthprocess is improved.

Further, it should be noted, in the laser diode of FIG. 11, that thetotal thickness of the Ga_(0.7)In_(0.3)P first upper optical waveguidelayer 303 and the Ga_(0.7)In_(0.3)P second upper optical waveguide layer304 is set generally equal to the thickness of the Ga_(0.7)In_(0.3)Plower optical waveguide layer 301. Thus, there appears a symmetricrefractive profile about the quantum-well active layer 302 in thevertical cross section of the laser diode for the part that includes thestripe region. As a result of such a vertically symmetric refractiveindex profile, the quantum-well active layer 302 is located at theposition where the vertical mode optical intensity is maximum. Thereby,the coefficient of optical confinement is improved and the thresholdcurrent of laser oscillation is reduced.

Third Embodiment

FIG. 12 shows the construction of a laser diode according to a thirdembodiment of the present invention, wherein those parts correspondingto the parts described previously are designated by the same referencenumerals and the description thereof will be omitted.

Referring to FIG. 12, the laser diode includes an n-type cladding layer401 formed on the n-type GaAs_(0.6)P_(0.4) thick film 103 with acomposition of (Al_(0.5)Ga_(0.5))_(0.7)In_(0.3)As_(0.05)P_(0.95).Further, the laser diode includes a pair of current-blocking regions 402of p-type AlGaInAsP formed on the first upper optical waveguide layer303 with the composition of(Al_(0.5)Ga_(0.5))_(0.7)In_(0.3)As_(0.05)P_(0.95) except for the striperegion, and a pair of current-blocking regions 403 of n-type AlGaInAsPhaving a composition represented as(Al_(0.5)Ga_(0.5))_(0.7)In_(0.3)As_(0.05)P_(0.95) are formed on thep-type current-blocking regions 402 respectively. Each of the n-typecurrent-blocking regions 403 is covered by a cap layer 404 of GaInPhaving a composition represented as Ga_(0.7)In_(0.3)P.

Further, the laser diode includes, on the second upper optical waveguidelayer 304, a cladding layer 405 of p-type AlGaInAsP with a compositionrepresented as (Al_(0.5)Ga_(0.5))_(0.7)In_(0.3)As_(0.05)P_(0.95).

In the present embodiment, the n-type AlGaInAsP current-blocking regions403 are covered with the Ga_(0.7)In_(0.3)P cap layer 404, which is freefrom Al. Thereby, the surface of the current-blocking regions 403containing Al is not exposed for the surface on which the regrowthprocess is to be conducted. Thus, the quality of the crystal layers tobe grown thereon is improved.

Further, it should be noted that the n-type cladding layer 401, thep-type current-blocking regions 402, the n-type current-blocking regions403, and the p-type cladding layer 405 are formed of AlGaInAsPcontaining As with an amount of about 5%. By adding, a small amount ofAs to the mixed crystal of AlGaInP, the hillock density and hillock sizeare reduced substantially in the mixed crystal layer grown by an MOCVDprocess. Thereby, the smoothness of the device surface is improved andthe scattering loss of the optical radiation in the optical waveguide isminimized. Associated therewith, the threshold current of laseroscillation is reduced and the slope efficiency is improved.

According to the present embodiment, it is possible to set a width W ofthe stripe region to be smaller than 5 μm. For example, it is possibleto set the width to 3 μm. When the width of the stripe region is thusdecreased, the leakage of the lateral mode optical radiation to theregion outside the stripe region increases inevitably. If thecurrent-blocking regions of the laser diode are formed of a materialthat absorbs the optical radiation, there would occur an extensiveoptical absorption loss and the slope efficiency of the laser diodewould have been deteriorated. Further, when the Al-content in thecurrent-blocking regions is large, there is a risk of optical damagingcaused in the current-blocking regions in correspondence to the opticalcavity edge as a result of optical absorption by the surface states. Itshould be noted that the current-blocking regions contain Al with aconcentration identical with the concentration of the cladding layer,and there occurs no increase of optical damaging in the current-blockingregions. The decrease of the stripe width of course contributes to thedecrease of the drive current of the laser diode.

Fourth Embodiment

FIG. 13 shows the construction of a laser diode according to a fourthembodiment of the present invention.

Referring to FIG. 13, the laser diode is constructed on a substrate 1102of n-type GaAs carrying thereon a composition-graded layer 1103 ofn-type GaAsP having a composition represented as GaAs_(y)P_(1-y),wherein the composition-graded layer 1103 is formed by an MOCVD processwhile changing the composition y continuously and gradually from 1 to0.4. The growth process of the composition-graded layer 1103 is wellestablished a smooth surface is realized by optimizing the compositiongradient.

Next, a buffer layer 1104 of n-type GaAsP having a composition ofGaAs_(0.6)P_(0.4) is grown on the composition-graded layer 1103, andcladding layer 1105 of n-type AlGaInAsP, an undoped active layer 1106 ofGaInAsP, a cladding layer 1107 of p-type AlGaInAsP, a spike-eliminationlayer 1198 of p-type GaInP, and a cap layer 1109 of p-type GaAsP, aregrown consecutively on the buffer layer 1104 by an MOCVD process.

After the formation of the cap layer 1109, an SiO₂ film is deposited bya CVD process, followed by a photolithographic process to form a stripepattern in correspondence to the region where injection of electriccurrent is to be made, with a width of 10 μm.

Next, the layers 1109 and 1108 are patterned consecutively by a chemicaletching process while using the SiO₂ film thus formed as a mask, whereinthe chemical etching process is continued until the etching reaches apart of the semiconductor layer 1107. As a result, a mesa ridge stripeis formed as represented in FIG. 13.

In the foregoing chemical etching process, the p-type GaAs cap layer1109 is patterned while using a sulfuric acid etchant, while the p-typeGaInP layer 1108 and the p-type AlGaInAsP layer 1107 are patterned by ahydrochloric acid etchant. The depth of etching of the cladding layer1107 is controlled by way of controlling the duration of the etchingprocess. According to such a process, it is possible to simplify thefabrication process and device structure.

Next, a pair of current-blocking regions 1110 of n-type AlGaInAsP areformed on the mesa structure thus formed by a regrowth process whileusing the SiO₂ film as the mask covering the ridge region of the mesastructure, wherein the current-blocking regions 1110 are grown on theregion of the cladding layer 1107 not covered by the SiO₂ mask.

Further, the SiO₂ mask is removed, and a contact layer 1111 of p-typeGaAsP is grown on the current-blocking regions 1110 by a regrowthprocess so as to cover the p-type GaAsP cap layer 1109 exposed at theridge region of the mesa structure.

Thereafter, the bottom surface of the substrate 1102 is polished and ann-type electrode 1101 is formed thereon by an evaporation depositionprocess. Further, a p-type electrode 1112 is deposited on the contactlayer 1111. The electrodes 1101 and 1112 are subjected to an annealingprocess, and the optical cavity of the laser diode is formed by cleavingthe structure thus formed.

In the laser diode of FIG. 13, it should be noted that the claddinglayer 1107, the contact layer 1111 and the cap layer 1109 achieve alattice matching to the GaAsP mixed crystal layer of the compositionGaAs_(0.6)P_(0.4).

In the GaInAsP active layer 1106 formed with lattice matching with theGaAs_(0.6)P_(0.4) mixed crystal composition, it is possible to changethe bandgap wavelength from 560 nm to 650 nm. Further, it is alsopossible to increase the range of optical wavelength by adopting aquantum-well structure or applying strain to the active layer 1106.Further, it is possible to realize an optical wavelength of the 630 nmband or 650 nm band by introducing As into the active layer.

In the case of the laser diode of the illustrated construction, thelaser diode oscillated at the wavelength of 635 nm. In this case, amixed crystal of AlGaInAsP was used for the current blocking regions1110, and the As content was set to be 20% in atomic percent for thegroup V elements constituting the mixed crystal. As a result, theproblem of hillock formation was successfully suppressed and a flat andsmooth surface was obtained. Thereby, the leakage current associatedwith the hillocks was reduced, and the frequency of initial failure ofthe laser diode was also reduced. With the elimination of currentleakage path, the injected drive current was effectively confined intothe stripe region as a result of the current-confinement action of thepnp structure formed outside the ridge stripe.

Further, in view of the fact that an AlGaInAsP composition having asmaller bandgap as compared with the active layer 1106 is used for thecurrent-blocking regions 1110, there occurs an optical absorption forthe higher mode optical radiation leaked from the stripe region in thelateral direction. Thereby, a waveguide loss is caused at the regionoutside the ridge stripe for the higher-mode optical radiation thatspreads into such a region outside the stripe ridge structure.Associated therewith, the fundamental mode optical radiation is alone iseffectively confined in the ridge stripe and there is formed arefractive-index waveguide structure characterized by a single peak. Thelaser diode thereby oscillates stably in the fundamental lateral modeeven when operated to provide a high output power.

Fifth Embodiment

FIG. 14 shows the construction of a laser diode according to a fifthembodiment of, the present invention.

Referring to FIG. 14, the laser diode is constructed on a substrate 1202of n-type GaAs carrying thereon a composition-graded layer 1203 ofn-type GaAsP having a composition represented as GaAs_(y)P_(1-y),wherein the composition-graded layer 1203 is formed by an MOCVD processwhile changing the composition y continuously and gradually from 1 to0.4. The growth process of the composition-graded layer 1203 is wellestablished a smooth surface is realized by optimizing the compositiongradient.

Next, a buffer layer 1204 of n-type GaAsP having a composition ofGaAs_(0.6)P_(0.4) is grown on the composition-graded layer 1203, andcladding layer 1105 of n-type AlGaInAsP, an undoped active layer 1206 ofGaInAsP, a cladding layer 1207 of p-type AlGaInAsP, a spike-eliminationlayer 1208 of p-type GaInP, and a cap layer 1209 of p-type GaAsP, aregrown consecutively on the buffer layer 1204 by an MOCVD process.

After the formation of the cap layer 1209, an SiO₂ film is deposited bya CVD process, followed by a photolithographic process to form a stripepattern in correspondence to the region where injection of electriccurrent is to be made, with a width of 10 μm.

Next, the layers 1209 and 1208 are patterned consecutively by a chemicaletching process while using the SiO₂ film thus formed as a mask, whereinthe chemical etching process is continued until the etching reaches apart of the semiconductor layer 1207. As a result, a mesa ridge stripeis formed as represented in FIG. 14.

In the foregoing chemical etching process, the p-type GaAs cap layer1209 is patterned while using a sulfuric acid etchant, while the p-typeGaInP layer 1208 and the p-type AlGaInAsP layer 1207 are patterned by ahydrochloric acid etchant. The depth of etching of the cladding layer1207 is controlled by way of controlling the duration of the etchingprocess. According to such a process, it is possible to simplify thefabrication process and device structure.

Next, a pair of current-blocking regions 1210 of n-type AlGaInAsP areformed on the mesa structure thus formed by a regrowth process with acomposition set so as to achieve lattice matching with theGaAs_(0.6)P_(0.4) mixed crystal composition while using the SiO₂ film asthe mask covering the ridge region of the mesa structure, wherein thecurrent-blocking regions 1210 are grown on the region of the claddinglayer 1207 not covered by the SiO₂ mask. By introducing As with aconcentration of 5% into the current-blocking regions 1210, the problemof hillock formation was effectively suppressed.

Further, the SiO₂ mask is removed and a contact layer 1211 of p-typeGaAsP is grown on the current-blocking regions 1210 by a regrowthprocess so as to cover the p-type GaAsP cap layer 1209 exposed at theridge region of the mesa structure.

Thereafter, the bottom surface of the substrate 1202 is polished and ann-type electrode 1201 is formed thereon by an evaporation depositionprocess. Further, a p-type electrode 1212 is deposited on the contactlayer 1211. The electrodes 1201 and 1212 are subjected to an annealingprocess to form an ohmic contact, and the optical cavity of the laserdiode is formed by cleaving the structure thus formed.

In the laser diode of FIG. 14, it should be noted that the claddinglayer 1207, the current-blocking regions 1210, the contact layer 1211and the cap layer 1209′ achieve lattice matching to the GaAsP mixedcrystal layer of the composition GaAs_(0.6)P_(0.4).

In the GaInAsP active layer 1206 formed with lattice matching with theGaAs_(0.6)P_(0.4) mixed crystal composition, it is possible to changethe bandgap wavelength from 560 nm to 650 nm. Further, it is alsopossible to increase the range of optical wavelength by adopting aquantum-well structure or applying strain to the active layer 1206.Further, it is possible to realize an optical wavelength of the 630 nmband or 650 nm band by introducing As into the active layer 1206.

In the case of the laser diode of the illustrated construction, thelaser diode oscillated at the wavelength of 635 nm. In this case, amixed crystal of AlGaInAsP was used for the current blocking, regions1210 with the lattice matching composition to the GaAsP mixed crystalwhile setting the As content to 5% in atomic percent for the group Velements constituting the mixed crystal. Thereby, the refractive indexof the current-blocking regions 1210 is reduced as compared with therefractive index of the cladding layer 1207, and there is formed a realrefractive index waveguide structure.

Associated therewith, the efficiency of laser oscillation is improvedand the laser diode can operate stably with high optical output power.The use of the real-refractive index waveguide structure also reducesastigmatism of the output optical beam.

Further, the problem of hillock formation was successfully suppressedand a flat and smooth surface was obtained by introducing 5% of As intothe current-blocking regions 2210. Thereby, the leakage currentassociated with the hillocks was reduced, and the frequency of initialfailure of the laser diode was also reduced. With the elimination ofcurrent leakage path, the injected drive current was effectivelyconfined into the stripe region as a result of the current-confinementaction of the pnp structure formed outside the ridge stripe.

Sixth Embodiment

FIG. 15 shows the construction of a laser diode according to a sixthembodiment of the present invention.

FIG. 15 shows the construction of a laser diode according to a sixthembodiment of the present invention.

Referring to FIG. 15, the laser diode is constructed on a substrate 1302of n-type GaAs carrying thereon a composition-graded layer 1303 ofn-type GaAsP having a composition represented as GaAs_(y)P_(1-y),wherein the composition-graded layer 1303 is formed by an MOCVD processwhile changing the composition y continuously and gradually from 1 to0.4. The growth process of the composition-graded layer 1303 is wellestablished a smooth surface is realized by optimizing the compositiongradient.

Next, a buffer layer 1304 of n-type GaAsP having a composition ofGaAs_(0.6)P_(0.4) is grown on the composition-graded layer 1303, andcladding layer 1305 of n-type AlGaInAsP, an undoped active layer 1306 ofGaInAsP, a first cladding layer 1307 of p-type AlGaInAsP, an etchingstopper layer 308 of p-type GaAsP, a second cladding layer of p-typeAlGaInAsP, a spike elimination layer 1310 of p-type GaInP, and a caplayer 1311 of p-type GaAsP, are grown consecutively on the buffer layer1304 by an MOCVD process.

After the formation of the cap layer 1311, an SiO₂ film is deposited bya CVD process, followed by a photolithographic process to form a stripepattern in correspondence to the region where injection of electriccurrent is to be made, with a width of 10 μm.

Next, the layers 1311, 1310 and 1309 are patterned consecutively by achemical etching process while using the SiO₂ film thus formed as amask, wherein the chemical etching process is continued until theetching stopper layer 1308 is exposed. As a result, a mesa ridge stripeis formed as represented in FIG. 14.

In the foregoing chemical etching process, the p-type GaAsP cap layer1311 is patterned while using a sulfuric acid etchant, while the p-typeGaInP layer 1310 and the p-type AlGaInAsP layer 1309 are patterned by ahydrochloric acid etchant. As a result of use of the etching stopperlayer 1308, the control of height of the ridge structure issubstantially facilitated.

Next, a pair of current-blocking regions 1312 of n-type AlGaInAsP areformed on the mesa structure thus formed by a regrowth process whileusing the SiO₂ film as the mask covering the ridge region of the mesastructure, wherein the current-blocking regions 1312 are grown on theregion of the cladding layer 1312 not covered by the SiO₂ mask.

Further, the SiO₂ mask is removed and a contact layer 1313 of p-typeGaAsP is grown on the current-blocking regions 1312 by a regrowthprocess so as to cover the p-type GaAsP cap layer 1311 exposed at theridge region of the mesa structure.

Thereafter, the bottom surface of the substrate 1302 is polished and ann-type electrode 1301 is formed thereon by an evaporation depositionprocess. Further, a p-type electrode 1314 is deposited on the contactlayer 1313. The electrodes 1301 and 1314 are subjected to an annealingprocess so as to form an ohmic contact, and the optical cavity of thelaser diode is formed by cleaving the structure thus formed.

In the laser diode of FIG. 15, a laser oscillation was obtained with thehorizontal lateral mode at the wavelength of 650 nm.

As a result of use of the mixed crystal containing As for thecurrent-confinement regions 1312, the problem of hillock formation wassuccessfully eliminated. Thereby, the problem of leakage current orwaveguide loss associated with optical scattering is eliminated and thethreshold current of laser oscillation is reduced. In the illustratedexample, a composition of GaAs_(0.4)P_(0.6) was used for the etchingstopper layer 1308 so as to form a lattice misfit of about −0.73%.Thereby, the bandgap of the etching stopper layer 1308 exceeds thephoton energy of the laser beam radiation produced by the laser diodeand the problem of optical loss is avoided. It should be noted that theetching stopper layer 1308 is provided with a thickness less than thecritical thickness and the problem of degradation of crystal quality isavoided.

In the present embodiment that uses GaAsP for the etching stopper layer1308, the bandgap energy is larger than the case of using GaInP for theetching stopper layer 1308. On the other hand, the lattice strain of theetching stopper layer 1308 can be minimized by using a composition ofGaInAsP. The etching stopper layer 1308 having such a composition avoidsoptical absorption simultaneously.

As a result of use of the etching stopper layer 1308, it becomespossible, in the present embodiment, to apply an etching process to theregion where the active layer 1306 is provided or to the region in thevicinity of the active layer 1306, without causing an over-etching ofthe active layer 1506. Even so, the effect of non-optical surface stateson the etching surface was eliminated with regard to the devicecharacteristic or scattering of device characteristic.

Further, in view of the fact that the etching stopper layer 1308 iscovered with the cladding layer 1307, there occurs no surface oxidation,and the current-confinement regions 312 are formed thereon withexcellent crystal quality. As a result, the laser diode of the presentembodiment shows little aging and operates with excellent reliability.

Seventh Embodiment

FIG. 16 shows the construction of a laser diode according to a seventhembodiment of the present invention.

Referring to FIG. 16, the laser diode is constructed on a substrate 1402of n-type GaAs carrying thereon a composition-graded layer 1403 ofn-type GaAsP having a composition represented as GaAs_(y)P_(1-y),wherein the composition-graded layer 1403 is formed by an MOCVD processwhile changing the composition y continuously and gradually from 1 to0.4. The growth process of the composition-graded layer 1403 is wellestablished a smooth surface is realized by optimizing the compositiongradient.

Next, a buffer layer 1404 of n-type GaAsP having a composition ofGaAs_(0.6)P_(0.4) is grown on the composition-graded layer 1403, andcladding layer 1405 of n-type AlGaInAsP, an optical waveguide layer 1406of undoped GaInP, an active layer 1407 of undoped GaInAsP, an opticalwaveguide layer 1408 of undoped GaInP, a cladding layer 1409 of p-typeAlGaInAsP, a spike-elimination layer 1410 of p-type GaInP, and a caplayer 1411 of p-type GaAsP, are grown consecutively on the buffer layer1404 by an MOCVD process.

After the formation of the cap layer 1411, an SiO₂ film is deposited bya CVD process, followed by a photolithographic process to form a stripepattern in correspondence to the region where injection of electriccurrent is to be made, with a width of 10 μm.

Next, the layers 1411, 1410 and 1409 are patterned consecutively by achemical etching process while using the SiO₂ film thus formed as amask, wherein the chemical etching process is continued until theoptical waveguide layer 1408 is exposed. As a result, a mesa ridgestripe is formed as represented in FIG. 16.

In the foregoing chemical etching process, the p-type GaAsP cap layer1411 is patterned while using a sulfuric acid etchant, while the p-typeGaInP layer 1410 and an upper part of the p-type AlGaInAsP layer 1409are patterned by a hydrochloric acid etchant. Then the etchant ischanged again to the sulfuric acid etchant and the remaining part of theAlGaInAsP cladding layer 1409 is etched until the optical waveguidelayer 1408 is exposed. Thereby, the optical waveguide layer 1408 is usedas the etching stopper. As a result of use of the etching stopper, thepresent invention can control the height of the ridge structure easily.

Next, a pair of current-blocking regions 1413 of p-type AlGaInAsP areformed on the mesa structure thus formed by a regrowth process whileusing the SiO₂ film as the mask covering the ridge region of the mesastructure, wherein the current-blocking regions 1412 are grown on theregion of the optical waveguide layer 1408 and the cladding layer 1409not covered by the SiO₂ mask. Further, n-type AlInAsP current blockingregions 1413 are grown on the p-type current-blocking regions 1412 whileusing the SiO2 mask, similarly to the process of forming thecurrent-blocking regions 1412.

Further, the SiO₂ mask is removed and a contact layer 1414 of p-typeGaAsP is grown on the current-blocking regions 1413 by a regrowthprocess so as to cover the p-type GaAsP cap layer 1411 exposed at theridge region of the mesa structure.

Thereafter, the bottom surface of the substrate 1402 is polished and ann-type electrode 1401 is formed thereon by an evaporation depositionprocess. Further, a p-type electrode 1412 is deposited on the contactlayer 1414. The electrodes 1401 and 1415 are subjected to an annealingprocess, and the optical cavity of the laser diode is formed by cleavingthe structure thus formed.

In the laser diode of FIG. 16, it should be noted that the claddinglayer 1409, the contact layer 1414 and the current-blocking regions 1412and 1413 form together a pnp structure acting as a current confinementstructure.

In the illustrated example, the laser diode oscillated with thefundamental lateral mode at the wavelength of 640 nm.

By adding As into the mixed crystal layer constituting thecurrent-blocking regions 412 and 413, the problem of hillock formationis successfully eliminated in the laser diode of the present embodiment.Associated with this, the leakage current path is eliminated and thewaveguide loss caused as a result of optical scattering is minimized.

As the active layer 1407 is sandwiched by the GaInP optical waveguidelayers 1406 and 1408, which is free from Al, non-optical recombinationof carriers is reduced and the threshold of laser oscillation isreduced. Further, as a result of use of Al-free material in the opticalwaveguide of the laser diode in which the optical intensity is strong,the surface states associated with oxidation of Al is minimized and theCOD level is increased. Thereby, the laser diode operates at a highoptical output power.

Eighth Embodiment

FIG. 17 shows the construction of a laser diode according to an eighthembodiment of the present invention.

Referring to FIG. 17, the laser diode is constructed on a substrate 1502of n-type GaAs carrying thereon a composition-graded layer 1503 ofn-type GaAsP having a composition represented as GaAs_(y)P_(1-y),wherein the composition-graded layer 1503 is formed by an MOCVD processwhile changing the composition y continuously and gradually from 1 to0.4. The growth process of the composition-graded layer 1503 is wellestablished a smooth surface is realized by optimizing the compositiongradient.

Next, a buffer layer 1504 of n-type GaAsP having a composition ofGaAs_(0.6)P_(0.4) is grown on the composition-graded layer 1503, and acladding layer 1505 of n-type AlGaInAsP, an undoped active layer 1506 ofGaInAsP, a first cladding layer 1507 of p-type AlGaInAsP, and a currentconfinement layer 1508 of n-type AlGaInAsP, are grown consecutively onthe buffer layer 1504 by an MOCVD process.

After the formation of the current confinement layer 1508, a resist filmis deposited by a spin-coating process, followed by a photolithographicprocess to form a stripe window in correspondence to the region whereinjection of electric current is to be made, with a width of 10 μm.

Next, the current confinement layer 1508 is patterned by a chemicaletching process while using the resist film thus formed as a mask,wherein the chemical etching process is continued until the etchingreaches the optical waveguide layer 1507. As a result, a stripe grooveis formed as represented in FIG. 17. The chemical etching process may beconducted by using a sulfuric acid etchant. As a result of the chemicaletching process, a pair current-blocking regions 1508 are formed with anintervening stripe groove region exposing the optical waveguide layer1507.

Next, the resist film is removed and a second cladding layer 1509 ofp-type AlGaInAsP, a spike-elimination layer 1510 of p-type GaInP, and acontact layer 1511 of p-type GaAsP are grown consecutively on thecurrent-blocking regions 1508 by a regrowth process so as to cover theoptical waveguide layer 1507 exposed at the stripe groove region.

Thereafter, the bottom surface of the substrate 1502 is polished and ann-type electrode 1501 is formed thereon by an evaporation depositionprocess. Further, a p-type electrode 1512 is deposited on the contactlayer 1511. The electrodes 1501 and 1512 are subjected to an annealingprocess to form an ohmic contact, and the optical cavity of the laserdiode is formed by cleaving the structure thus formed.

In the laser diode of FIG. 17, it should be noted that the claddinglayer 1509 and the contact layer 1111 achieve a lattice matching to theGaAsP mixed crystal layer of the composition GaAs_(0.6)P_(0.4).

In the case of the laser diode of the illustrated construction, thelaser diode oscillated with the fundamental lateral mode at thewavelength of 635 nm.

It should be noted that the current-blocking layer or regions 1508contain As with the concentration of 20%. As a result, there occurs nosubstantial formation of hillocks and a smooth and flat surface isobtained for the layer 1508. Thereby, the problem of leakage currentinduced by hillocks or the associated problem of initial failure of thelaser diode is effectively eliminated.

Further, in view of elimination of the leakage current path, it becomespossible to confine the electric current into the stripe region moreefficiently.

It should be noted that the fabrication process of the laser diode ofthe present embodiment requires only two MOCVD process, contrary to thecase of forming the laser diode having a stripe ridge structure, whichrequires three separate MOCVD process. Thereby, the number ofintermission of the growth process is reduced and degradation of qualityof the epitaxial layers grown on such a surface is minimized.

Ninth Embodiment

FIG. 18 shows the construction of a laser diode according to an eighthembodiment of the present invention.

Referring to FIG. 18, the laser diode is constructed on a substrate 1602of n-type GaAs carrying thereon a composition-graded layer 1603 ofn-type GaAsP having a composition represented as GaAs_(y)P_(1-y),wherein the composition-graded layer 1603 is formed by an MOCVD processwhile changing the composition y continuously and gradually from 1 to0.4. The growth process of the composition-graded layer 1603 is wellestablished a smooth surface is realized by optimizing the compositiongradient.

Next, a buffer layer 1604 of n-type GaAsP having a composition ofGaAs_(0.6)P_(0.4) is grown on the composition-graded layer 1603, and acladding layer 1605 of n-type AlGaInAsP, an undoped active layer 1606 ofGaInAsP, a first cladding layer 1607 of p-type AlGaInAsP, and a currentconfinement layer 1608 of n-type AlGaInAsP, are grown consecutively onthe buffer layer 1604 by an MOCVD process.

After the formation of the current confinement layer 1608, a resist filmis deposited by a spin-coating process, followed by a photolithographicprocess to form a stripe window in correspondence to the region whereinjection of electric current is to be made, with a width of 10 μm.

Next, the current confinement layer 1608 is patterned by a chemicaletching process while using the resist film thus formed as a mask,wherein the chemical etching process is continued until the etchingreaches the optical waveguide layer 1607. As a result, a stripe grooveis formed as represented in FIG. 17. The chemical etching process may beconducted by using a sulfuric acid etchant. As a result of the chemicaletching process, a pair current-blocking regions 1508 are formed with anintervening stripe groove region exposing the optical waveguide layer1607.

Next, the resist mask is removed and a second cladding layer 1609 ofp-type AlGaInAsP, a spike-elimination layer 1610 of p-type GaInP, and acontact layer 1611 of p-type GaAsP are grown on the current-blockingregions 1608 consecutively by a regrowth process so as to cover theoptical waveguide layer 1607 exposed at the stripe groove region.

Thereafter, the bottom surface of the substrate 1602 is polished and ann-type electrode 1601 is formed thereon by an evaporation depositionprocess. Further, a p-type electrode 1612 is deposited on the contactlayer 1611. The electrodes 1601 and 1612 are subjected to an annealingprocess to form an ohmic contact, and the optical cavity of the laserdiode is formed by cleaving the structure thus formed.

In the laser diode of FIG. 18, it should be noted that the AlInAsPcurrent-blocking layer 1608, and hence the current-blocking regions1608, is formed to have a composition transparent to the laser beamradiation produced by the laser diode, by introducing 5% of As into thecomposition of AlInP. Thereby, the current-blocking regions 1608 achievelattice matching with the composition GaAs_(0.6)P_(0.4).

With this amount of As, it was observed that hillock formation iseffectively suppressed. Further, it should be noted that the AlInAsPcurrent-blocking regions 1608 of the foregoing lattice matchingcomposition have a refractive index smaller than the refractive index ofthe cladding layer 1607. Thus, there occurs no substantial waveguideloss, and the threshold current is reduced further. Further, the outerdifferential quantum efficiency is improved and the laser diode canproduce high output optical power. In addition, the use of thereal-refractive index waveguide structure reduces the astigmatism of theoutput optical beam, and a single peak beam spot is obtained. The laserdiode causes an oscillation with the fundamental lateral mode whendriven to produce a high output optical power.

Tenth Embodiment

FIG. 19 shows the construction of a laser diode according to a tenthembodiment of the present invention.

Referring, to FIG. 19, the laser diode is constructed on a substrate1702 of n-type GaAs carrying thereon a composition-graded layer 1703 ofn-type GaAsP having a composition represented as GaAs_(y)P_(1-y),wherein the composition-graded layer 1703 is formed by an MOCVD processwhile changing the composition y continuously and gradually from 1 to0.4. The growth process of the composition-graded layer 1703 is wellestablished a smooth surface is realized by optimizing the compositiongradient.

Next, a buffer layer 1704 of n-type GaAsP having a composition ofGaAs_(0.6)P_(0.4) is grown on the composition-graded layer 1703, and acladding layer 1705 of n-type AlGaInAsP, an active layer 1706 of undopedGaInAsP, a first cladding layer 1707 of p-type AlGaInAsP, an etchingstopper layer 1708 of p-type GaInAsP, and a current confinement layer1709 of n-type AlGaInAsP, are grown consecutively on the buffer layer1704 by an MOCVD process.

After the formation of the current confinement layer 1709, a resist filmis deposited by a spin-coating process, followed by a photolithographicprocess to form a stripe window in correspondence to the region whereinjection of electric current is to be made, with a width of 10 μm.

Next, the current confinement layer 1709 is patterned by a chemicaletching process while using the resist film thus formed as a mask,wherein the chemical etching process is conducted by using ahydrochloric acid etchant and continued until the etching stopper layer1708 is exposed. As a result, a stripe groove is formed as representedin FIG. 19. As a result of the use of the etching stopper layer 1708,the depth of the stripe groove is controlled exactly.

Next, the resist mask is removed and a second cladding layer 1710 ofp-type AlGaInAsP, a spike-elimination layer 1711 of p-type GaInP, and acontact layer 1712 of p-type GaAsP are grown consecutively on thecurrent-blocking regions 1709 by a regrowth process so as to cover theetching stopper layer 1708 exposed at the stripe groove region.

Thereafter, the bottom surface of the substrate 1702 is polished and ann-type electrode 1701 is formed thereon by an evaporation depositionprocess. Further, a p-type electrode 1713 is deposited on the contactlayer 1712. The electrodes 1701 and 1713 are subjected to an annealingprocess to form an ohmic contact, and the optical cavity of the laserdiode is formed by cleaving the structure thus formed.

In the case of the laser diode of the illustrated example, the laserdiode oscillated with the fundamental lateral mode at the wavelength of635 nm.

It should be noted that the current-blocking regions 1709 contain As.Thus, there occurs no substantial formation of hillocks and a smooth andflat surface is obtained for the layer 1709 and the layers grownthereon. Thereby, the problem of leakage current induced by hillocks iseffectively eliminated. Further, the problem of optical loss associatedwith the hillocks in the optical waveguide region is eliminated.

In the present invention, it should be noted that the GaInAsP etchingstopper 1708 has a lattice-matching composition in which the etchingstopper layer 1708 achieves lattice matching with the substrate. At thislattice-matching composition, the GaInAsP etching stopper layer 1708 hasa bandgap energy of about 2.0 eV, while this value of bandgap energyexceeds the photon energy of the laser oscillation radiation. Further,in view of the fact that the etching stopper layer 1708 achieves latticematching, there occurs no limitation with regard to the thickness of theetching stopper layer 1708, and a desirable large process margin can besecured for the etching process, by using a large thickness for theetching stopper layer 17.

By providing the etching stopper layer 1708, it becomes possible tocontinue the etching process to the active layer 1706 or the region inthe vicinity of the active layer 1706, without causing over-etching ofthe active layer 1706.

The laser diode of the present embodiment has an advantageous feature inthat the effect of non-optical recombination center such as surfacestate is minimized because of the excellent quality of the crystallayers constituting the laser diode and excellent efficiency of laseroscillation is realized. Further, device-to-device variation of thelaser characteristic is also minimized. It should be noted that thefirst cladding layer 1707 of AlGaInAsP is covered by the p-type GaAsPetching stopper layer 1708. Thus, the first cladding layer 1707 remainsintact even when the etching process is conducted. Thus, the surface ofthe first cladding layer 1707 is free from surface oxidation or damages,and the current-blocking layer 1709 is grown thereon with excellentquality.

Eleventh Embodiment

FIG. 20 shows the construction of a laser diode according to an eleventhembodiment of the present invention.

Referring to FIG. 20, the laser diode is constructed on a substrate 1802of n-type GaAs carrying thereon a composition-graded layer 1803 ofn-type GaAsP having a composition represented as GaAs_(y)P_(1-y),wherein the composition-graded layer 1803 is formed by an MOCVD processwhile changing the composition y continuously and gradually from 1 to0.4. The growth process of the composition-graded layer 1803 is wellestablished a smooth surface is realized by optimizing the compositiongradient.

Next, a buffer layer 1804 of n-type GaAsP having a composition ofGaAs_(0.6)P_(0.4) is grown on the composition-graded layer 1803, and acladding layer 1805 of n-type AlGaInAsP, an active layer 1806 of undopedGaInAsP, a first cladding layer 1807 of p-type AlGaInAsP, an etchingstopper layer 1808 of p-type GaInAsP, a current confinement layer 1809of n-type AlGaInAsP, and further an oxidation-prevention layer 1810 ofp-type GaInP, are grown consecutively on the buffer layer 1804 by anMOCVD process.

After the formation of the oxidation-prevention layer 1810, a resistfilm is deposited by a spin-coating process, followed by aphotolithographic process to form a stripe window in correspondence tothe region where injection of electric current is to be made, with awidth of 10 μm.

Next, the oxidation-prevention layer 1810 of GaInP and the underlyingcurrent-blocking layer 1809 of AlInAsP are patterned by a chemicaletching process while using the resist film thus formed as a mask,wherein the chemical etching process is conducted by using ahydrochloric acid etchant and is continued until the etching stopperlayer 1808 is exposed. As a result, a stripe groove is formed asrepresented in FIG. 20.

In the foregoing patterning process, the GaInP oxidation-preventionlayer 1810 and the AlInAsP current-blocking layer 1809 are patternedselectively with respect to the GaAsP etching stopper layer 1808 byusing a hydrochloric acid etchant, and a pair of current-blockingregions 1809 are formed from the current-blocking layer 1809.

Next, the resist mask is removed and a second cladding layer 1811 ofp-type AlGaInAsP, a spike-elimination layer 1812 of p-type GaInP, and acontact layer 1813 of p-type GaAsP are grown consecutively on thecurrent-blocking regions 1809 by a regrowth process so as to cover theetching stopper layer 1808 exposed at the stripe groove region.

Thereafter, the bottom surface of the substrate 1802 is polished and ann-type electrode 1801 is formed thereon by an evaporation depositionprocess. Further, a p-type electrode 1813 is deposited on the contactlayer 1812. The electrodes 1801 and 1813 are subjected to an annealingprocess to form an ohmic contact, and the optical cavity of the laserdiode is formed by cleaving the structure thus formed.

In the case of the laser diode of the illustrated example, the laserdiode oscillated with the fundamental lateral mode at the wavelength of630 nm.

It should be noted that the current-blocking regions 1809 contain As.Thus, there occurs no substantial formation of hillocks and a smooth andflat surface is obtained for the layer 1809 and the layers grownthereon. Thereby, the problem of leakage current induced by hillocks iseffectively eliminated. Further, the problem of optical loss associatedwith the hillocks in the optical waveguide region is eliminated.

In the present embodiment, it should further be noted that the surfaceoxidation of the AlInAsP current-blocking layer 1809 is eliminated bythe oxidation-prevention layer 1810, and the second cladding layer 1811is grown thereon with excellent quality. Thus, the laser diode of thepresent embodiment shows little aging and operates reliably over a longtime.

Twelfth Embodiment

FIG. 21 shows the construction of a laser diode according to a twelfthembodiment of the present invention.

Referring to FIG. 21, the laser diode is constructed on a substrate 1902of n-type GaAs carrying thereon a composition-graded layer 1903 ofn-type GaAsP having a composition represented as GaAs_(y)P_(1-y),wherein the composition-graded layer 1903 is formed by an MOCVD processwhile changing the composition y continuously and gradually from 1 to0.4. The growth process of the composition-graded layer 1903 is wellestablished a smooth surface is to realized by optimizing thecomposition gradient.

Next, a buffer layer 1904 of n-type GaAsP having a composition ofGaAs_(0.6)P_(0.4) is grown on the composition-graded layer 1903, and acladding layer 1905 of n-type AlGaInAsP, an optical waveguide layer 1906of undoped GaInP, an active layer 1907 of undoped GaInAsP, an opticalwaveguide layer 1908 of undoped GaInP, a first current-blocking layer1909 of p-type AlGaInAsP, a second current-blocking layer 1910 of n-typeAlGaInAsP, and an oxidation-prevention layer 1911 of p-type GaInP, aregrown consecutively on the buffer layer 1904 by an MOCVD process.

After the formation of the oxidation-prevention layer 1911, a resistfilm is deposited by a spin-coating process, followed byphotolithographic process to form a stripe window in correspondence tothe region where injection of electric current is to be made, with awidth of 10 μm.

Next, the oxidation-prevention layer 1911 of GaInP and the underlyingcurrent-blocking layers 1910 and 1909 of AlInAsP are patterned by achemical etching process while using the resist film thus formed as amask similarly to the previous embodiment, wherein the chemical etchingprocess is conducted until the optical waveguide layer 1908 is exposed.As a result, a stripe groove is formed as represented in FIG. 21.Thereby, the optical waveguide layer 1908 functions as an etchingstopper.

Next, the resist mask is removed and a second cladding layer 1912 ofp-type AlGaInAsP, a spike-elimination layer 1913 of p-type GaInP, and acontact layer 1914 of p-type GaAsP are grown consecutively on theoxidation-prevention layer 1911 by a regrowth process so as to cover theoptical waveguide layer 1908 exposed at the stripe groove region.

Thereafter, the bottom surface of the substrate 1902 is polished and ann-type electrode 1901 is formed thereon by an evaporation depositionprocess. Further, a p-type electrode 1915 is deposited on the contactlayer 1914. The electrodes 1901 and 1915 are subjected to an annealingprocess to form an ohmic contact, and the optical cavity of the laserdiode is formed by cleaving the structure thus formed.

In the case of the laser diode of the illustrated example, the laserdiode oscillated with the fundamental lateral mode at the wavelength of630 nm.

It should be noted that the current-blocking regions 1909 and 1910contain As. Thus, there occurs no substantial formation of hillocks anda smooth and flat surface is obtained for the layers 1909 and 1910 andthe layers grown thereon. Thereby, the problem of leakage currentinduced by hillocks is effectively eliminated. Further, the problem ofoptical loss associated with the hillocks in the optical waveguideregion is eliminated.

Further, in view of the fact that the layer adjacent to the active layeris free from Al, non optical recombination of carriers is suppressed andthe threshold current of laser oscillation is reduced. In view of thefact that the region of the laser diode where there is formed strongoptical radiation is free from Al, the number of surface states at thecavity edge surface is reduced and the optical damaging at the opticalcavity edge surface is minimized.

In the foregoing embodiments a description was made with regard to thelaser diode structure constructed on a graded GaAsP layer formed on aGaAs substrate. However, it is possible to construct the laser diode ona GaP substrate or GaAsP substrate. Further, a composition-graded layerof GaInP may be used in place of the GaAsP composition graded layer.Further, the composition-graded layer may be formed by a process otherthan a vapor phase epitaxial process.

Thirteenth Embodiment

FIG. 22 shows the construction a semiconductor light-emitting deviceaccording to a thirteenth embodiment of the present invention.

Referring to FIG. 22, the semiconductor light-emitting device isconstructed on a semiconductor substrate 2001 and includes an activelayer 2004 emitting optical radiation and semiconductor layers 2002 and2003 having a bandgap larger than a bandgap of the active layer and alattice constant intermediate between a lattice constant of GaP and alattice constant of GaAs, wherein the semiconductor layers 2002 and 2003are formed so as to vertically sandwich the active layer 2004.

In the semiconductor light-emitting device of FIG. 22, the semiconductorlayer 2003 includes, in a part thereon, a layer 2005 having acomposition represented as Al_(x)Ga_(y)In_(1-x-y)P_(t)As_(1-t) (0.8≦x≦1,0≦y≦0.2, 0≦t≦1), wherein a part of the layer 2005 is converted intooxidized regions 2007 as a result of selective oxidation.

In the semiconductor light-emitting device of FIG. 22, the foregoingoxidized regions 2007 become an insulator, and thus, the semiconductorlayer 2005 functions as a current-confinement structure. As the oxidizedregions 2007 have a reduced refractive index, there occurs a refractiveindex step between the unoxidized part of the semiconductor layer 2005and the oxidized regions 2007. As a result, there emerges areal-refractive index waveguide structure suitable for lateral modecontrol.

Further, the structure of FIG. 22 is suitable for increasing the outputpower in view of the fact that the waveguide structure in the vicinityof the active layer 2004 is formed of a material free from waveguideloss.

It should be noted that, in the prior art device, it has been necessaryto realize such a real-waveguide structure by using a buried structure,which requires a number of crystal growth processes. Contrary to theprior art, the structure of FIG. 22 can be formed by a single crystalgrowth process. Thereby, the semiconductor light-emitting device of thepresent embodiment can be formed easily with high yield of production.

Fourteenth Embodiment

FIG. 23 shows the construction of a semiconductor light-emitting deviceaccording to a fourteenth embodiment of the present invention, whereinthose parts corresponding to the parts described with reference to FIG.22 are designated by the same reference numerals and the descriptionthereof will be omitted.

Referring to FIG. 23, the semiconductor light-emitting device has astructure similar to that of the device of FIG. 22 except that theactive layer 2004 is formed of a single quantum well structure or amultiple quantum well structure and that the active layer 2004 isvertically sandwiched by a pair of optical waveguide layers 2024 and2025 having a composition represented as(Al_(z)Ga_(1-z))_(γ)In_(1-γ)P_(u)As_(1-u) (0≦z<1, 0.5<γ<1, 0<u≦1),wherein the active layer 2004 has a composition represented as(Al_(x1)Ga_(1-x1))_(α1)In_(1-α1)P_(t1)As_(1-t1) (0≦x₁<1, 0<α₁≦1, 0≦t₁≦1)when formed of a single quantum well. When the active layer 2004 isformed of a multiple quantum well structure, on the other hand, theactive layer 2004 is formed of alternate stacking of a quantum welllayer of the foregoing composition and a barrier layer of a compositionrepresented as (Al_(x2)Ga_(1-x2))_(α2)In_(1-α2)P_(t2)As_(1-t2) (0≦x₂<1,0.5<α₂≦1, 0≦t₂≦1). Further, each of the cladding layers 2002 and 2003has a composition represented as(Al_(y)Ga_(1-y))_(β)In_(1-β)P_(v)As_(1-v) (0<y≦1, 0.5<β<1, 0<v≦1),wherein the composition of the cladding layers 2002 and 2003 is set suchthat the cladding layers 2002 and 2003 have a bandgap larger than abandgap of the active layer 2004 and a lattice constant between GaP andGaAs. The composition of the optical waveguide layers 2024 and 2025 isset such that the optical waveguide layers 2024 and 2025 have a bandgaplarger than the bandgap of the active layer 2004 but smaller than thebandgap of the cladding layers 2002 and 2003.

In the construction of FIG. 23 or 24, it should be noted that thesemiconductor light-emitting device includes, in one of the claddinglayers 2002 and 2003 (layer 2003 in the example of FIG. 23), or betweenone of the cladding layers 2002 or 2003 (layer 2003 in the example ofFIG. 24) and the active layer 2004, a semiconductor layer 2005 having acomposition represented as Al_(x)Ga_(y)In_(1-x-y)P_(t)As_(1-t) (0.8≦x≦1,0≦y≦0.2, 0≦t≦1) is provided in such a manner that a part of the layer2005 is selectively oxidized to form oxidized regions 2007.

In the case of the device of FIG. 23, the active layer 2004, having thecomposition of (Al_(x1)Ga_(1-x1))_(α1)In_(1-α1)P_(t1)As_(1-t1) (0≦x₁<1,0<α₁≦1, 0≦t₁≦1), is capable of emitting visible wavelength radiation.Further, the cladding layers 2002 and 2003, having the lattice constantbetween GaP and GaAs and the composition represented as(Al_(y)Ga_(1-y))_(β)In_(1-β)P_(v)As_(1-v) (0<y≦1, 0.5<β<1, 0<v≦1), havea bandgap larger than the bandgap realized by a material formed on aGaAs substrate, and the device of FIG. 23 is suitable for producingshort wave optical radiation.

Further, in view of the fact that the optical waveguide layers 2024 and2025 of the composition (Al_(z)Ga_(1-z))_(γ)In_(1-γ)P_(u)As_(1-u)(0≦z<1, 0.5<γ<1, 0<u≦1) form an SCH structure together with the activelayer of the composition (Al_(x)Ga_(1-x))_(α)In_(1-α)P_(t)As_(1-t)(0≦x<1, 0<α≦1, 0≦t≦1), the device of FIG. 23 can realize a wide bandgapwith a reduced Al content for the optical waveguide layers 2024 and2025, and the electric current caused as a result of non-opticalrecombination or carriers or surface recombination of carriers isreduced. As a result, the efficiency of optical emission is improved. Inthe case the device is a laser diode, the problem of degradation of theoptical cavity edge is reduced and the laser diode becomes operableunder high-output power condition. In the construction of FIG. 23, it isalso possible to introduce strain into the cladding layer. Further, itis possible to reduce the bandgap of the cladding layers as comparedwith prior art devices.

It should be noted that a mixed crystal of GaInP increases the latticeconstant and decreases the bandgap with decreasing Ga content. Accordingto the estimation by Sandip, et al., Appl. Phys. Lett. 60, 1992, pp.630-362 with regard to the band discontinuity, the band discontinuityincreases primarily on the conduction band while there occurs nosubstantial change on the valence band. More specifically, the change ofband structure for the valence band is small even when the compositionof the GaInP mixed crystal is changed. Further, there is a tendency thatthe conduction band energy increases when Al is added to a GaInP mixedcrystal. At the same time, the valence band energy is decreased.Thereby, the magnitude of change of energy is much larger in the valenceband than in the conduction band energy. In relation to this situation,there has been a drawback in a conventional semiconductor light-emittingdevice constructed on a GaAs substrate in that, while there is formed alarge band discontinuity on the conduction band, the band discontinuityon the valence band is not sufficient for effective carrier confinement.

The device structure of FIG. 23 is advantageous with this regard in thata large band discontinuity is secured for the conduction band due to thedecrease of the Al content in the optical waveguide layers 2024 and2025. Thereby, the problem of electron overflowing, which has been amajor problem in red-wavelength laser diodes of the system of AlGaInP,is reduced substantially.

Further, as a result of formation of the insulating regions 2007, causedby the selective oxidation of the layer 2005 ofAl_(x)Ga_(y)In_(1-x-y)P_(t)As_(1-t) (0.8≦x≦1, 0≦y≦0.2, 0≦t≦1) containinga high concentration Al, there is formed a current-confinement structureby the insulating regions 2007 and the remaining part of the layer 2005having the composition of Al_(x)Ga_(y)In_(1-x-y)P_(t)As_(1-t) (0.8≦x≦1,0≦y≦0.2, 0≦t≦1). In view of the fact that the selectively oxidizedinsulating regions 2007 have a refractive index smaller than therefractive index of the remaining part of the layer 2005 of thecomposition Al_(x)Ga_(y)In_(1-x-y)P_(t)As_(1-t) (0.8≦x≦1, 0≦y≦0.2,0≦t≦1), there is a lateral diffraction index step formed incorrespondence to the remaining part of the layer 2005, and there isformed a refractive-index waveguide structure that can be used forcontrolling the lateral mode. It should be noted that the part of thedevice in the vicinity of the active layer 2004 and constituting thewaveguide structure is formed of a material free from waveguide loss.Thus, the device of the present embodiment is suitable for producing ahigh optical output power. Conventionally, such an optical waveguidestructure free from optical loss has to be formed by repeating a numberof crystal growth steps. In the case of the present invention, on theother hand, it is possible to form the desired waveguide structure in asingle crystal growth process.

In the semiconductor light-emitting device of FIG. 22 or FIG. 23, itshould be noted that the substrate 2001 is formed of GaAsP, and thesemiconductor layer 2005 of the composition represented asAl_(x)Ga_(y)In_(1-x-y)P_(t)As_(1-t) (0.8≦x≦1, 0≦y≦0.2, 0≦t≦1) achieveslattice matching with the substrate 2001. It should be noted that such aGaAsP substrate 2001 can be formed by growing a GaPAs graded layerhaving a lattice constant between GaP and GaAs on one of a GaAssubstrate or a GaP substrate by an epitaxial process such as a vaporphase epitaxial process with a large thickness such as 50 μm such thatthe GaPAs composition changes gradually in the graded layer. Bycontrolling the composition of the graded layer such that the latticeconstant at the top part of the graded layer becomes identical with thelattice constant of the heterojunction part (at least the cladding layer2002), it becomes possible to form a heteroepitaxial system withoutinducing the problem of lattice misfit.

There is a tendency that the oxidation rate of the semiconductor layer2005 of the composition Al_(x)Ga_(y)In_(1-x-y)P_(t)As_(1-t) (0.8≦x≦1,0≦y≦0.2, 0≦t≦1) becomes small when the thickness of the layer 2005 issmall. Associated therewith, there is a possibility that the insulatorregions 2007 may be too small for an effective current-blocking layer.In the present invention, in which the layer 2005 of the compositionAl_(x)Ga_(y)In_(1-x-y)P_(t)As_(1-t) (0.8≦x≦1, 0≦y≦0.2, 0≦t≦1) achieves alattice matching with the GaAsP substrate 2001, it becomes possible toform the layer 2005 with a sufficient thickness. Thereby, a sufficientoxidation rate is secured for the layer 2005 and the throughput ofdevice fabrication process can be increased.

In the device of FIG. 22 or FIG. 23, it is possible to use a GaAssubstrate for the substrate 2001. In this case, the active layer 2004 issandwiched by semiconductor layers that have a lattice matchingcomposition with GaAs.

In the case of using GaAs for the substrate 2001, it is possible to useAlAs for the layer 2005. In this case, however, there arises a problem,due to the fact that the AlAs layer accumulates a compressive strain ofabout 0.14%, that the active layer 2004 may be subjected to an adversaryeffect. By using the composition of Al_(x)Ga_(y)In_(1-x-y)P_(t)As_(1-t)(0.8≦x≦1, 0≦y≦0.2, 0≦t≦1) for the semiconductor layer 2005, it ispossible to achieve a lattice matching with the GaAs substrate and theeffect of strain is eliminated.

In the semiconductor light-emitting device of FIG. 22 or 23, the layer2005 of the foregoing composition Al_(x)Ga_(y)In_(1-x-y)P_(t)As_(1-t)(0.8≦x≦1, 0≦y≦0.2, 0≦t≦1) is left unoxidized for the region having awidth w1 as the current path of the device, wherein the width w1 is setsuch that a ratio of w1 with respect to a quantity defined as the sum ofthe width w1 and the total width, represented as w2, of the oxidizedregions 2007 (w1/(w1+w2)) is equal to or smaller than 0.6. When theforegoing ratio is larger than 0.6, the light-emission can be caused inthe region close to the edge of a ridge structure, provided that such aridge structure is formed in the device as represented by a broken linein FIG. 22 or 23. Thereby, there can occur a waveguide loss as a resultof fluctuation of the edge width. When the foregoing ratio w1/(w1+w2) issmaller, the effect of the edge width fluctuation is reduced and thedevice can operate with a larger optical output power.

Fifteenth Embodiment

FIG. 24 shows the construction of a semiconductor light-emitting deviceaccording to a fifteenth embodiment of the present invention, whereinthose parts corresponding to the parts described previously withreference to FIGS. 22 and 23 are designated by the same referencenumerals and the description thereof will be omitted.

Referring to FIG. 24, the semiconductor light-emitting device of thepresent embodiment has a construction similar to that of the device ofFIG. 22 or 23, except that there is formed a ridge structure 2009 havinga width d as a part of the cladding layer 2003 locating above thesemiconductor layer 2005 of the composition represented asAl_(x)Ga_(y)In_(1-x-y)P_(t)As_(1-t) (0.8≦x≦1, 0≦y≦0.2, 0≦t≦1). In theillustrated example, the width d of the ridge structure 2009 is setequal to or larger than 10 μm.

In the construction of FIG. 24, in view of the fact that there isprovided the selectively oxidized regions 2007 underneath the ridgestructure 9, the ridge structure 9 itself can be formed with anincreased with out deteriorating the current confinement taking place inthe device. Because of the increased size of the ridge structure 9, itis possible to form a electrode thereon with large contact area, withoutproviding a thermally insulating dielectric film. Thereby, thedifferential resistance of the device is minimized. Further, thestructure is suitable for employing a junction-down mounting structure.In this case, the heat of the device is easily dissipated to a mountingsubstrate on which the device of FIG. 24 is flip-chip mounted.

Sixteenth Embodiment

FIG. 25 shows the construction of a light emitting semiconductor deviceaccording to a sixteenth embodiment of the present invention, whereinthose parts corresponding to the parts described previously aredesignated by the same reference numerals and the description thereofwill be omitted.

Referring to FIG. 25, the light-emitting semiconductor device has aconstruction similar to the device of FIG. 24 except that there isprovided an etching stopper layer 2029 having a composition representedas Ga_(y)In_(1-y)P_(t)As_(1-t) (0<y≦1, 0≦t≦1) underneath thesemiconductor layer 2005 of the compositionAl_(x)Ga_(y)In_(1-x-y)P_(t)As_(1-t) (0.8≦x≦1, 0≦y≦0.2, 0≦t≦1). Byproviding the etching stopper layer 2029, it becomes possible to controlthe height of the ridge structure 2009 exactly. Thereby, the fabricationof the semiconductor device is substantially facilitated.

In any of the foregoing embodiments of FIGS. 22-25, the layer 2005 ofthe composition Al_(x)Ga_(y)In_(1-x-y)P_(t)As_(1-t) (0.8≦x≦1, 0≦y≦0.2,0≦t≦1) may actually have a composition of AlP_(t)As_(1-t) (0≦t≦1). Inthis case, Al is the only group III elements constituting the layer2005. In view of the increased oxidation rate of the AlGaInPAs system,which is extremely sensitive to the Al content therein, it becomespossible to reduce the time needed for fabricating the semiconductorlight-emitting device by using the AlPAs for the semiconductor layer2005. In the case other layers, such as the cladding layer, contain Alwith high concentration in view of the need of increasing the bandgap,such layer may also be oxidized together with the layer 2005 when the Alcontent in the layer 2005 is close to the Al content in such a widegaplayer. Thus, the use of the AlP_(t)As_(1-t) (0≦t≦1) composition isadvantageous for forming a current-blocking structure by way ofselective oxidation.

Sixteenth Embodiment

FIG. 26 shows the construction of a semiconductor light-emitting deviceaccording to a seventeenth embodiment of the present invention.

Referring to FIG. 26, the semiconductor light-emitting device has astructure similar to that of the device of FIG. 23 or FIG. 24 in thatthe active layer 2004 is vertically sandwiched by the cladding layers2002 and 2003.

In the structure of FIG. 26, it should be noted that a part of thecladding layer 2003 includes a layer 2015 of AlGaInAs having acomposition represented as Al_(x)Ga_(y)In_(1-x-y)As (0.8≦x≦1, 0≦y≦0.2),and a part of the layer 2015 is oxidized selectively to form a pair ofinsulator regions 2017, such that the insulator regions 2017 laterallysandwich an unoxidized region of the layer 2015 therebetween with thewidth of w1. Thereby, the width w1 is set such that the ratio w1/(w1+w2)is equal to or smaller than 0.6.

In the present embodiment, too, it should be noted that the materials inthe vicinity of the active layer 2004 are free from optical absorptionwith regard to the wavelength of the optical radiation produced as aresult of laser oscillation, and the semiconductor light-emitting devicecan be produce a large output optical power.

Similarly to the embodiment of FIG. 22 or 23, there arises the problemof optical waveguide loss in the structure of FIG. 26 when the foregoingratio w1/(w1+w2) is larger than 0.6 due to the fluctuation of edge widthof the ridge structure, provided that a ridge structure is formed on thecladding layer 2003 as represented by a broken line in FIG. 26. Bysetting the ratio w1/(w1+w2) to be equal to or smaller than 0.6, theforgoing problem of optical waveguide loss is successfully eliminated.

Eighteenth Embodiment

FIG. 27 shows the construction of a semiconductor light-emitting deviceaccording to an to eighteenth embodiment of the present invention,wherein those parts corresponding to the parts described previously aredesignated by the same reference numerals and the description thereofwill be omitted.

Referring to FIG. 27, the semiconductor light-emitting device has astructure similar to the device of FIG. 24 in that the ridge structure2009 is formed on the structure of FIG. 26. Thereby, the ridge structure2009 is formed so as to cover the semiconductor layer 2015 including theinsulator regions 2017 with a width d set such that the width d exceeds10 μm.

In the present embodiment in which the semiconductor layer 2015 is freefrom P, an effective current confinement is achieved. Thus, it becomespossible to increase the width d of the ridge structure 2009 and a largecontact area is secured for the electrode provided on the ridgestructure 2009. Further, in view of the fact that use of insulating filmis not necessary in the device of the present embodiment, thedifferential resistance of the device is reduced. In view of theincreased electrode area, the structure of FIG. 27 is suitable forflip-chip mounting on a support substrate, wherein such a flip-chipmounting is advantageous due improved efficiency of heat dissipation.

Nineteenth Embodiment

FIG. 28 shows the construction of a semiconductor light-emitting deviceaccording to a nineteenth embodiment of the present invention, whereinthe device of FIG. 28 is actually a laser diode having an SCH-QWstructure.

Referring to FIG. 28, the laser diode is constructed on a GaAsoffset-substrate 2111 having an inclined principal surface inclined fromthe (100) surface in the [110] direction with an offset angle of 2°.

On the substrate 2111, there is formed a composition-graded layer 2112of n-type GaPAs by a vapor phase epitaxial process such that the Pcontent increases gradually from 0 to 0.4. Thus, the GaPAscomposition-graded layer 2112 has a composition of GaP_(0.4)As_(0.6) onthe top part thereof. On the composition-graded layer 2112, a GaPAslayer 2113 having the foregoing composition of GaP_(0.4)As_(0.6) isformed such that the total thickness of the layers 2112 and 2113 becomesabout 50 μm. The layers 2112 and 2113 form, together with the GaAssubstrate 2111, a GaPAs epitaxial substrate 2101. Alternatively a GaPsubstrate may be used in place of the GaAs substrate 2111. Generally, aGaPAs substrate includes an epitaxial layer of GaPAs on a GaAs or GaPsubstrate with a thickness of 30 μm or more. At the surface of the GaPAslayer, the lattice misfit is sufficiently relaxed, and thus, thesubstrate 2101 formed of the GaAs substrate 2111 and the GaPAs layers2112 and 2113 can be regarded as a single GaPAs ternary substrate.

On the GaPAs substrate 2101, a cladding layer 2102 of n-type AlGaInPAshaving a composition represented as(Al_(y)Ga_(1-y))_(β)In_(1-β)P_(v)As_(1-v) (y=0.5, β=0.8, v=0.85) isformed by an MOCVD process with a thickness of 1 μm, wherein thecladding layer contains As and has the composition set so as to achievelattice matching with the GaP_(0.4)As_(0.6) substrate 2101.

On the cladding layer 2102, there is formed an optical waveguide layer2114 of p-type AlGaInPAs having a composition represented as(Al_(z)Ga_(1-z))_(γ)In_(1-γ)P_(u)As_(1-u) (z=0.1, γ=0.7, u=1) by anMOCVD process with a thickness of 0.1 μm, and a single quantum-wellactive layer 2104 of AlGaInPAs is formed on the optical waveguide layer2114 with a thickness of 25 nm by an MOCVD process with a compositionrepresented as (Al_(x)Ga_(1-x))_(α)In_(1-α)P_(t)As_(1-t) (x=0, α=0.65,t=0.9), wherein the composition of the active layer 2104 is selected soas to accumulate a compressive strain therein.

Further, an optical waveguide layer 2115 of p-type AlGaInPAs having acomposition represented as (Al_(z)Ga_(1-z))_(γ)In_(1-γ)P_(u)As_(1-u)(z=0.1, γ=0.7, u=1) is formed on the active layer 2104 by an MOCVDprocess with a thickness of 0.1 μm, and a first p-type cladding layer2103 of p-type AlGaInPAs is formed on the optical waveguide layer by anMOCVD process with a thickness of 0.1 μm and a composition representedas (Al_(y)Ga_(1-y))_(γ)In_(1-β)P_(v)As_(1-v) (y=0.5, β=0.8, v=0.85).

On the first p-type cladding layer 2103, there is formed a layer 2105 ofp-type AlGaInPAs layer by an MOCVD process with a thickness of 50 nmsuch that the layer 2105 has a composition represented asAl_(x)Ga_(y)In_(1-x-y)P_(t)As_(1-t) (x=1, y=0, t=0.4), wherein thiscomposition is actually represented as AlP_(0.4) As_(0.6).

Further, a second p-type cladding layer 2106 is formed on the AlPAslayer 2105 by an MOCVD process with a thickness of about 0.9 μm, whereinthe p-type cladding layer 2106 has a composition represented as(Al_(y)Ga_(1-y))_(β)In_(1-β)P_(v)As_(1-v) (y=0.5, β=0.8, v=0.85).Further, a buffer layer 2116 of p-type GaInP having a compositionrepresented as Ga0.7In0.3P and a contact layer 2117 of p-type GaPAshaving a composition represented as GaP_(0.4)As_(0.6) are grownconsecutively on the second p-type cladding layer 2106 with respectivethicknesses of 0.1 μm and 0.2 nm.

In the foregoing layered structure, it should be noted that the layers2102, 2103, 2114, 2115 and 2105 have respective compositions chosen soas to achieve a lattice matching with the GaPAs substrate 2101. Duringthe MOCVD process for forming the layered structure, TMG, TMI, TMA, AsH₃and PH₃ may be used for the gaseous source together with a carrier gasof H₂.

After the formation of the layered structure, a photolithographicpatterning process is applied so as to remove a part of the layeredstructure in correspondence to a stripe region, until the AlPAs layer2105 of the composition AlP_(0.4)As_(0.6) is removed and the underlyingcladding layer 2103 is exposed. As a result of the photolithographicpatterning process, there is formed a ridge stripe structure 2109 suchthat the ridge stripe structure 2109 extends in an axial direction ofthe laser diode.

After formation of the ridge stripe to structure 2109, the half-productof the laser diode thus obtained is subjected to an oxidation processconducted in a water vapor atmosphere at 450° C., and there are formedoxidized regions 2107 such that each of the oxidized regions 2107penetrates into the ridge structure 2109 from a lateral side of theridge stripe structure 2109 with a depth of 1.5 μm. Thereby, thereremains a central, non-oxidized region of the layer 2105 with a width ofabout 3 μm, wherein the unoxidized region form a current-confinementstructure together with the oxidized regions 2107 acting as acurrent-blocking region. As a result of formation of thecurrent-blocking structure in the layer 2105, a light-emission takesplace in correspondence to the region right underneath the unoxidizedregion of the AlPAs layer 2105. In the foregoing construction, it shouldbe noted that the ratio of the unoxidized region of the layer 2105 tothe width of the ridge stripe structure is about 0.5.

After forming the oxidized regions 2107 by the selective oxidizingprocess, an SiO₂ film 2118 is deposited so as to cover the ridgestructure, and a window is formed in correspondence to the ridge topsurface. Further, a p-type electrode 2119 is deposited on the SiO₂ film2118 in contact with the contact layer 2117 at the contact window.

The GaAs substrate 2111 is then subjected to a polishing process at thebottom surface thereof such that the thickness of the substrate 2111becomes 100 μm, and an n-type electrode 120 is deposited on the polishedbottom surface of the GaAs substrate 2111.

According to the present embodiment, a laser diode oscillating at thewavelength of 660 nm is obtained.

As a result of the selective oxidation of the AlGaInPAs layer 2105containing Al with high concentration, a part of the layer 2105 isconverted into insulator in correspondence to the regions 2107, and theoxidized regions 2107 form the desired current-confinement structuretogether with the central unoxidized region of the AlGaInPAs layer 2105.

In view of the fact that the oxidized regions 2107 of the AlGaInPAslayer 2105, having a composition generally represented asAl_(x)Ga_(y)In_(1-x-y)P_(t)As_(1-t) (0.8≦x≦1, 0≦y≦0.2, 0≦t≦1), has arefractive index smaller than a refractive index of the layer 2105itself, there is formed a refractive index profile in the layer 2105 andthe refractive index profile forms a real-refractive index waveguidestructure effective for lateral mode control. For example, it ispossible to control the lateral mode of laser oscillation by optimizingthe distance between the active layer 2104 and the layer 2105 ofAlGaInPAs of the foregoing general composition ofAl_(x)Ga_(y)In_(1-x-y)P_(t)As_(1-t) (0.8≦x≦1, 0≦y≦0.2, 0≦t≦1).

In view of the fact that the laser diode uses a material free fromoptical absorption in the wavelength range corresponding to theoscillation wavelength of the laser diode, for the part in the vicinityof the active layer 2104. Thereby, the laser diode can produce a largeoptical output power.

In the fabrication process of the laser diode of FIG. 28, it should benoted only a single regrowth process is necessary for forming thedesired current-confinement structure including the ridge stripestructure. In conventional laser diodes having a buried heterostructure,formation such a current-confinement structure requires a number ofregrowth process steps. Thus, the fabrication process of the laser diodeis simplified in the present embodiment and the fabrication of the laserdiode is facilitated. Associated with this, the yield of production ofthe laser diode is improved.

In the construction of FIG. 28, it should be noted that the off-angle ofthe GaP_(0.4)As_(0.6) substrate 101 is small. As noted previously, theoff-angle of only 2° is used in the construction of FIG. 28. Thereby,the present embodiment successfully avoids the problem of hillockformation, which is frequently observed in an AlGaInP layer grown by anMOCVD process on a substrate such as GaP, GaAs or GaP_(0.4) As_(0.6),for the case in which the substrate has a small off-angle. It should benoted that this tendency of hillock formation becomes conspicuous whenthe Al content is increased. In the case of the laser diode having astructure as shown in FIG. 28, the effect of the hillock formation onthe device performance can become serious in view of the use of largethickness for the cladding layers.

In the present embodiment, the problem of hillock formation issuccessfully avoided by introducing As into the layer of AlGaInP. Byincorporating As, the droplet formation of Al or Ga during the MOCVDprocess of the AlGaInP layer is suppressed. Thereby, the hillockformation is successfully suppressed even in such a case the off-angleof the substrate 2101 is set small.

The laser diode of FIG. 28 has another advantageous feature in that Alcontent can be reduced as compared with a conventional material formedon a GaAs substrate while maintaining the same bandgap. For example, theAl content in the optical waveguide layers 2114 and 2115 is reduced ascompared with a conventional optical waveguide layer, and the currentassociated with non-optical recombination of carriers is reduced.Thereby, the efficiency of light-emission is improved. Further, in viewof the fact that the surface recombination current is also reduced andthe degradation of optical cavity edge surface is reduced at the sametime, the output power of the laser diode can be increased as comparedwith a conventional laser diode. Thus, the laser diode of the presentembodiment can be used for a high-power red-wavelength laser diode undera high temperature environment.

In the laser diode of FIG. 28, it should be noted that the active layer2004 of the single quantum well structure can be replaced with amultiple quantum well structure. In this case, the quantum well layerrepeated alternately together with a barrier layer having a compositionrepresented as (Al_(x2)Ga_(1-x2))_(α2)In_(1-α2)P_(t2)As_(1-t2) (0≦x₂<1,0.5<α₂<1, 0≦t₂≦1). It should be noted that the optical waveguide layers2114 and 2115 may contain As.

In the present embodiment, it should be noted that the to-be-oxidizedlayer 2105 of p-type Al_(x)Ga_(y)In_(1-x-y)P_(t)As_(1-t) (x=1, y=0 andt=0.4) may be replaced with a p-type AlAs layer. In this case, thecompositional parameters y and t are set to zero (y=t=0) while thecompositional parameter x is set to one (x=1). When this composition isused, the layer 2105 accumulates a compressive strain of about 1.4%.Thus, there is a limitation in the thickness of the layer 2105 and thelayer 2105 is formed to have a thickness of about 20 nm. It was foundthat the oxidation rate of an AlAs layer is larger than the oxidationrate of an AlPAs layer of the same thickness but contains P. The growthof a binary mixed crystal layer of AlAs is much easier than growing aternary mixed crystal layer of AlPAs.

Twentieth Embodiment

FIG. 29 shows the construction of a semiconductor optical deviceaccording to a twentieth embodiment of the present invention, whereinthe device of FIG. 29 is actually a laser diode having an SCH-MQWstructure.

Referring to FIG. 29, the laser diode is constructed on a GaAsoffset-substrate 2131 having an inclined principal surface inclined fromthe (100) surface in the [110] direction with an offset angle of 2°

On the substrate 2131, there is formed a composition-graded layer 2132of n-type GaPAs by a vapor phase epitaxial process such that the Pcontent increases gradually from 0 to 0.4. Thus, the GaPAscomposition-graded layer 2132 has a composition of GaP_(0.4)As_(0.6) onthe top part thereof. On the composition-graded layer 2132, a GaPAslayer 2133 having the foregoing composition of GaP_(0.4)As_(0.6) isformed such that the total thickness of the layers 2132 and 2133 becomesabout 90 μm. The GaPAs layers 2132 and 2133 form a GaPAs substrate 2121together with the GaAs substrate 2131.

On the GaPAs substrate 2121, a cladding layer 2122 of n-type AlGaInPAshaving a composition represented as(Al_(y)Ga_(1-y))_(β)In_(1-β)P_(v)As_(1-v) (y=0.5, β=0.8, v=0.85) isformed by an MOCVD process with a thickness of 1 μm, wherein thecladding layer contains As and has the composition set so as to achievelattice matching with the GaP_(0.4)As_(0.6) substrate 2121.

On the cladding layer 2122, there is formed an optical waveguide layer2134 of p-type AlGaInPAs having a composition represented as(Al_(z)Ga_(1-z))_(γ)In_(1-γ)P_(u)As_(1-u) (z=0, γ=0.7, u=1) by an MOCVDprocess with a thickness of 0.1 μm, and a quantum-well layer ofAlGaInPAs having thickness of about 10 nm and a composition representedas (Al_(x)Ga_(1-x))_(α)In_(1-α)P_(t)As_(1-t) (x=0, α=0.65, t=0.9) and abarrier layer of AlGaInPAs having a thickness of 10 nm and a compositionrepresented as (Al_(z)Ga_(1-z))_(γ)In_(1-γ)P_(u)As_(1-u) (z=0, γ=0.7,u=1) are repeated alternately on the optical waveguide layer 2134 toform an active layer 2124 of a multiple quantum well structure, whereinthe composition of the quantum well layer is selected so as toaccumulate a compressive strain therein.

Further, an optical waveguide layer 2135 of p-type AlGaInPAs having acomposition represented as (Al_(z)Ga_(1-z))_(γ)In_(1-γ)P_(u)As_(1-u)(z=0.1, γ=0.7, u=1) is formed on the active layer 2124 with a thicknessof 0.1 μm, and a first p-type cladding layer 2123 of p-type AlGaInPAs isformed on the optical waveguide layer 2135 with a thickness of 0.1 μmand a composition represented as(Al_(y)Ga_(1-y))_(β)In_(1-β)P_(v)As_(1-v) (y=0.5, β=0.8, v=0.85).

On the first p-type cladding layer 2123, there is formed a layer 2125 ofp-type AlGaInPAs layer with a thickness of 50 nm such that the layer2125 has a composition represented asAl_(x)Ga_(y)In_(1-x-y)P_(t)As_(1-t) (x=1, y=0, t=0.4), wherein thiscomposition is actually represented as AlP_(0.4)As_(0.6).

Further, a second p-type cladding layer 2126 is formed on the AlPAslayer 2125 with a thickness of about 0.9 μm, wherein the p-type claddinglayer 2126 has a composition represented as(Al_(y)Ga_(1-y))_(β)In_(1-β)P_(v)As_(1-v) (y=0.5, β=0.8, v=0.85).Further, a buffer layer 2136 of p-type GaInP having a compositionrepresented as Ga_(0.7)In_(0.3)P and a contact layer 2137 of p-typeGaPAs having a composition represented as GaP_(0.4)As_(0.6) are grownconsecutively on the second p-type cladding layer 2126 with respectivethicknesses of 0.1 μm and 0.2 nm.

In the foregoing layered structure, it should be noted that the claddinglayers 2122, 2123 and 2126, the optical waveguide layers 2134 and 2135,and the layer 2125 achieve a lattice matching with the GaPAs substrate2121.

Next, the layered structure thus obtained is subjected to aphotolithographic patterning process to form a central ridge stripestructure, wherein the ridge stripe structure used in the embodiment ofFIG. 29 has an increased width of 50 μm as compared with the previousembodiment of FIG. 28. Thereby, the etching process is continued untilthe cladding layer 2123 underneath the layer 2125 is exposed. Further,an oxidation process is conducted in a water vapor atmosphere at thetemperature of 450° C. to cause an oxidation in the AlP_(0.4)As_(0.6)layer 2125. Thereby, the oxidation starts at the exposed edge of thelayer 2125 and proceeds to the interior of the ridge stripe structurealong the layer 2125, and a pair of oxidized regions 2127 are formed asa result such that each oxidized region 2127 extends into the interiorof the ridge stripe structure from a side wall thereof along the layer2125 with a distance of about 22.5 μm. Thereby, a region of unoxidizedAlPAs layer 2125 is left at the center of the two oxidized regions 2127with a width of 5 μm, wherein this unoxidized region provides thecurrent path of the drive current. On the other hand, the oxidizedregions 2127 function as a current-blocking regions and there is formeda current-confinement structure in the ridge stripe structure by theunoxidized part of the AlPAs layer 2125 and the oxidized regions 2127.In correspondence to the injection of the drive current via theunoxidized part of the layer 2125, there occurs a light emission rightunderneath the unoxidized part of the layer 2125. In the presentembodiment, the ratio of the width of the unoxidized part to the entirewidth of the ridge stripe structure is about 0.1.

After formation of the ridge stripe structure, the lateral sides of theridge stripe structure are filled with a polyimide as represented byregions 2128 and a p-type electrode 2138 is formed on the top part ofsuch a planarized structure in contact with the contact layer 2137.Further, the bottom surface of the GaAs substrate 2131 is polished to athickness of 100 μm, and an n-type electrode 2139 is formed on such apolished bottom surface.

According to the construction of FIG. 29, a laser diode oscillating atthe wavelength of 650 nm is obtained.

As a result of the selective oxidation of the AlGaInPAs layer 2125containing Al with high concentration, a part of the layer 2125 isconverted into insulator in correspondence to the regions 2127, and theoxidized regions 2127 form the desired current-confinement structuretogether with the central unoxidized region of the AlGaInPAs layer 2125.

In view of the fact that the oxidized regions 2127 of the AlGaInPAslayer 2125, having a composition generally represented asAl_(x)Ga_(y)In_(1-x-y)P_(t)As_(1-t) (0.8≦x≦1, 0≦y≦0.2, 0≦t≦1), has arefractive index smaller than a refractive index of the layer 2125itself, there is formed a refractive index profile in the layer 2125 andthe refractive index profile forms a real-refractive index waveguidestructure effective for lateral mode control. For example, it ispossible to control the lateral mode of laser oscillation by optimizingthe distance between the active layer 2124 and the layer 2125 ofAlGaInPAs of the foregoing general composition ofAl_(x)Ga_(y)In_(1-x-y)P_(t)As_(1-t) (0.8≦x≦1, 0≦y≦0.2, 0≦t≦1).

As the waveguide structure is formed inside the ridge stripe with asufficient distance from the side wall of the ridge stripe structure,the laser diode of the present embodiment successfully minimizes thewaveguide loss associated with the fluctuation of the edge width.

In the fabrication process of the laser diode of FIG. 29, it should benoted only a single regrowth process is necessary for forming thedesired current-confinement structure including the ridge stripestructure. In conventional laser diodes having a buried heterostructure,formation such a current-confinement structure requires a number ofregrowth process steps. Thus, the fabrication process of the laser diodeis simplified in the present embodiment and the fabrication of the laserdiode is facilitated. Associated with this, the yield of production ofthe laser diode is improved.

Further, in view of the fact that the laser diode of FIG. 29 uses a wideridge stripe structure having a width of 50 μm, and thus, a wide contactarea is secured on the ridge stripe structure, it is possible todissipate heat efficiently via the contact area. Thereby, thedifferential resistance of the laser diode device is minimized.

Further, it should be noted that the optical waveguide layers 2314 and2135 and the active layer 2124 are free from Al in the laser diode ofthe present embodiment. Referring back to FIG. 6 showing therelationship between the bandgap and the lattice constant for thecomposition of (Al_(0.5)Ga_(0.5))_(0.5)In_(0.5)P, which is widely usedin a visible laser diode of the AlGaInP system constructed on a GaAssubstrate, it can be seen that the same bandgap is realized by aGa_(0.7)In_(0.3)P composition that achieves a lattice matching with theGaP_(0.4)As_(0.6) substrate 2101. Thus, the present inventionsuccessfully uses the Ga_(0.7)In_(0.3)P composition for the opticalwaveguide layers 2134 and 2135 and minimizes the non-opticalrecombination of carriers, which is caused in relation to the existenceof Al. Thereby, the laser diode of the present embodiment can produce alarge output power. The present embodiment provides a red-wavelengthlaser diode operable under high temperature environment with a largeoutput optical power.

Twenty-First Embodiment

FIG. 30 shows the construction of a semiconductor optical deviceaccording to a twenty-first embodiment of the present invention, whereinthose parts corresponding to the parts described previously aredesignated by the same reference numerals and the description thereofwill be omitted.

Referring to FIG. 30, the optical semiconductor device is a laser diodeand has a structure similar to that described with reference to FIG. 29,except that an etching stopper layer 2129 of GaInPAs having acomposition represented as Ga_(y)In_(1-y)P_(t)As_(1-t) (0<y≦1, 0≦t≦1) isinterposed between the to-be-oxidized layer 2125 and the substrate 2121.In fact, the etching stopper layer 2129 is provided right underneath theto-be-oxidized layer 2125. It should be noted that a III-V materialhaving a high Al concentration or P concentration can be etchedeffectively by a hydrochloric acid etchant, while a material containingAs with high concentration resists against the etching process. Thus,the layer 2129 of the composition Ga_(y)In_(1-y)P_(t)As_(1-t) (0<y≦1,0≦t≦1) can be used as an etching stopper.

With the use of the etching stopper layer 2129, the etching process forforming the ridge stripe structure is controlled easily, and the yieldof production of the laser diode is improved. Otherwise, the laser diodeof the present embodiment is similar to the laser diode described withreference to FIG. 30.

Twenty-Second Embodiment

FIG. 31 shows the construction of a laser diode according to atwenty-second embodiment of the present invention.

Referring to FIG. 31, the laser diode is constructed on a GaAsoffset-substrate 2141 having an inclined principal surface inclined fromthe (100) surface in the [110] direction with an offset angle of 15°.

On the GaPAs substrate 2141, a cladding layer 2142 of n-type AlGaInPAshaving a composition represented as (Al_(y)Ga_(1-y))_(β)In_(1-β)P(y=0.5, β=0.8) is formed by an MOCVD process with a thickness of 1 μm,and an optical waveguide layer 2154 of AlGaInPAs having a compositionrepresented as (Al_(z)Ga_(1-z))_(γ)In_(1-γ)P (z=0.5, γ=0.7) is formed onthe cladding layer 2142 by an MOCVD process with a thickness of 0.1 μm.Further, a quantum-well layer of AlGaInPAs having a thickness of about10 nm is formed on the optical waveguide layer 2154 with a compositionrepresented as (Al_(x)Ga_(1-x))_(α)In_(1-α)P (x=0, α=0.65), wherein thecomposition of the quantum well layer is selected so as to accumulate acompressive strain therein.

Further, an optical waveguide layer 2155 of p-type AlGaInPAs having acomposition represented as (Al_(z)Ga_(1-z))_(γ)In_(1-γ)P (z=0.1, γ=0.7)is formed on the active layer 2124 with a thickness of 0.1 μm, and afirst p-type cladding layer 2143 of p-type AlGaInPAs is formed on theoptical waveguide layer 2155 with a thickness of 0.1 μm and acomposition represented as (Al_(y)Ga_(1-y))_(β)In_(1-β)P (y=0.7, β=0.5).

On the first p-type cladding layer 2143, there is formed a layer 2145 ofp-type AlGaInPAs layer with a thickness of 50 nm such that the layer2145 has a composition represented asAl_(x)Ga_(y)In_(1-x-y)P_(t)As_(1-t) (x=1, y=0, t=0.037), wherein thiscomposition is actually represented as AlP_(0.037)As_(0.963).

Further, a second p-type cladding layer 2146 is formed on the AlPAslayer 2145 with a thickness of about 0.9 μm, wherein the p-type claddinglayer 2146 has a composition represented as(Al_(y)Ga_(1-y))_(β)In_(1-β)P (y=0.7, β=0.5). Further, a buffer layer2146 of p-type GaInP having a composition represented asGa_(0.5)In_(0.5)P and a contact layer 2157 of p-type GaAs are grownconsecutively on the second p-type cladding layer 2146 with respectivethicknesses of 0.1 μm and 0.2 nm.

In the foregoing layered structure, it should be noted that the claddinglayers 2142, 2143 and 2146, the optical waveguide layers 2154 and 2155,and the layer 2145 achieve a lattice matching with the GaAs substrate2141.

Next, the layered structure thus obtained is subjected to aphotolithographic patterning process to form a central ridge stripestructure, wherein the ridge stripe structure used in the embodiment ofFIG. 31 has a width of 50 μm. Thereby, the etching process of thephotolithographic patterning process is continued until the claddinglayer 2143 underneath the layer 2145 is exposed. Further, an oxidationprocess is conducted in a water vapor atmosphere at the temperature of450° C. to cause an oxidation in the AlP_(0.037)As_(0.963) layer 2145.Thereby, the oxidation starts at the exposed edge of the layer 2145 andproceeds to the interior of the ridge stripe structure along the layer2145, and a pair of oxidized regions 2147 are formed as a result suchthat each oxidized region 2147 extends into the interior of the ridgestripe structure from a side wall thereof along the layer 2145 with adistance of about 22.5 μm. Thereby, a region of unoxidized AlPAs layer2145 is left at the center of the two oxidized regions 2147 with a widthof 5 μm, wherein this unoxidized region provides the current path of thedrive current. On the other hand, the oxidized regions 2147 function asa current-blocking regions and there is formed a current-confinementstructure in the ridge stripe structure by the unoxidized part of theAlPAs layer 2145 and the oxidized regions 2147. In correspondence to theinjection of the drive current via the unoxidized part of the layer2145, there occurs a light emission right underneath the unoxidized partof the layer 2145. In the present embodiment, the ratio of the width ofthe unoxidized part to the entire width of the ridge stripe structure isabout 0.1.

After formation of the ridge stripe structure, the lateral sides of theridge stripe structure are filled with a polyimide as represented byregions 2148 and a p-type electrode 2158 is formed on the top part ofsuch a planarized structure in contact with the contact layer 2157.Further, the bottom surface of the GaAs substrate 2141 is polished to athickness of 100 μm, and an n-type electrode 2159 is formed on such apolished bottom surface.

In the embodiment of FIG. 31, too, a similar advantageous effect as thedevice describe previously is obtained. In the device of the presentembodiment constructed on the GaAs substrate 2141, an adversary effectis expected when an AlAs layer is used for the to-be-oxidized layer 2145due to the lattice misfit of as much as about 0.14%. The presentembodiment successfully avoids such an adversary effect by using anAlGaInPAs layer containing P with the composition represented asAl_(x)Ga_(y)In_(1-x-y)P_(t)As_(1-t) (0.8≦x≦1, 0<t≦1) for the layer 2145.By incorporating P into the layer 2145, it becomes possible to achieve alattice matching with the GaAs substrate 2141 and the adversary effectassociated with the strain in the layer 2145 is eliminated.

Twenty-Third Embodiment

FIG. 32 shows the construction of a semiconductor light-emitting deviceaccording to a twenty-third embodiment of the present invention, whereinthose parts corresponding to the parts described previously aredesignated by the same reference numerals and the description thereofwill be omitted.

Referring to FIG. 32, the laser diode has a construction similar to thatof the laser diode of FIG. 31 except that an AlAs layer 2165 of p-typeis provided in place of the AlGaInPAs layer 2145.

As a result of the selective oxidation of the AlAs layer 2165 containingAl with high concentration, a part of the layer 2165 is converted intoinsulator in correspondence to regions 2167, and the oxidized regions2167 form the desired current-confinement structure together with thecentral unoxidized region of the AlAs layer 2165.

In view of the fact that the oxidized regions 2167 of the AlAs layer2165 has a refractive index smaller than a refractive index of the layer2165 itself, there is formed a refractive index profile in the layer2165 and the refractive index profile forms a real-refractive indexwaveguide structure effective for lateral mode control. For example, itis possible to control the lateral mode of laser oscillation byoptimizing the distance between the active layer 2144 and the layer 2165of AlAs.

As the waveguide structure is formed inside the ridge stripe with asufficient distance from the side wall of the ridge stripe structure,the laser diode of the present embodiment successfully minimizes thewaveguide loss associated with the fluctuation of the edge width.

In the fabrication process of the laser diode of FIG. 32, it should benoted only a single regrowth process is necessary for forming thedesired current-confinement structure including the ridge stripestructure. In conventional laser diodes having a buried heterostructure,formation such a current-confinement structure requires a number ofregrowth process steps. Thus, the fabrication process of the laser diodeis simplified in the present embodiment and the fabrication of the laserdiode is facilitated. Associated with this, the yield of production ofthe laser diode is improved.

Further, in view of the fact that the laser diode of FIG. 32 uses a wideridge stripe structure having a width of 50 μm, and thus, a wide contactarea is secured on the ridge stripe structure, it is possible todissipate heat efficiently via the contact area. Thereby, thedifferential resistance of the laser diode device is minimized.

Thus, the present embodiment enables a semiconductor light-emittingdevice having a current-confinement structure and capable of lateralmode control by a simple fabrication process.

While the description has been provided so far with reference to a laserdiode, the semiconductor light-emitting device of FIGS. 22-32 may alsobe a light-emitting diode (LED). According to the present invention, avisible LED of high-luminosity and having an excellent temperaturecharacteristic can be obtained.

Twenty-Fourth Embodiment

FIG. 33 shows a construction of the layer 2125 used in a laser diodeaccording to a twenty-fourth embodiment of the present invention.

Referring to FIG. 33, the laser diode of the present embodiment has aconstruction described already with reference to FIG. 29 or FIG. 30,except that the layer 2125 is formed of an alternate stacking of an AlAslayer having a thickness of 5 nm and a layer having a lattice constantbetween GaP and GaAs. In the illustrated example, the latter layer is anAlPAs layer having a composition of AlP_(0.4)As_(0.6) and a thickness of1 nm, wherein the AlP_(0.4)As_(0.6) achieves a lattice matching with theGaP_(0.4)As_(0.6) substrate 2121. By repeating the AlAs layer and theAlP_(0.4)As_(0.6) layer (four times in the illustrated example), thereis formed a superlattice structure in the layer 2125. While the AlAslayer has a lattice strain of about 1.4% with respect to theAlP_(0.4)As_(0.6) substrate 2111, the AlAs layer can be grown on thesubstrate 2111 without lattice relaxation due to the small thickness (5nm).

With increasing thickness of the layer 2125, the oxidation rate of thelayer 2125 increases. Further, the oxidation rate increases withincreasing Al content. Thereby, the lateral extent of the oxidizedregion 2127 is represented as being proportional to the square root ofthe duration of the oxidation process. Further, it turned out that theoxidation proceeds faster in the mixed crystal of AlPAs that contains Pthan in the mixed crystal of AlAs. Thus, it is preferable to use a mixedcrystal of AlAsP having a composition close to AlAs or AlAs itself forthe layer 2125 in order to reduce the duration for the oxidationprocess.

In the case the GaP_(0.4)As_(0.6) substrate 2121 is used for thesubstrate of the laser diode, it should be noted that the AlAs layeraccumulates a lattice strain of 1.4%. Thus, it is necessary to limit thethickness of the AlAs layer to be smaller than a critical thicknessabove which lattice relaxation takes place. On the other hand, such arestriction of thickness of the AlAs layer decreases the oxidation rate.On the other hand, the construction of FIG. 33, in which a number ofAlAs layers, each having a thickness smaller than the critical thicknessof the AlAs layer, are stacked repeatedly and alternately with anintervening layer, is effective for preventing lattice relaxation andfor realizing a sufficient oxidation rate.

FIG. 34 shows the result of an experiment conducted by the inventor ofthe present invention.

In the experiment, the structure of FIG. 33 is used and a layeridentical in composition with the p-type cladding layer 2123 is grownthereon with a thickness of 0.2 μm. Next, the cladding layer 2123 thusformed is patterned until the etching stopper layer 2129 (see FIG. 30)is exposed, and a ridge stripe structure is formed with a width of 40μm.

The structure thus formed is subjected to a selective oxidation processat 460° C. for 10 minutes.

FIG. 34 shows the plan view of the specimen used in the experimentwherein FIG. 34 shows the ridge region and the region of the layer 2125where the selective oxidation has taken place. It should be noted thatthe region where the selective oxidation has taken place is representedin FIG. 34 by hatching. As can be seen in FIG. 34, the oxidized regionis formed with a lateral width of 8 μm only after 10 minutes ofselective oxidation process. This rate of oxidation is sufficient forpractical use of the selective oxidation process for the formation ofthe oxidized regions 2127 in the actual fabrication process of the laserdiode. This rapid oxidation is attributed to the large diffusion rate ofoxygen taking place along the surface of the layer 2125. By using thestructure of FIG. 33, the number of the surfaces available for oxygendiffusion is increased, and this leads to the increase of the totaloxidation rate of the layer 2125.

It should be noted that the superlattice structure of FIG. 33 isapplicable to any of the embodiments from FIGS. 22-32. Further, itshould be noted that the AlP_(0.4)As_(0.6) layer in the construction ofFIG. 33 may be replaced with any material of the system GaAsP, AlInP,GaInP, AlGaInP, GaInAsP, and AlGaInAsP, provided that the material has alattice constant that eliminates lattice relaxation by the AlAs layer.The layer may achieve a lattice matching with the substrate oraccumulate a strain compensating the strain of the AlAs layer. In viewof the rapid rate of oxidation, the material of AlPAs, which contains Alas the only group III element, is most preferable. The thickness of thelayers constituting the superlattice structure of FIG. 33 may be changedvariously from the value described before.

Twenty-Fifth Embodiment

FIG. 35 shows the construction of a vertical-cavity laser diodeaccording to a twenty-fifth embodiment of the present invention.

It should be noted that the laser diode of the present invention uses adistributed Bragg reflector (DBR) having a lattice constant between GaAsand GaP, wherein at least one of the two semiconductor layers repeatedalternately to form the distributed Bragg reflector, has a compositionrepresented as (Al_(x1)Ga_(1-x1))_(y1)In_(1-y1)As_(z1)P_(1-z1) (0≦x₁≦1,0.5≦y₁≦1, 0<z₁<1).

In the system of AlGaInAsP, it should be noted that the bandgap energyis increased with decrease of the lattice constant. See the relationshipof FIG. 8. Thus, the DBR based on the semiconductor layers of theAlGaInAsP system and having a lattice constant between GaAs and GaP doesnot cause absorption of the optical radiation emitted by the laser diodewith the wavelength of 630-650 nm. Thereby, the optical waveguide losscaused by the DBR is minimized.

Further, in view of the fact that the semiconductor layer contains As,the hillock density or surface defects including surface undulation ofthe semiconductor layers constituting the DBR is reduced. Thereby, thereflectance of the DBR is maximized.

It is known that, in the semiconductor mixed crystal such as AlInP orAlGaInP, there is a tendency of increasing hillock density and surfaceundulation with increasing Al content. While this problem can bereduced, to some extent, by using an offset substrate having a surfaceoffset from the (100) surface or increasing the growth temperature, ithas been difficult to suppress the hillock formation or surfaceundulation perfectly.

The present inventor discovered experimentally that hillock formation iseffectively suppressed by adding As into the mixed crystal of AlGaInP.Thereby, it was also discovered that only a small amount of As, such as1-2% in terms of the atomic fraction for the group V elements, issufficient for achieving the desired effect. In achieving the desiredeffect, it is not necessary to restrict the growth condition or surfaceorientation of the substrate. Thus, by using a mixed crystal of theAlGaInAsP system containing As for the DBR, it becomes possible toimprove the quality of the surface of the crystal layers forming theDBR.

FIG. 35 shows the construction of the vertical-cavity laser diodeaccording to the present embodiment.

Referring to FIG. 35, the vertical-cavity laser diode is constructed ona substrate 3102 of n-type GaAsP having a lattice misfit of −1.4% withrespect to a GaAs substrate and includes, on the substrate of 3102, abuffer layer 3103 of n-type GaAsP, a DBR structure 3104 formed of analternate repetition of an n-type AlInAsP layer and an n-type GaInAsPlayer, a cladding layer 3105 of undoped AlGaInAsP, an active layer 3106of undoped GaInP, a cladding layer 3107 of undoped AlGaInAsP, a DBRstructure 3108 formed of an alternate repetition of a p-type AlInAsPlayer and a p-type GaInAsP layer, a spike elimination layer 3109 ofGaInP, and a contact layer 3110 of GaAsP, wherein the layers 3103-3110are deposited consecutively on the substrate 3102 by an MOCVD process.

After the formation of the foregoing layered structure, aphotolithographic patterning process is conducted in which the DBR 3108,the spike elimination layer 3109 and the contact layer 3110 arepatterned to form a central post structure, wherein the patterningprocess is conducted until the AlGaInAsP cladding layer 3107 is exposed.In the construction of FIG. 35, it should be noted that the layers3103-3110 achieve a lattice matching with the GaAsP substrate 3102.

After the formation of the central post structure, an SiO₂ film 3111 isdeposited uniformly, by a CVD process so as to cover the central poststructure, and a photolithographic patterning process is conducted toform a first contact window in the SiO₂ film 3111 by using a resist masksuch that the first contact window exposes the GaAsP contact layer 3110at top part of the central post structure. Further, the contact layer3110 is patterned by using another photolithographic process so as toexpose the spike elimination layer 3109 in correspondence to a secondcontact window formed in the first contact window, and a circular resistmask pattern is formed so as to cover the spike elimination layer 3109thus exposed such that the circular resist mask pattern is locatedcentrally to the spike elimination layer 3909 exposed in the secondcontact window.

Further a p-type electrode layer is deposited on the structure thuscovered by the circular resist mask by an evaporation-depositionprocess, and a p-type electrode 3112 is formed by lifting off thecircular resist mask. Further, the bottom surface of the GaAsP substrate3102 is polished and an n-type electrode 3101 is deposited by anevaporation-deposition process.

Thereafter, a thermal annealing process is applied to form an ohmiccontact at each of the electrodes 3101 and 3112.

In the laser diode of the present embodiment, the laser beam is emittedfrom the circular opening formed in the p-type electrode 3112. In, orderto facilitate the emission of the laser beam, the GaAsP contact layer3110, which is not transparent to the laser beam, is removed incorrespondence to the second contact window.

As is well known in the art, each of the layers constituting the DBRstructure 3104 or 3108 has a thickness set to be equal to a quarterwavelength of the laser beam produced by the laser diode. Further, thecladding structure including the cladding layers 3105 and 3107 and theactive layer 3106 is set to be equal to an integer multiple of thehalf-wavelength optical distance. In the case the refractive index ofthe semiconductor layers constituting the DBR structure adjacent to thecladding layer is smaller than the refractive index of the claddinglayer, a full-wavelength optical cavity is formed. In the opposite case,a half-wavelength optical cavity is formed.

According to the present embodiment, the active layer 3106 has acomposition of GaInP causing a laser oscillation at the wavelength of635 nm, wherein the active layer 3106 of such a composition is appliedwith a compressive strain from the substrate 3102. In view of the factthat the DBR structure includes, at least a part thereof, a layer ofAlGaInAsP or AlInAsP that contains As with a concentration of 2% withrespect to the group V elements. Thus, the hillock formation iseliminated on the surface of the semiconductor layers constituting theDBR structure and a uniform inter interface is realized. Associatedtherewith, the characteristic of the DBR structure is improved and theperformance of the laser diode is improved with respect, to theoscillation threshold current and device lifetime.

Twenty-Sixth Embodiment

Next, a vertical-cavity laser diode according to a twenty-sixthembodiment of the present invention will be described with reference toFIG. 36.

In the laser diode of the present embodiment, a DBR having a compositionbetween GaAs and GaP is used similarly to the laser diode of FIG. 35,except that the active layer is formed of GaInAsP. More specifically,the laser diode of the present embodiment uses a composition ofGa_(y2)In_(1-y2)As_(z2)P_(1-z2) (0<y₂≦1, 0<z≦1) for the active layer, incombination with the DBR having a lattice constant between GaAs and GaP.

According to the present embodiment, it is possible to control theoscillation wavelength and further the strain of the active layer withrespect to the DBR structure by controlling the As content in the activelayer of GaInAsP.

It should be noted that the wavelength obtained from a mixed crystal ofGaInP having a lattice matching composition to a GaAs substrate is about650 nm, wherein this wavelength decreases with decrease of the latticeconstant of the GaInP mixed crystal. Thus, it is necessary to increasethe Ga content in such a GaInP active layer for increasing thewavelength, while such an increase of the Ga content causes accumulationof a compressive strain in the active layer.

Meanwhile, it is possible, in a GaInAsP active layer to decrease thebandgap energy by increasing the As content. While such an increase ofAs content induces an increase of the lattice constant, the increase ofthe lattice constant can be successfully compensated for by using aGaInP composition having a small lattice constant as the startingcomposition of the active layer and add As to such a startingcomposition. As the change of the bandgap energy induced by As is muchlarger than the change of the bandgap energy caused by the associatedlattice strain or a change of Ga content in a GaInP mixed crystal, theforegoing construction of the present embodiment easily increases theoscillation wavelength and achieves minimization of the lattice misfitwith respect to the DBR.

For example, it is necessary to use a composition of Ga_(0.45)In_(0.55)Pfor obtaining an oscillation wavelength of 660 nm when a GaInP layerformed on a Ga_(0.7)In_(0.3)P substrate is used for the active layer. Inthis case, a strain of about 1.9% is accumulated in the GaInP activelayer. In the case of the present embodiment, in which a composition ofGa_(0.8)In_(0.2)As_(0.5)P_(0.5) is used for the active layer, it ispossible to achieve a laser oscillation at the wavelength of 660 nmwhile reducing the strain to one half (½).

Further, the use of the mixed crystal of GaInAsP for the active layerreduces the problem of deterioration of crystal quality. Thus, thepresent embodiment enables the desired oscillation wavelength whilereducing the strain in the active layer as compared with the case ofachieving the foregoing desired oscillation wavelength while using aGaInP mixed crystal for the active layer.

Further, the present embodiment has an advantageous feature in that thelattice constant of the DBR can be set close to the lattice constant ofGaP. Thereby, the refractive index difference between the AlInAsP layerand the GaInAsP layer constituting the DBR structure is increased andthe number of stacks of the layers in the DBR structure can be reduced.

FIG. 36 shows the construction of the vertical-cavity laser diodeaccording to the present embodiment.

Referring to FIG. 36, the vertical-cavity laser diode is constructed ona substrate 3202 of n-type GaAsP having a lattice misfit of −2.0% withrespect to a GaAs substrate and includes, on the substrate of 3202, abuffer layer 3203 of n-type GaAsP, a DBR structure 3204 formed of analternate repetition of an n-type AlInAsP layer and an n-type GaAsPlayer, a cladding layer 3205 of undoped AlGaInAsP, an active layer 3206of undoped GaInAsP, a cladding layer 3207 of undoped AlGaInAsP, a DBRstructure 3208 formed of an alternate repetition of a p-type AlInAsPlayer and a p-type GaAsP layer, a spike elimination layer 3209 of p-typeGaInP, and a contact layer 3210 of p-type GaAsP, wherein the layers3203-3210 are deposited consecutively on the substrate 3202 by an MOCVDprocess.

After the formation of the foregoing layered structure, aphotolithographic patterning process is conducted in which the DBRstructure 3208, the spike elimination layer 3209 and the contact layer3210 are patterned to form a central post structure. The patterningprocess is conducted until the AlGaInAsP cladding layer 3207 is exposed.

In the construction of FIG. 36, it should be noted that the GaAsP layerforming the DBR structures 3204 and 3208 achieves a lattice matchingwith the GaAsP substrate 3202. It should be noted that the GaAsP layerhaving such a lattice matching composition to the GaAsP substrate 3202is transparent to the optical radiation produced by the laser diode.

After the formation of the central post structure, an SiO₂ film 3211 isdeposited uniformly on the central post structure by a CVD process, anda photolithographic patterning process is conducted to form a firstcontact window in the SiO₂ film 3211 by using a resist mask so as toexpose the GaAsP contact layer 3210 at top part of the central poststructure. Further, the contact layer 3210 is patterned by using anotherphotolithographic process as to expose the spike elimination layer 3209in a second contact window formed in the first contact window, and acircular resist mask pattern is formed so as to cover the spikeelimination layer 3209 thus exposed by the second contact window. Thecircular resist mask is formed centrally to the second contact window.

Further a p-type electrode layer is deposited on the structure thuscovered by the circular resist mask by an evaporation-depositionprocess, and a p-type electrode 3212 is formed by lifting off thecircular resist mask. Further, the bottom surface of the GaAsP substrate3202 is polished and an n-type electrode 3201 is deposited by anevaporation-deposition process.

Thereafter, a thermal annealing process is applied to form an ohmiccontact at each of the electrodes 3201 and 3212.

In the laser diode of the present embodiment, the laser beam is emittedfrom the circular opening formed in the p-type electrode 3212. In orderto facilitate the emission of the laser beam, the GaAsP contact layer3210, which is not transparent to the laser beam, is removed incorrespondence to the second contact window.

In the laser diode of FIG. 36, it should be noted that the active layer3206 may have the foregoing composition ofGa_(0.8)In_(0.2)As_(0.5)P_(0.5). Further, the DBR structure 3204 isformed of an alternate stacking of an n-type AlInAsP layer and an n-typeGaAsP layer. The DBR structure 3208, on the other hand, is formed of analternate stacking of a p-type AlInAsP layer and a p-type GaAsP layer.In the illustrated example, a composition that achieves a lattice misfitof −2.0% with respect to a GaAs substrate is used for the GaAsPsubstrate 3202 as noted already.

Similarly to the previous embodiment, the cladding layers 3205 and 3207use a composition of AlGaInAsP that contains As. Further, the DBRstructures 3204 and 3208 use the alternate stacking of the layers ofAlInAsP and GaAsP that contains As therein. Thus, the hillock formationat the semiconductor layer interface in the DBR structure is effectivelysuppressed. It should be noted that the layer of GaAsP used in the DBRstructure 3204 or 3208 is transparent to the laser oscillationwavelength in the composition that achieves lattice matching with theGaAsP substrate 3202.

By using a composition providing an oscillation wavelength of 650 nm forthe active layer 3206, it is possible to reduce the lattice strain ofthe active layer to be one half (½). Further, it is possible to set thelattice constant of the GaAsP substrate 3202 to be close to the latticeconstant of GaP. Thus, a large refractive index difference is achievedbetween the semiconductor layers constituting the DBR structures 3204and 3208, and the number of stacks in the DBR structure can be reduced.

Because of the reduced strain, the quality of the crystal constitutingthe active layer 3206 is improved. As a result of decrease of the numberof stacks of the semiconductor layers in the DBR structures, theresistance of the laser diode is also reduced.

Twenty-Seventh Embodiment

Next, a vertical-cavity laser diode according to a twenty-seventhembodiment of the present invention will be described with reference toFIG. 37.

In the laser diode of the present embodiment, the laser diode includes aDBR structure having a lattice constant between GaP and GaAs, and a pairof carrier confinement layers having a composition represented asGa_(y3)In_(1-y3)P (0.5<y₃≦1) are provided so as to sandwich the activelayer 3206 vertically.

As can be seen in FIG. 8, the bandgap energy increases in the materialof the system GaInP with decreasing lattice constant. Thus, the GaInPlayer having a lattice matching composition with the DBR structure has abandgap energy larger than the optical wavelength range of 630-650 nmand functions as an effective carrier confinement layer with regard tothe active layer 3306.

According to the present embodiment, carrier confinement is achieved bya semiconductor layer of GaInP, which is free from Al. Thus, the problemof non-optical recombination of carriers associated with the use of anAl-containing layer such as an AlGaInP layer is successfully avoided.The laser diode of the present embodiment has an advantageous feature oflow threshold of laser oscillation.

Further, the vertical-cavity laser diode of the present embodiment usesa semiconductor layer transparent to the optical radiation of thewavelength of laser oscillation for the contact layer. As a result ofuse of such a transparent contact layer, it becomes possible toeliminate the patterning process to remove the contact layer 3110 or3210 in the previous embodiment for forming the optical window.

FIG. 37 shows the construction of the vertical-cavity laser diodeaccording to the present embodiment.

Referring to FIG. 37, the vertical-cavity laser diode is constructed ona substrate 3302 of n-type GaAsP and includes, on the substrate of 3302,a buffer layer 3303 of n-type GaAsP, a DBR structure 3304 formed of analternate repetition of an n-type AlInAsP layer and an n-type GaInPlayer, a carrier confinement layer 3305 of undoped GaInP, an activelayer 3306 of undoped GaInAsP, another carrier confinement layer 3307 ofundoped GaInP, another DBR structure 3308 formed of an alternaterepetition of a p-type AlInAsP layer and a p-type GaInP layer, and acontact layer 3309 of p-type GaInP, wherein the layers 3303-3309 aredeposited consecutively on the substrate 3302 by an MOCVD process.

After the formation of the foregoing layered structure, aphotolithographic patterning process is conducted in which the DBRstructure 3308, and the contact layer 3309 are patterned to form acentral post structure. The patterning process is conducted until theGaInP optical waveguide layer 3307 is exposed.

After the formation of the central post structure, an SiO₂ film 3310 isdeposited uniformly by a CVD process, and a photolithographic patterningprocess is conducted to form a contact window in the SiO₂ film 3310 soas to expose the GaInP contact layer 3309 in correspondence to thecontact window at top part of the central post structure. Further, acircular resist mask pattern is formed so as to cover the contact layer3309 thus exposed by the contact window, and a p-type electrode layer isdeposited on the structure thus covered by the circular resist mask byan evaporation-deposition process. By lifting off the circular resistpattern, a p-type electrode 3311 is formed in a circular shape. Further,the bottom surface of the GaAsP substrate 3302 is polished and an n-typeelectrode 3301 is deposited by an evaporation-deposition process.

Thereafter, a thermal annealing process is applied to form an ohmiccontact at each of the electrodes 3301 and 3311.

In the laser diode of the present embodiment, the laser beam is emittedfrom the circular opening formed in the p-type electrode 3311. Becausethe GaInP contact layer 3309 is transparent to the optical beam producedby the laser diode, the process for forming an optical window in thecontact layer 3309 as in the case of the previous embodiments of FIGS.35 and 36 can be eliminated.

It should be noted that the GaInP mixed crystal having a latticeconstant between GaAs and GaP is transparent to the optical radiation inthe wavelength range of 630-660 nm. Thus, the GaInP contact layer 3309can be formed with lattice matching to the GaAs substrate 3302. Further,it is possible to use a GaAsP layer for the transparent contact layer3309, provided that the GaAsP layer has an As content smaller than about0.63. A GaAsP layer containing As with a concentration exceeding theforegoing limit shows an optical absorption to the optical beam producedby the laser diode. It should be noted that a GaAsP mixed crystal layerhaving such a composition can achieve a lattice matching with the GaAsPsubstrate 3302. In the case of using a GaAsP layer for the contact layer3309, a high-concentration doping can be achieved easily. In the event atransparent GaAsP layer cannot be obtained at the lattice matchingcomposition to the DBR structure or the substrate, it is possible to usea transparent GaAsP layer accumulating a strain.

As noted previously, the present embodiment can eliminate the problem ofnon-recombination of carriers as a result of use of Al-free compositionfor the layers 3304 and 3307 and the efficiency of laser oscillation isimproved substantially.

Twenty-Eighth Embodiment

Next, a vertical-cavity laser diode according to a twenty-eighthembodiment of the present invention will be described with reference toFIG. 38.

In the laser diode of the present embodiment that uses a DBR structurehaving a lattice constant between the lattice constant of GaAs and thelattice constant of GaP, an AlAsP layer having a composition representedas AlAs_(z4)P_(1-z4) (0≦z₄≦1) is used for constructing the DBRstructure. By using the AlAsP layer, it is possible to increase thereflectance of the DBR structure. Thereby, the number of stacks of thesemiconductor layers in the DBR structure can be reduced. In the DBRstructure having a lattice constant between GaAs and GaP, it is possibleto use a mixed crystal layer of AlAsP in addition to AlInP.

It is estimated that a mixed crystal of AlAsP has a smaller refractiveindex as compared with a mixed crystal of AlInP of the same latticeconstant, due to the reason that the mixed crystal of AlAsP has a largerbandgap energy between the Γ point of the conduction band and thevalence band. As the number of stacks of layers in the DBR structure isreduced by using the staking structure of AlAsP/GaInP as compared withthe case of using the stacking structure of AlInP/GaInP, it is possibleto achieve a high reflectance with a reduced number of the stacks andthe resistance of the laser diode caused by the DBR structure isreduced. In view of the fact that the AlAsP mixed crystal is free fromIn, the relative proportion of As in the mixed crystal is increased andthe problem of hillock formation is effectively suppressed.

FIG. 38 shows the construction of the vertical-cavity laser diodeaccording to the present embodiment.

Referring to FIG. 38, the vertical-cavity laser diode is constructed ona substrate 3402 of n-type GaAsP and includes, on the substrate of 3402,a buffer layer 3403 of n-type GaAsP, a DBR structure 3404 formed of analternate repetition of an n-type AlAsP layer and an n-type GaInP layer,a carrier confinement layer 3405 of undoped GaInP, an active layer 3406of undoped GaInAsP, another carrier confinement layer 3407 of undopedGaInP, another DBR structure 3408 formed of an alternate repetition of ap-type AlAsP layer and a p-type GaInP layer, and a contact layer 3409 ofp-type GaInP, wherein the layers 3403-3409 are deposited consecutivelyon the substrate 3402 by an MOCVD process.

After the formation of the foregoing layered structure, aphotolithographic patterning process is conducted in which the DBRstructure 3408 and the contact layer 3409 are patterned to form acentral post structure. The patterning process is conducted until theGaInP optical waveguide layer 3407 is exposed.

After the formation of the central post structure, an SiO₂ film 3410 isdeposited uniformly by a CVD process, and a photolithographic patterningprocess is conducted to form a contact window in the SiO₂ film 3410 soas to expose the GaInP contact layer 3409 in correspondence to thecontact window at top part of the central post structure. Further, acircular resist mask pattern is formed so as to cover the contact layer3409 thus exposed by the contact window, and a p-type electrode layer isdeposited on the structure thus covered by the circular resist mask byan evaporation-deposition process. By lifting off the circular resistpattern, a p-type electrode 3411 is formed in a circular shape. Further,the bottom surface of the GaAsP substrate 3402 is polished and an n-typeelectrode 3401 is deposited by an evaporation-deposition process.

Thereafter, a thermal annealing process is applied to form an ohmiccontact at each of the electrodes 3401 and 3411.

In the vertical-cavity laser diode of FIG. 38, the AlAsP layer and theGaInP layer constituting the DBR structure 3404 or 3408 have a latticematching composition to the GaAsP substrate 3402. As the AlAsP layer hasa smaller refractive index as compared with the AlInP layer of the samelattice constant, it is possible to increase the refractive indexdifference or step formed between the AlAsP layer and the GaInP layer inthe DBR structure 3404 or 3408. As a result, the number of stacks oflayers in the DBR structures 3404 and 3408 is reduced and the resistanceof the laser diode is reduced accordingly. In the DBR structure 3404 or3408, it should be noted that the AlAsP layer may be used together witha semiconductor layer other than GaInP. For example, the AlAsP layer maybe used together with a layer of AlGaAsP to form the DBR structure. Inthis case, the superlattice structure of the DBR structure 3404 or 3408is easily formed by an MOCVD process while merely switching the supplyof gaseous source of Ga.

Twenty-Ninth Embodiment

Next, a vertical-cavity laser diode according to a twenty-ninthembodiment of the present invention will be described with reference toFIG. 39.

In the present embodiment, the laser diode includes acurrent-confinement structure formed in a part of the DBR structure,wherein the current-confinement structure is formed in the DBR structureby a selective oxidation process of an AlAsP layer having a compositionrepresented as AlAs_(z5)P_(1-z5) (0≦z₅≦1). The AlAsP layer has a lowrefractive and forms the DBR structure together with anothersemiconductor layer of a high refractive index.

It should be noted that the foregoing AlAsP layer is not necessarily bethe only one low-refractive-index layer of the DBR structure. Forexample, the AlAsP layer may be formed only in the vicinity of theactive layer. In this case, the low-refractive-index layer in the regionaway from the active layer may be formed of AlInAsP. By doing so, thecurrent-confinement structure can be formed without increasing theresistance of the laser diode.

The AlAsP layer is not required to achieve a lattice matching with otherlayers of the DBR structure but may accumulate a strain therein. As theAlAsP layer is used only in a part of the DBR structure, there occurs noserious degradation of crystal quality even when the AlAsP layeraccumulates a strain.

According to the present embodiment, a vertical-cavity laser diodehaving a reduced threshold current is obtained. Because of the use ofAlAsP for the part of the DBR structure where the selective oxidationprocess is to be conducted, the selective oxidation process proceedsrapidly. It should be noted that the layer of AlAsP contains Al as theonly group III element. It should be noted that the oxide layer formedas a result of the oxidation of Al becomes an insulator. Thereby, drivecurrent of the laser diode is caused to flow through the unoxidizedregion encircled by the insulating region thus oxidized.

FIG. 39 shows the construction of the vertical-cavity laser diodeaccording to the present embodiment.

Referring to FIG. 39, the vertical-cavity laser diode is constructed ona substrate 3502 of n-type GaAsP and includes, on the substrate of 3502,a buffer layer 3503 of n-type GaAsP, a first DBR structure 3504 formedof an alternate repetition of an n-type AlAsP layer and an n-type GaInPlayer, a carrier confinement layer 3505 of undoped GaInP, an activelayer 3506 of undoped GaInAsP, another carrier confinement layer 3507 ofundoped GaInP, a second DBR structure 3508 formed of an alternaterepetition of a p-type AlAsP layer and a p-type GaInP layer, a third DBRstructure 3509 formed of an alternate repetition of a p-type AlInAsPlayer and a p-type GaInP layer, and a contact layer 3510 of p-typeGaInP, wherein the layers 3403-3510 are deposited consecutively on thesubstrate 3502 by an MOCVD process.

After the formation of the foregoing layered structure, aphotolithographic patterning process is conducted in which the DBRstructure 3508, 3509 and the contact layer 3510 are patterned to form acentral post structure. The patterning process is conducted until theGaInP optical waveguide layer 3507 is exposed.

After the formation of the central post structure, a selective oxidationprocess is conducted in a water vapor atmosphere to induce a selectiveoxidation of the AlAsP layer constituting the second DBR structure 3508.The oxidation of the AlAsP layer proceeds laterally into the interior ofthe central post structure in the DBR structure 3508 along the AlAsPlayers therein, and there is formed an oxidized region 3508A such thatthe oxidized region 3508A surrounds the central, unoxidized region thatprovides the current path of the drive current.

Further, an SiO₂ film 3511 is deposited uniformly by a CVD process, anda photolithographic patterning process is conducted to form a contactwindow in the SiO₂ film 3511 so as to expose the GaInP contact layer3510 in correspondence to the contact window at top part of the centralpost structure. Further, a circular resist mask pattern is formed so asto cover the contact layer 3510 thus exposed by the contact window, anda p-type electrode layer is deposited on the structure thus covered bythe circular resist mask by an evaporation-deposition process. Bylifting off the circular resist pattern, a p-type electrode 3512 isformed in a circular shape. Further, the bottom surface of the GaAsPsubstrate 3502 is polished and an n-type electrode 3501 is deposited byan evaporation-deposition process.

Thereafter, a thermal annealing process is applied to form an ohmiccontact at each of the electrodes 3501 and 3512.

In the present embodiment, the process of selective oxidation forforming the oxidized region 3508A is substantially facilitated byforming the second DBR structure 3508 by a repetitive and alternatestacking of AlAsP and GaInP layers. While it is possible to form thethird DBR structure 3509 also to have the AlAsP/GaInP structuresimilarly to the second DBR structure, it is advantageous to use theAlInAsP/GaInP stacking structure for the third DBR structure 3509 forminimizing the resistance of the laser diode.

Further, it is possible to use a stacking structure of AlAs/GaInP forthe second DBR structure 3508.

According to the present embodiment, a current confinement structure isformed inside the DBR structure and the threshold current of laseroscillation can be reduced substantially.

Thirtieth Embodiment

Next, a vertical-cavity laser diode according to a thirtieth embodimentof the present invention will be described with reference to FIG. 40.

In the present embodiment, the vertical-cavity laser diode includes aDBR structure similarly to the vertical-cavity laser diodes of theprevious embodiments except that there is interposed a currentconfinement structure of an AlAsP layer between the DBR structure andthe active layer, wherein the AlAsP layer has a composition representedas AlAs_(z6)P_(1-z6) (0≦z₆≦1) and includes therein an insulator regionformed as a result of selective oxidation.

In the present embodiment, it is not necessary for the AlAsP layer toachieve a lattice matching to the DBR structure but may accumulate astrain. Because a sufficient current-confinement effect is obtained withthe thickness of only 10-20 nm for the AlAsP layer, it is also possibleto use an AlAs layer in place of the AlAsP layer without causing anyserious deterioration of crystal quality.

In the laser diode of the present embodiment, it is preferable toprovide the current-confinement structure of AlAsP as close to theactive layer as possible for eliminating unwanted spreading of the drivecurrent after passing through the current-confinement structure. Theoxidized region thus formed as a result of the selective oxidationprocess has a reduced refractive index, and the current-confinementstructure forms also an optical confinement structure, which iseffective for lateral mode control of the laser oscillation.

FIG. 40 shows the construction of the vertical-cavity laser diodeaccording to the present embodiment.

Referring to FIG. 40, the vertical-cavity laser diode is constructed ona substrate 3602 of n-type GaAsP and includes, on the substrate of 3602,a buffer layer 3603 of n-type GaAsP, a DBR structure 3604 formed of analternate repetition of an n-type AlAsP layer and an n-type GaInP layer,a first carrier confinement layer 3605 of undoped GaInP, an active layer3606 of undoped GaInAsP, a second carrier confinement layer 3607 ofundoped GaInP, a to-be-oxidized layer 3608 of p-type AlAsP, a thirdoptical confinement layer 3609 of undoped GaInP, a contact layer 3610 ofp-type GaInP, and another DBR structure 3611, wherein the layers3603-3611 are deposited consecutively on the substrate 3602 by an MOCVDprocess.

After the formation of the foregoing layered structure, aphotolithographic patterning process is conducted in which the DBRstructure 3611 is patterned to form a central post structure. Thepatterning process is conducted until the GaInP contact layer 3610 isexposed.

After the formation of the central post structure, the central poststructure is protected by a circular resist pattern, and the GaInPcontact layer 3610, the GaInP carrier confinement layer 3609 and theAlAsP to-be-oxidized layer 3608 are patterned consecutively until thecarrier confinement layer 3607 is exposed, while using the circularresist pattern as a mask.

Next, the structure thus obtained is subjected to a selective oxidationprocess in a water vapor atmosphere, and there is formed an oxidizedregion 3608A in the to-be-oxidized layer 3608 as a result of theoxidation that proceeds toward the interior of the layer 3608, startingfrom the outermost, exposed surface. Thereby, the oxidized region 3608Aacts as a current-blocking region and there is formed acurrent-confinement structure within the to-be-oxidized layer 3608.

Further, an SiO₂ film 3612 is deposited uniformly by a CVD process, anda photolithographic patterning process is conducted to form a contactwindow in the SiO₂ film 3612 so as to expose DBR structure 3611 and apart of the p-type GaInP contact layer 3610. Further, a resist maskpattern is formed so as to cover the DBR structure 3611 and a p-typeelectrode layer is deposited on the structure thus covered by the resistmask pattern by an evaporation-deposition process. By lifting off theresist mask pattern, a p-type electrode 3613 is formed in contact withthe contact layer 3610. Further, the bottom surface of the GaAsPsubstrate 3602 is polished and an n-type electrode 3601 is deposited byan evaporation-deposition process.

Thereafter, a thermal annealing process is applied to form an ohmiccontact at each of the electrodes 3601 and 3613.

As noted before, the vertical-cavity laser diode of FIG. 40 includes acurrent-confinement structure formed as a result of selective oxidationprocess of the AlGaP to-be-oxidized layer 3608. As the layer 3608 isformed close to the active layer 3606, the carriers corresponding to thedrive current of the laser diode are injected into the active layer 3606with minimum lateral spreading, and the efficiency of laser oscillationis improved substantially. Further, the oxidized region 3608A and theunoxidized region of the layer 3608 form an optical confinementstructure effective for lateral mode control of laser oscillation.Thereby, the vertical-cavity laser diode of the present embodimentoscillates stably at a single lateral mode.

It should be noted that a thickness of 10-20 nm is sufficient for theAlAsP to-be-oxidized layer 3608. Further, AlAs may be used for the layer3608 without causing a serious deterioration of crystal quality.

It should be noted that the foregoing embodiments of FIGS. 35-40 can beconstructed also on a GaInP substrate. Such a GaInP substrate can beformed by depositing a composition-graded layer on a GaAs substrate by avapor phase epitaxial process.

Thirty-First Embodiment

Next, a vertical-cavity laser diode according to a thirty-firstembodiment of the present invention will be described with reference toFIG. 31.

In the present embodiment, the vertical-cavity laser diode uses a pairof DBR structures having a lattice constant between GaAs and GaP,wherein the vertical-cavity laser diode is constructed such that anoutput laser beam is obtained through the DBR structure located closerto the substrate. The vertical-cavity laser diode of such a constructionis suitable for a flip-chip mounting, as the laser beam is emitted inthe upward direction in the state that the laser diode is mounted on asupport substrate such as a printed circuit board in a face-down stateor junction-down state.

FIG. 41 shows the construction of the vertical-cavity laser diodeaccording to the present embodiment.

Referring to FIG. 41, the vertical-cavity laser diode is constructed ona substrate 3813 of n-type GaP carrying thereon a composition-gradedlayer 3814 of n-type GaAsP formed by a vapor phase epitaxial process,wherein the composition-graded layer 3814 changes a composition thereoffrom GaP to GaAsP.

The laser diode includes, on the composition-graded layer 3814, a bufferlayer 3803 of n-type GaAsP, a DBR structure 3804 formed of an alternaterepetition of an n-type AlInAsP layer and an n-type GaInP layer, acarrier confinement layer 3805 of undoped AlGaInAsP, an active layer3806 of undoped GaInAsP, another carrier confinement layer 3807 ofundoped GaInP, a DBR structure 3808 formed of an alternate repetition ofa p-type AlInAsP layer and a p-type GaInP layer, a spike eliminationlayer 3809 of p-type GaInP, and a contact layer 3810 of p-type GaAsP,wherein the layers 3803-3810 are deposited consecutively on thecomposition-graded layer 3814 by an MOCVD process.

After the formation of the foregoing layered structure, aphotolithographic patterning process is conducted in which the DBR 3808,the spike elimination layer 3809 and the contact layer 3810 arepatterned to form a central post structure while using a resist mask.The patterning process is conducted until the GaInP carrier confinementlayer 3807 is exposed.

After the formation of the central post structure, an SiO₂ film 3811 isdeposited uniformly by a CVD process, and a photolithographic patterningprocess is conducted to form a contact window in the SiO₂ film 3811 byusing a resist mask so as to expose the GaAsP contact layer 3810, and ap-type electrode 3812 is deposited by an evaporation-deposition process.

In the present embodiment, the bottom surface of the GaAsP substrate3802 is polished and a resist pattern is provided so as to cover theregion aligned with the post structure, and an n-type electrode isdeposited by an evaporation-deposition process. Further, by lifting offthe resist pattern, there is formed an n-type electrode 3801 such thatthe n-type electrode 3801 has an optical window in correspondence to thepart where the resist pattern has been provided.

Thereafter, a thermal annealing process is applied to form an ohmiccontact at each of the electrodes 3801 and 3812.

Finally, an SiO₂ anti-reflection coating 3815 is provided on the bottomsurface of the substrate 3801 in correspondence to the optical windowwith a thickness corresponding to a quarter wavelength of the laseroscillation wavelength.

In the construction of FIG. 41, it should be noted that the GaPsubstrate 3813 and the GaAsP composition-graded layer 3814 thereon aretransparent to the optical radiation of the oscillation wavelength ofthe laser diode of 635 nm. Thus, it is not necessary to remove a part ofthe substrate 3813 or 3814 to provide a passage for the output opticalbeam. Thereby, the fabrication process of the laser diode is simplified.

In the present embodiment, it is also possible to use otherabsorption-free substrates such as GaInP substrate for the substrate3813. Further, the process of forming the composition-graded layer 3814on the substrate 3813 is not limited to a vapor phase epitaxial process.

Thirty-Second Embodiment

Next, a vertical cavity laser diode according to a thirty-secondembodiment of the present invention will be described with reference toFIG. 42.

In the present embodiment, the vertical-cavity laser diode includes apair of DBR structures having a lattice constant between GaAs and GaP,wherein the laser diode is designed to produce the output optical beamthrough the DBR structure located closer to the substrate while usingsimultaneously a GaAsP substrate.

In the present embodiment, a part of the GaAsP substrate is etched awayfor providing the path of the output optical beam, wherein the processof etching the GaAsP substrate is facilitated in the present embodimentby interposing a GaInAsP etching stopper layer between the GaAsPsubstrate and the DBR structure located closer to the GaPAs substrate.

It should be noted that a GaAsP mixed crystal is not transparent to theoptical radiation of the wavelength of 630-660 nm when the As content isequal to or larger than 0.63. Thus, there can be a case in which theGaAsP substrate absorbs the output laser beam in the vertical-cavitylaser diode of the type that emits the output laser beam through the DBRstructure located closer to the GaAsP substrate, depending on thecomposition of the GaAsP substrate. Thus, it is necessary in such avertical-cavity laser diode to remove a part of the GaAsP substrate forallowing the laser beam to go out without absorption.

While such an etching of the GaAsP substrate can be achieved by using asulfuric acid etchant, the sulfuric acid etchant, reacting upon a mixedcrystal of AlGaInAsP, can act on the DBR structure depending on thecomposition of the DBR structure. On the other hand, a mixed crystal ofGaInAsP containing As with a concentration smaller than the As contentof the GaAsP substrate, a high selectivity of etching is realized withrespect to the GaAsP substrate. Thus, the present embodiment uses aGaInAsP mixed crystal layer as an etching stopper layer in the processof forming an opening in the GaAsP substrate as a passage of the outputlaser beam. In view of the fact that the selectivity of etchingincreases with decreasing As content, it is possible to use a mixedcrystal composition of GaInP for the etching stopper layer.

FIG. 42 shows the construction of the vertical-cavity laser diodeaccording to the present embodiment.

Referring to FIG. 42, the vertical-cavity laser diode is constructed ona substrate 3902 of n-type GaAsP, wherein the laser diode includes, onthe GaAsP substrate 3902, a buffer layer 3903 of n-type GaAsP, anetching stopper layer 3912 of n-type GaInP, a DBR structure 3904 formedof an alternate repetition of an n-type AlInAsP layer and an n-typeAlGaAsP layer, a carrier confinement layer 3905 of undoped GaInP, anactive layer 3906 of undoped GaInAsP, another carrier confinement layer3907 of undoped GaInP, a DBR structure 3908 formed of an alternaterepetition of a p-type AlInAsP layer and a p-type AlGaAsP layer, a spikeelimination layer 3909 of p-type GaInP, and a contact layer 3910 ofp-type GaAsP, wherein the foregoing layers 3903-3910, including thelayer 3912, are deposited consecutively on the substrate 3902 by anMOCVD process.

In the present embodiment the n-type GaASP substrate 3902 has acomposition set such that a lattice strain of −1.4% is accumulated withrespect to GaAs. Further, the active layer 3906 of GaInAsP has acomposition that provides a laser oscillation wavelength of 650 nm.Further, it should be noted that the DBR structure 3904 uses AlInAsP forthe low-refractive-index layer and AlGaAsP for the high-refractive-indexlayer.

After the formation of the foregoing layered structure, aphotolithographic patterning process is conducted in which the DBR 3908,the spike elimination layer 3909 and the contact layer 3910 arepatterned to form a central post structure while using a resist mask.The patterning process is conducted until the GaInP carrier confinementlayer 3907 is exposed.

After the formation of the central post structure, an SiO₂ film 3910 isdeposited uniformly by a CVD process, and a photolithographic patterningprocess is conducted to form a contact window in the SiO₂ film 3910 byusing a resist mask so as to expose the GaAsP contact layer 3910, and ap-type electrode 3911 is deposited by an evaporation-deposition process.

In the present embodiment, the bottom surface of the GaAsP substrate3902 is polished and a resist pattern is provided so as to expose theregion aligned with the post structure, and a wet etching process isapplied to the GaAsP substrate 3902 while using a sulfuric acid etchant.Thereby, the wet etching process proceeds until the GaInP etchingstopper layer 3912 is exposed, wherein the etching stops spontaneouslyupon the exposure of the GaInP etching stopper layer 3912 due to theselectivity of the GaInP composition. As a result of the wet etchingprocess, an opening is formed in the GaAsP substrate 3902 as the outputpath of the laser beam.

After the step of forming the opening in the GaAsP substrate 3902, ann-type electrode is deposited by an evaporation-deposition process onthe bottom surface of the GaAsP substrate 3902. Further, a thermalannealing process is applied to form an ohmic contact at each of theelectrodes 3901 and 3911.

By using the etching stopper layer 3912, the etching process for formingthe opening in the GaAsP substrate 3902 is controlled exactly and thelaser diode can be produced with little variation.

As noted previously, a GaInAsP mixed crystal can be used for the etchingstopper layer 3912.

Thirty-Third Embodiment

The laser diodes of the present invention described heretofore withreference to FIGS. 9-42 can be used for various applications.

FIG. 43 shows the construction of a xerographic printer that uses thelaser diode according to any of the embodiments of the presentinvention.

Referring to FIG. 43, the xerographic printer includes a sheet feed path4002 including guide rollers 4002 a-4002 d for feeding a sheet from asheet feed stack 4001 one by one to a sheet recovery tray 4003.

In correspondence to an intermediate location on the sheet feed path4002 between the sheet feed stack 4001 and the recovery tray 4003, thereis provided a photosensitive medium 4004, which may be a photosensitivedrum or a photosensitive belt, and a laser diode array 4005 writes animage to be recorded on the sheet by way of an optical beam, wherein thelaser diode array may include the visible to red wavelength laser diodedescribed with reference to any of the embodiments of FIGS. 9-42 as anoptical source.

The photosensitive medium 4004 is electrically charged by an electriccharger 4004A, and an electrostatic latent image is formed on thecharged surface of the photosensitive medium 4004 in correspondence tothe part irradiated by the laser beam.

The electrostatic latent image thus formed on the photosensitive medium4004 is developed by toner powers held in a toner cartridge 4006 and atoner image is formed on the photosensitive medium 4004 incorrespondence to the toner image. The toner image thus formed on thephotosensitive medium 4004 is then transferred to the sheet on the sheetfeed path 4002 by urging the sheet strongly to the photosensitive medium4004 by an urging roller 4004B.

The recording sheet thus formed with the toner image is then fixed by afixing unit and is forwarded to the sheet recovery tray.

In the xerographic image recording apparatus, writing of theelectrostatic latent image onto the photosensitive medium 4004 can beachieved by using a red color beam, which is advantageous for high-speedand high-resolution image recording.

Thirty-Fourth Embodiment

FIG. 44 shows the construction of an optical disk drive according to athirty-fourth embodiment of the present invention.

Referring to FIG. 44, the optical disk drive includes a rotary opticaldisk 5001 and an optical head 5002 driven by a driving mechanism 5003 soas to scan over the surface of the rotary optical disk 5001, wherein theoptical head 5002 includes a red-wavelength laser diode 5002 a accordingto any of the embodiments described heretofore with reference to FIGS.9-42.

The laser beam produced by the laser diode 5002 a is directed to thesurface of the rotary optical disk 5001 via a lens 5002 a, ahalf-transparent mirror 5002 c and mirrors 5002 d and 5002 e, while theoptical beam reflected by the optical disk 5001 is guided to aphoto-detector 5002 f via the mirrors 5002 e and 5002 d, thehalf-transparent mirror 5002 c and the mirror 5002 g.

By using the red-wavelength laser diode of the previous embodiments,optical reading and optical writing becomes possible with a small drivecurrent.

Thirty-Fifth Embodiment

FIG. 45 shows the construction of an optical module according to athirty-fifth embodiment of the present invention.

Referring to FIG. 45, the optical module includes, in a module housing6001, a lens 6002 and a laser diode 6003 in optical alignment with thelens 6002, wherein the laser diode 6003 may be any of the red-wavelengthlaser diode described in the previous embodiments with reference toFIGS. 9-42. Further, the optical module includes a plastic optical fiber6004 in optical alignment with the lens 6002, and hence the laser diode6003. Thereby, the laser beam produced by the laser diode 6003 isinjected into the plastic optical fiber 6004.

According to the optical module of the present embodiment, a laser beamin the wavelength range of about 650 nm is produced efficiently by usinga red-wavelength laser diode explained before, wherein it should benoted that this wavelength of about 650 nm corresponds to the minimumtransmission loss of PMMA which is used extensively for the material ofa plastic optical fiber.

Thus, the optical module of the present embodiment, and hence thered-wavelength laser diode of the present invention, is expected to playan important role in a low-cost, short-distance optical network.

While it is illustrated in FIG. 45 that the laser diode 6003 is anedge-emission type laser diode, the vertical-cavity laser diodeexplained with reference to FIGS. 35-42 is also applicable to theoptical module of FIG. 45.

Further, the present invention is by no means limited to the embodimentsdescribed heretofore, but various variations and modifications may bemade without departing from the scope of the invention.

What is claimed is:
 1. A semiconductor light-emitting device,comprising: a semiconductor substrate; an active layer provided oversaid semiconductor substrate, said active layer emitting opticalradiation; a semiconductor layer vertically sandwiching said activelayer with another semiconductor layer, said semiconductor layer havinga bandgap larger than a bandgap of said active layer and a latticeconstant between GaP and GaAs, said semiconductor layer containing ato-be-oxidized layer in a part thereof with a composition represented asAl_(x)Ga_(y)In_(1-x-y)P_(t)As_(1-t) (0.8≦x≦1, 0≦y≦0.2, 0≦t≦1), saidto-be-oxidized layer comprising a pair of oxidized regions and anot-oxidized region formed between oxidized regions, said oxidizedregions being an insulator.
 2. A semiconductor light-emitting device, asclaimed in claim 1, wherein said semiconductor substrate is formed of amaterial of GaPAs, and wherein said to-be-oxidized layer has acomposition achieving a lattice matching with said semiconductorsubstrate.
 3. A semiconductor light-emitting device as claimed in claim1, wherein said to-be-oxidized layer has a composition represented asAlP_(t)As_(1-t) (0≦t≦1), containing Al as the only group III element. 4.A semiconductor light-emitting device as claimed in claim 1, whereinsaid to-be-oxidized layer has a superlattice structure in which an AlAslayer and a layer having a lattice constant between GaP and GaAs arestacked a plurality of times.
 5. A semiconductor light-emitting deviceas claimed in claim 4, wherein said layer having a lattice constantbetween GaP and GaAs is AlPAs.
 6. A semiconductor light-emitting deviceas claimed in claim 1, wherein said oxidized regions have a total widthw2, said not-oxidized region has a width w1, wherein a ratio of saidwidth w1 to a sum of said width w1 and said width w2 is less than 0.6.7. A semiconductor light-emitting device as claimed in claim 1, whereinsaid semiconductor light-emitting device includes a ridge structureformed in a part of said semiconductor layer located above saidto-be-oxidized layer, said ridge structure having a ridge widthexceeding 10 μm.
 8. A semiconductor light-emitting device as claimed inclaim 1, wherein said semiconductor light-emitting device includes aridge structure formed in a part of said semiconductor layer locatedabove said to-be-oxidized layer, and wherein an etching stopper layerhaving a composition Ga_(y)In_(1-y)P_(t)As_(10t) (0≦y≦1, 0≦t≦1) isprovided under said to-be-oxidized layer.
 9. A semiconductorlight-emitting device, comprising: a semiconductor substrate; an activelayer provided over said semiconductor substrate, said active layerproducing optical radiation; and a pair of cladding layers sandwichingsaid active layer vertically, said active layer being one of a singlequantum well structure containing therein a quantum well layer and amultiple quantum well structure containing therein a quantum well layerand a barrier layer, said quantum well layer comprising a mixed crystalof AlGaInPAs having a composition represented as(Al_(x1)Ga_(1-x1))_(α1)In_(1-α1)P_(t1)As_(1-t1) (0≦x₁<1, 0<α₁≦1,0≦t₁≦1), said barrier layer comprising a mixed crystal of AlGaInPAshaving a composition represented as(Al_(x2)Ga_(1-x2))_(α2)In_(1-α2)P_(t2)As_(1-t2) (0≦x₂<1, 0.5<α₂<1,0≦t₂≦1), each of said cladding layers comprising a mixed crystal ofAlGaInPAs containing Al and having a composition represented as(Al_(y)Ga_(1-y))_(β)In_(1-β)P_(v)As_(1-v) (0<y≦1, 0.5<β<1, 0<v≦1), eachof said cladding layers having a lattice constant between GaP and GaAsand a bandgap larger than a bandgap of said active layer, an opticalwaveguide layer of AlGaInPAs interposed between said active layer andeach of said cladding layers, said optical waveguide layer having abandgap larger than the bandgap of said active layer but smaller thanthe bandgap of said cladding layer, said optical waveguide layer havinga composition represented as (Al_(z)Ga_(1-z))_(γ)In_(1-γ)P_(u)As_(1-u)(0≦z<1, 0.5<γ<1, 0<u≦1), a to-be-oxidized layer provided in at least oneof said cladding layers such that said cladding layer contains saidto-be-oxidized layer in correspondence to a part thereof, or betweensaid active layer and one of said cladding layers, said to-be-oxidizedlayer having a composition represented asAl_(x)Ga_(y)In_(1-x-y)P_(t)As_(1-t) (0.8≦x≦1, 0≦y≦0.2, 0≦t≦1), a part ofsaid to-be-oxidized layer being selectively oxidized to form a selectiveoxidized region.
 10. A semiconductor light-emitting device, as claimedin claim 8, wherein said semiconductor substrate is formed of a materialof GaPAs, and wherein said to-be-oxidized layer has a compositionachieving a lattice matching with said semiconductor substrate.
 11. Asemiconductor light-emitting device as claimed in claim 10, wherein saidto-be-oxidized layer has a composition represented as AlP_(t)As_(1-t)(0≦t≦1), containing Al as the only group III element.
 12. Asemiconductor light-emitting device as claimed in claim 9, wherein saidto-be-oxidized layer has a superlattice structure in which an AlAs layerand a layer having a lattice constant between GaP and GaAs are stacked aplurality of times.
 13. A semiconductor light-emitting device as claimedin claim 12, wherein said layer having a lattice constant between GaPand GaAs is AlPAs.
 14. A semiconductor light-emitting device as claimedin claim 9, wherein said to-be-oxidized layer is formed with saidselective oxidation region with a width w2, with a not-oxidized regionformed with a width w1, wherein said not-oxidized region is formed suchthat a ratio of said width w1 to a sum of said width w1 and said widthw2 is less than 0.6.
 15. A semiconductor light-emitting device asclaimed in claim 9, wherein said semiconductor light-emitting deviceincludes a ridge structure formed in a part of said cladding layerlocated above said to-be-oxidized layer, said ridge structure having aridge width exceeding 10 μm.
 16. A semiconductor light-emitting deviceas claimed in claim 9, wherein said semiconductor light-emitting deviceincludes a ridge structure formed in a part of said cladding layerlocated above said to-be-oxidized layer, and wherein an etching stopperlayer having a composition Ga_(y)In_(1-y)P_(t)As_(1-t) (0<y≦1, 0≦t≦1) isprovided under said to-be-oxidized layer.